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    sot729

    Abstract: No abstract text available
    Text: PDF: 2001 Nov 15 Philips Semiconductors Package outline HLLGA24: plastic thermal enhanced low profile land grid array package; 24 lands; body 8 x 10.7 x 1.4 mm A B D SOT729-1 land A1 index area A2 A A1 E detail X e1 v M C A B w M C b C 1/2 e H y y1 C v M C A B


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    HLLGA24: OT729-1 sot729 PDF