Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    WLCSP39 Search Results

    WLCSP39 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    WLCSP39 NXP Semiconductors Wafer level chip-scale package; 39 balls Original PDF

    WLCSP39 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Package outline WLCSP39: wafer level chip-scale package; 39 balls; 2.66 x 3.765 x 0.38 mm B E NXH1501UK A ball A1 index area A A2 D A1 detail X e1 e3 e C C A B C Øv Øw b y e K J H G F E D C B A ball A1 index area e2 1 2 3 4 e4 X 3 mm scale Dimensions mm are the original dimensions


    Original     		PDF WLCSP39: NXH1501UK wlcsp39 nxh1501uk NXH150155