Untitled
Abstract: No abstract text available
Text: 7 8 THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 20 RELEASED FOR PUBLICATION 6 5 4 3 2 1 20 REVISIONS ALL RIGHTS RESERVED. - P LTR C 20.3 FINISH: 30µ" MIN GOLD IN CONTACT AREA. SELECTIVE TIN ON PCB TAILS, NICKEL OVERALL. 3 FINISH: 30µ" MIN GOLD IN CONTACT AREA. SELECTIVE TIN-LEAD
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ECO-14-000933
UL94V-0.
28JAN2014
SIGNAL855
13JAN2011
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AN 8054
Abstract: table pth lead TS-0254
Text: 3M 4-Wall, Tripolarized Header .050" x .100" Latch/Ejector, PTH & SMT Straight, PTH Right Angle 810 Series • Tripolarized for robust alignment when mating to 820 series socket • 50 mil × 100 mil halves the connector length vs. traditional 100 mil x 100 mil products
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RIA-2217B-E
AN 8054
table pth lead
TS-0254
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Untitled
Abstract: No abstract text available
Text: REVISION A DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] SSMB-J-P-XX-RA-THX GENDER -J: JACK DO NOT SCALE FROM THIS PRINT LEAD STYLE -1: .093" BOARD -2: .062" BOARD -3: .039" BOARD SEE TABLE 1 TYPE -P: PCB TERMINATION -TH: THROUGH HOLE 3.92 .154 REF ORIENTATION
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Untitled
Abstract: No abstract text available
Text: REVISION A Pb THIS PRODUCT MANUFACTURED WITH LEAD-FREE PROCESSING GRF7X-J-P-XX-ST-TH1 DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] SERIES GRF7: GRF 75 OHM GRF7V: GRF 75 OHM HIGH VIBRATION SEE TABLE 2 DO NOT SCALE FROM THIS PRINT TERMINATION -TH1: THROUGH HOLE
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Abstract: No abstract text available
Text: REVISION B Pb THIS PRODUCT MANUFACTURED WITH LEAD-FREE PROCESSING MMCX7-J-P-XX-RA-THX DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] DO NOT SCALE FROM THIS PRINT GENDER -J: JACK TERMINATION -TH: THROUGH HOLE TYPE -P: PCB C +0.09 1.51 - 0.11 ORIENTATION -RA: RIGHT ANGLE
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AN 8054
Abstract: standard profile header right angle posts single
Text: 3M 4-Wall, Tripolarized Header .050" x .100" Latch/Ejector, PTH & SMT Straight, PTH Right Angle 810 Series • Tripolarized for robust alignment when mating to 820 series socket • 50 mil × 100 mil halves the connector length vs. traditional 100 mil x 100 mil products
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TS-0253-HINCLUDING,
RIA-2217B-E
AN 8054
standard profile header right angle posts single
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AN 8054
Abstract: No abstract text available
Text: 3M 4-Wall, Tripolarized Header .050" x .100" Latch/Ejector, PTH & SMT Straight, PTH Right Angle 810 Series • Tripolarized for robust alignment when mating to 820 series socket • 50 mil × 100 mil halves the connector length vs. traditional 100 mil x 100 mil products
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RIA-2217B-E
AN 8054
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AN 8054
Abstract: TS-0253-J
Text: 3M 4-Wall, Tripolarized Header .050" x .100" Latch/Ejector, PTH & SMT Straight, PTH Right Angle 810 Series • Tripolarized for robust alignment when mating to 820 series socket • 50 mil × 100 mil halves the connector length vs. traditional 100 mil x 100 mil products
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RIA-2217B-E
AN 8054
TS-0253-J
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AN 8054
Abstract: No abstract text available
Text: 3M 4-Wall, Tripolarized Header .050″ x .100″ Latch/Ejector, PTH & SMT Straight, PTH Right Angle 810 Series • Tripolarization to mating socket • 50 mil × 100 mil halves the connector length • Latch and eject for rugged high performance applications
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TS-0253-30
RIA-2217-A
AN 8054
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Untitled
Abstract: No abstract text available
Text: 3M 4-Wall, Tripolarized Header .050″ x .100″ Latch/Ejector, PTH & SMT Straight, PTH Right Angle 810 Series • Tripolarization to mating socket • 50 mil × 100 mil halves the connector length • Latch and eject for rugged high performance applications
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TS-0253-29
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Untitled
Abstract: No abstract text available
Text: 3M 4-Wall, Tripolarized Header .050″ x .100″ Latch/Ejector, PTH & SMT Straight, PTH Right Angle 810 Series • Tripolarization to mating socket • 50 mil × 100 mil halves the connector length • Latch and eject for rugged high performance applications
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TS-0253-B
RIA-2217-A
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3505-28
Abstract: No abstract text available
Text: 3M 4-Wall, Tripolarized Header .050" x .100" Latch/Ejector, PTH & SMT Straight, PTH Right Angle 810 Series • Tripolarization to mating socket • 50 mil × 100 mil halves the connector length • Latch and eject for rugged high performance applications
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TS-0253-E
RIA-2217A-E
3505-28
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IT 7831
Abstract: JESD97 2609 al 3505-28B
Text: 3M 4-Wall, Tripolarized Header .050″ x .100″ Latch/Ejector, PTH & SMT Straight, PTH Right Angle 810 Series • Tripolarization to mating socket • 50 mil × 100 mil halves the connector length • Latch and eject for rugged high performance applications
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TS-0253-29
IT 7831
JESD97
2609 al
3505-28B
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AN 8054
Abstract: No abstract text available
Text: 3M 4-Wall, Tripolarized Header .050″ x .100″ Latch/Ejector, PTH & SMT Straight, PTH Right Angle 810 Series • Tripolarization to mating socket • 50 mil × 100 mil halves the connector length • Latch and eject for rugged high performance applications
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TS-0253-C
RIA-2217A-c
AN 8054
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Untitled
Abstract: No abstract text available
Text: REVISION A Pb THIS PRODUCT MANUFACTURED WITH LEAD-FREE PROCESSING MMCXV-J-P-XX-ST-TH1 DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] TERMINATION -TH1: THROUGH HOLE SERIES -V: HIGH VIBRATION 50 OHM DO NOT SCALE FROM THIS PRINT ORIENTATION -ST: STRAIGHT GENDER
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance
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AN1902
QFN 76 9x9 footprint
QFN 64 8x8 footprint
QFN PACKAGE thermal resistance
JEDEC JESD51-8 BGA
4914 smd
qfn 32 land pattern
QFN 64 9x9 footprint
QFN 9X9
AN1902
MO-220
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FOOTPRINT MO-229 2X3 SOLDERING
Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level
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AN1902
FOOTPRINT MO-229 2X3 SOLDERING
Theta-JC QFP die down
QFN 56 7x7 footprint
EIA-783
EIA and EIAJ standards 783
QFN 76 9x9 footprint
AN1902
QFN 56 7x7 0.5
JESD51-7
MO-220
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BD 4914
Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.
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AN1902/D
BD 4914
QFN 76 9x9 footprint
qfn 48 7x7 stencil
QFN 64 8x8 footprint
QFN 64 9x9 footprint
land pattern BGA 0.75 freescale
QFN 56 7x7 footprint
QFN PCB Layout guide
Motorola MAP QFN
MO-220 8x8
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Untitled
Abstract: No abstract text available
Text: 8 PEFORMANCE-BASED PLATING SEE NOTE 2 LETTER TARGET LEAD-FREE DESIGNATION O NL Y WITH A P P L I C A B L E PL A TIN G CODES 4-COLUMN DIFFERENTIAL S IGNAL LETTER DESIGNATION REPRESENTED DASH CO NO C TELCORDIA UE NO D TELCORDIA CO YES E TELCORDIA UE YES LEFT
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Untitled
Abstract: No abstract text available
Text: 8 PERFORMANCE-BASED PLATING SEE NOTE 2 LETTER TARGET LEAD-FREE DESIGNATION O N L Y WI TH A P P L I C A B L E PL ATI NG CODES 8-COLUMN DIFFERENTIAL S IGNAL APPLICATION LEAD-FREE B TELCORDIA CO NO C TELCORDIA UE NO D TELCORDIA CO YES E TELCORDIA UE YES CONTACT
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Untitled
Abstract: No abstract text available
Text: 8 PEFORMANCE-BASED PLATING SEE NOTE 2 LETTER TARGET LEAD-FREE DESIGNATION O NL Y WITH A P P L I C A B L E PL A TIN G CODES 6-COLUMN DIFFERENTIAL S IGNAL APPLICATION LEAD B TELCORDIA CO NO C TELCORDIA UE NO D TELCORDIA CO YES E TELCORDIA UE YES CONTACT MATING
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Untitled
Abstract: No abstract text available
Text: DRW NO. ± C-367-5G00-000 ZONE REV SCR NUMBER ALL A CSAS-9E4MBM.VER01 BACKPLANE RIGHT POLARIZED ASSEMBLY PART NUMBER ASSIGNMENT 367 - X X 0 X SH DESCRIPTION BY NEW RELEASE HCL-AK REV A 1 DATE 12/06/2013 APPROVED D. SMITH X X X L LOAD 5 STANDARD LOADED, LEADFREE
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C-367-5G00-000
VER01
SI-P11U-DC-BP-RTP0L-EW
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Untitled
Abstract: No abstract text available
Text: 13 10 12 M ATERIAL NUMBER tt OF COLUMNS n OF DIFF PAIR DIM ’’A" MAX DIM “B“ 7 6060- *0 10 50 26.60 17.10 76060 PTH 0 7 6060- *2 12 60 30.40 20.90 0.46 7 6060- *4 14 70 34.20 24.70 ±0.05 7 6060- *6 16 80 38.00 28.50 7 6060- *0 10 50 26.60
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7606Q-*
SD-76060-002
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C-439-3200-500
Abstract: No abstract text available
Text: 3 X DRW NO. ▼ ZONE TABLE 1 GbX S T A N D A R D REVISION OF ALL PART NUMBERS IS BACKPLANE POW ER CONNECTOR GbX POW ER MODULE LEAD OFF • JT SEE D E T A I L 3 = 8 = 1P O SITIO N 2 = 2 P O SITIO N 5 = 7 = 3 P O SITIO N B P . 5 0 u ' GOLD. 1 P O SITIO N B P .
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CSAS-76SP5U
VER01
VER01
C-439-3200-500
C-439-3200-500
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