SOT631 Search Results

SOT631 Datasheets (4)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
SOT631-1		NXP Semiconductors	Footprint for reflow soldering SOT631-1		Original	PDF
SOT631-2		NXP Semiconductors	Footprint for reflow soldering SOT631-2		Original	PDF
SOT631-3		NXP Semiconductors	LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.05 mm		Original	PDF
SOT631-4		NXP Semiconductors	Plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1 mm		Original	PDF

SOT631 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA208 package SOT631-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	PDF	LFBGA208 OT631-2 OT631-2
Untitled Abstract: No abstract text available Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA208 package SOT631-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	PDF	LFBGA208 OT631-1 OT631-1
Untitled Abstract: No abstract text available Text: Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.05 mm SOT631-3 B D A ball A1 index area A A2 A1 E detail X C e1 y1 C ∅v M C A B b e y ∅w M C U T R P e N M L K e2 J H G F E D C B A ball A1 index area	Original	PDF	LFBGA208: OT631-3 MO-205
MO-205 Abstract: sot631 Text: PDF: 2002 Aug 14 Philips Semiconductors Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.05 mm SOT631-2 A B D ball A1 index area A A2 A1 E detail X C e1 ∅v M C A B ∅w M C b e y1 C y U T R P e	Original	PDF	LFBGA208: OT631-2 MO-205 MO-205 sot631
Untitled Abstract: No abstract text available Text: Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1 mm B D SOT631-4 A ball A1 index area E A A2 A1 detail X e1 ∅v ∅w b e M M C C A B C y y1 C U T R P N M e L K e2 J H G F E D C B A ball A1 index area	Original	PDF	LFBGA208: OT631-4 MO-205
MO-205 Abstract: sot631 Text: PDF: 2003 Oct 20 Philips Semiconductors Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.05 mm SOT631-3 B D A ball A1 index area A A2 A1 E detail X C e1 y1 C ∅v M C A B b e y ∅w M C U T R P e	Original	PDF	LFBGA208: OT631-3 MO-205 MO-205 sot631
MO-205 Abstract: LFBGA208 Text: PDF: 2002 Aug 19 Philips Semiconductors Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.25 mm SOT631-1 A B D ball A1 index area A A2 A1 E detail X C e1 ∅v M C A B b e y y1 C ∅w M C U T R P e	Original	PDF	LFBGA208: OT631-1 MO-205 MO-205 LFBGA208
MO-205 Abstract: sot631 Text: PDF: 2001 Oct 29 Philips Semiconductors Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.25 mm SOT631-1 A B D ball A1 index area A A2 A1 E detail X C e1 ∅v M C A B b e y y1 C ∅w M C U T R P e	Original	PDF	LFBGA208: OT631-1 MO-205 MO-205 sot631
PHY Interface for the PCI Express Abstract: PX1041A MO-205 sot631 PX1041A-EL1 Text: PX1041A PCI Express stand-alone X4 PHY Rev. 01 — 21 June 2007 Objective data sheet 1. General description The PX1041A is a high-performance, low-power, four-lane PCI Express electrical PHYsical layer PHY that handles the low level PCI Express protocol and signaling. The	Original	PDF	PX1041A PX1041A 8b/10b PHY Interface for the PCI Express MO-205 sot631 PX1041A-EL1
b0951 Abstract: 2SC647 BLX19 BLX16 25G60 2n5979 2N4310 ST+T8+1060 Text: POWER SILICON NPN Item Number Part Number I C 5 10 15 20 25 30 35 40 45 • 50 60 65 70 75 · · 80 ·85 90 · 95 912 Ie Max (A) V(BA)CEO (V) fT hFE Min Max (Hz) leBO Max (A) t, Max tf Max PD Max TOper Max (a) (a) (W) (OC) Package Style >= 5 A, (Co nt' d)	Original	PDF
2SC3303 to-251 Abstract: 2S0586 2SC3303 2N4306 bo 913 bur10 SML1634 Text: POWER SILICON NPN Item Part Number Number I C 5 -10 15 -20 25 30 35 40 45 -50 ~ BUR10 BUR10 BUR10 SVTSO-5 SVTSO-5 SVTBO-5 2N2SS0 2N4113 2N4115 2N4306 2N4309 2SC520 2N1725 2N3S50 SOT5636 SOT63S3 2N2S93 2N5326 "~""";JIOI'\L. 55 - -60 2SC3367 2S0961 2N5337	Original	PDF	O-l11 O-220AB O-220 O-220var O-251 2SC3303 to-251 2S0586 2SC3303 2N4306 bo 913 bur10 SML1634
bck01 Abstract: LCD N96 bck-01 Infineon ITS 7166 SAA7750EL lcd module n96 sony g14 q2 audio ic sony DVD player with usb port circuit diagram sandisk micros card repair lcd monitor samsung Text: INTEGRATED CIRCUITS DATA SHEET Generic device for portable multimedia applications SAA7750-N1D Preliminary Specification version 1.3 File under Integrated Circuits, <Handbook> 2002 Jan 21 Philips Semiconductors Preliminary Specification version 1.3 Generic device for portable	Original	PDF	SAA7750-N1D bck01 LCD N96 bck-01 Infineon ITS 7166 SAA7750EL lcd module n96 sony g14 q2 audio ic sony DVD player with usb port circuit diagram sandisk micros card repair lcd monitor samsung