specification of 330 ohm resistor
Abstract: No abstract text available
Text: Metal Metal Glaze Glaze™Power PowerPack PackSurface SurfaceMount Mount High Power Power Density Density Ceramic Ceramic Package Package Welwyn Components PPS-1 Series PPS-1 Series 1 watt performance, standard 2010 footprint • 1Flat watt performance, standard 2010 footprint
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IEC62
500/reel
plc822181
specification of 330 ohm resistor
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Untitled
Abstract: No abstract text available
Text: Wave soldering footprint Footprint information for wave soldering of hermetically sealed glass surface-mounted package; 2 connectors SOD80C 6.30 4.90 2.70 1.90 2.90 1.70 solder land solder resist occupied area Dimensions in mm www.nxp.com 2010 NXP B.V.
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OD80C
sod080c
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of SO20 package SOT163-1 13.40 0.60 20x 1.50 8.00 11.00 11.40 1.27 (18×) solder land solder resist occupied area Dimensions in mm www.nxp.com 2010 NXP B.V. placement accuracy ± 0.25
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OT163-1
sot163-1
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Untitled
Abstract: No abstract text available
Text: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 5 leads SOT353 4.9 2.25 1.5 1 0.85 2.5 4.5 0.85 1 1.5 1.3 1.3 1.225 solder land solder resist occupied area Dimensions in mm www.nxp.com 2010 NXP B.V.
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OT353
sot353
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of XSON6 package SOT891 1.05 0.5 6x 1.4 0.6 (6×) 0.7 0.15 (6×) 0.25 (6×) 0.35 solder land plus solder paste solder resist occupied area www.nxp.com Dimensions in mm 2010 NXP B.V.
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OT891
sot891
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted package; 3 leads SOT416 2.2 1.7 1 0.85 2 0.5 3x 0.6 (3×) 1.3 solder land plus solder paste solder resist occupied area www.nxp.com Dimensions in mm 2010 NXP B.V.
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OT416
sot416
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Untitled
Abstract: No abstract text available
Text: Wave soldering footprint Footprint information for wave soldering of TSOP6 package SOT457 5.3 1.5 4x 1.475 0.45 (2×) 5.05 1.475 1.45 (6×) 2.85 solder land solder resist occupied area Dimensions in mm www.nxp.com 2010 NXP B.V. preferred transport direction during soldering
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OT457
sot457
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of LGA274 package SOP022-1 Hx A1 index area P P 0.8 1 0.7(2) 28.8 Hy The stencil thickness is 0.15 mm occupied area Dimensions in mm P Hx Hy 1.6 33.0 33.0 www.nxp.com 2010 NXP B.V. sop022-1_fr
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LGA274
OP022-1
sop022-1
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DFN4020-14
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of DFN4020-14 package SOT1334-1 D1 14x C (12x) Ay solder land occupied area DIMENSIONS in mm P1 P1 Ay C D1 0.50 2.30 1.07 0.30 www.nxp.com Dimensions in mm 2010 NXP B.V. 13-05-08 13-05-21
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DFN4020-14
OT1334-1
sot1334-1
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of DFN2520-9 package SOT1333-1 D1 9x C (8x) Ay solder land occupied area P1 DIMENSIONS in mm P1 Ay C D1 0.50 2.30 1.07 0.30 www.nxp.com Dimensions in mm 2010 NXP B.V. 13-05-08 13-05-21
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DFN2520-9
OT1333-1
sot1333-1
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resistor metal GLAZE 120 ohm 2 1W IRC
Abstract: IRC MAR MRC 058 datasheet 1R00 51R0 R250 EFB810-3/4-3/mrc 736
Text: HIGH POWER DENSITY METAL GLAZE SURFACE MOUNT POWER RESISTOR ISO-9001 Registered MRC SERIES Metal GlazeTM thick film element fired at 1000°C to solid ceramic substrate 1/2 watt in 1/8 watt package 1206 footprint 1 watt in 1/2 watt package (2010 footprint)
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ISO-9001
EIA-481:
resistor metal GLAZE 120 ohm 2 1W IRC
IRC MAR
MRC 058 datasheet
1R00
51R0
R250
EFB810-3/4-3/mrc 736
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XTL1024
Abstract: XTL-1024
Text: SM1612-4 4-Terminal Ceramic Surface-Mount Case 1.6 X 1.2 mm Nominal Footprint Electrical Connections Connection Terminals Input / Output 1 Metal Cover 2 Input / Output 3 No Connection 4 Dimensions in mm www.RFM.com E-mail: [email protected] 2009-2010 by RF Monolithics, Inc.
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SM1612-4
XTL1024
XTL-1024
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Solder Paste, Indium 5.8
Abstract: SOT996-2 VSSOP8 MICROPAK XX SOT103 WLCSP stencil design J-STD-020D SOT996 sot1049 XQFN10U
Text: AN10343 MicroPak soldering information Rev. 2 — 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array BGA , Wafer-Level Chip Scale Package (WLCSP) Abstract This application note describes evaluation of recommended solder land
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AN10343
Solder Paste, Indium 5.8
SOT996-2
VSSOP8
MICROPAK XX
SOT103
WLCSP stencil design
J-STD-020D
SOT996
sot1049
XQFN10U
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Untitled
Abstract: No abstract text available
Text: rev. page 1 of 11 date 09/2010 DESCRIPTION: point of load converter PART NUMBER: VPOL5A-5-SMT features * high efficiency topology, typically 94% at 3.3 Vdc * industry standard footprint * wide ambient temperature range, -40C to +85C * cost efficient open frame design
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UL/IEC/EN60950-1
E222736)
010in.
112th
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CSD25301W1015
Abstract: G003
Text: CSD25301W1015 www.ti.com SLPS210B – AUGUST 2009 – REVISED OCTOBER 2010 P-Channel NexFET Power MOSFET Check for Samples: CSD25301W1015 FEATURES 1 • • • • • • • PRODUCT SUMMARY Ultra Low Qg and Qgd Small Footprint Low Profile 0.62mm Height
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CSD25301W1015
SLPS210B
CSD25301W1015
G003
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Untitled
Abstract: No abstract text available
Text: CSD25301W1015 www.ti.com SLPS210B – AUGUST 2009 – REVISED OCTOBER 2010 P-Channel NexFET Power MOSFET Check for Samples: CSD25301W1015 FEATURES 1 • • • • • • • PRODUCT SUMMARY Ultra Low Qg and Qgd Small Footprint Low Profile 0.62mm Height
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CSD25301W1015
SLPS210B
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Untitled
Abstract: No abstract text available
Text: rev. page 1 of 11 date 09/2010 DESCRIPTION: point of load converter PART NUMBER: VPOL5A-5-SMT features * high efficiency topology, typically 94% at 3.3 Vdc * industry standard footprint * wide ambient temperature range, -40C to +85C * cost efficient open frame design
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UL/IEC/EN60950-1
E222736)
010in.
112th
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Untitled
Abstract: No abstract text available
Text: CSD25201W15 SLPS269A – JUNE 2010 – REVISED JULY 2011 www.ti.com P-Channel NexFET Power MOSFET Check for Samples: CSD25201W15 PRODUCT SUMMARY FEATURES 1 • • • • • • • Low Resistance Small Footprint 1.5-mm x 1.5-mm Gate ESD Protection –3kV
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CSD25201W15
SLPS269A
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Untitled
Abstract: No abstract text available
Text: CSD75205W1015 www.ti.com SLPS222B – OCTOBER 2009 – REVISED OCTOBER 2010 P-Channel NexFET Power MOSFET FEATURES 1 • • • • • • • • PRODUCT SUMMARY Dual P-Ch MOSFETs Common Source Configuration Small Footprint 1mm x 1.5mm Gate-Source Voltage Clamp
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CSD75205W1015
SLPS222B
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Untitled
Abstract: No abstract text available
Text: CSD75205W1015 www.ti.com SLPS222A – OCTOBER 2009 – REVISED OCTOBER 2010 P-Channel NexFET Power MOSFET FEATURES 1 • • • • • • • • PRODUCT SUMMARY Dual P-Ch MOSFETs Common Source Configuration Small Footprint 1mm x 1.5mm Gate-Source Voltage Clamp
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CSD75205W1015
SLPS222A
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CSD23201W10
Abstract: No abstract text available
Text: CSD23201W10 www.ti.com SLPS209A – AUGUST 2009 – REVISED MAY 2010 P-Channel NexFET Power MOSFET Check for Samples: CSD23201W10 FEATURES 1 • • • • • • • PRODUCT SUMMARY Ultra Low Qg and Qgd Small Footprint 1mm x 1mm Low Profile 0.62mm Height
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CSD23201W10
SLPS209A
CSD23201W10
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C1A3B3
Abstract: CSD25201W15
Text: CSD25201W15 SLPS269A – JUNE 2010 – REVISED JULY 2011 www.ti.com P-Channel NexFET Power MOSFET Check for Samples: CSD25201W15 PRODUCT SUMMARY FEATURES 1 • • • • • • • Low Resistance Small Footprint 1.5-mm x 1.5-mm Gate ESD Protection –3kV
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CSD25201W15
SLPS269A
C1A3B3
CSD25201W15
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Untitled
Abstract: No abstract text available
Text: METAL GLAZE HIGH POWER DENSITY SURFACE MOUNT POWER RESISTOR MRC ISO-9001 ^Registered, SERIES • • • • 1/2 watt in 1/8 watt package 1206 footprint 1 watt in 1/2 watt package (2010 footprint) MRC1/2: 0.1 ohm to 10,000 ohm MRC1: 0.05 ohm to 1.0 ohm
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OCR Scan
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ISO-9001
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Untitled
Abstract: No abstract text available
Text: METAL GLAZE POWER PACK SURFACE MOUNT HIGH POWER DENSITY CERAMIC PACKAGE PPS-1 ISO -9001 ^Registered, SERIES 1 Watt performance - standard 2010 footprint Flat ceramic package 0.1Q to 348KQ range Low inductance Superior surge handling capability 150°C maximum operating temperature
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OCR Scan
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348KQ
MIL-R-55342E
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