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    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of LGA274 package SOP022-1 Hx A1 index area P P 0.8 1 0.7(2) 28.8 Hy The stencil thickness is 0.15 mm occupied area Dimensions in mm P Hx Hy 1.6 33.0 33.0 www.nxp.com 2010 NXP B.V. sop022-1_fr


    Original     		PDF LGA274 OP022-1 sop022-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline LGA274: land grid array package; 274 lands SOP022-1 C pin A1 index 1.5 0.25 max (max) C 1.5 (max) 0.25 (max) detail X D e e1 A alignment hole for testing Ø 1.0 +0.1/-0.0 b B e2 e1 E cover e2 frame alignment hole for testing Ø 1.0 +0.1/-0.0


    Original     		PDF LGA274: OP022-1 sop022-1