BGA-292
Abstract: BGA292 C BGA292 MS-034
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W V U T R P N M L K
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BGA292:
OT489-1
MS-034
BGA-292
BGA292
C BGA292
MS-034
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MO-151
Abstract: BGA292 transistor t 04 27 C BGA292
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K
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BGA292:
OT489-1
MO-151
MO-151
BGA292
transistor t 04 27
C BGA292
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BGA292
Abstract: sot489 C BGA292
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 D D1 ball A1 corner A2 A A1 E1 E detail X k k A ZD b e ∅w M y v A ZE Y W V U T R P e N M L K J H G F E D C B A 2 1
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BGA292:
OT489-1
BGA292
sot489
C BGA292
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BGA292
Abstract: BGA-292
Text: Philips Semiconductors Package outlines BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm 1998 May 06 1 SOT489-1
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BGA292:
OT489-1
BGA292
BGA-292
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Untitled
Abstract: No abstract text available
Text: Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 b 1/2 e e ∅v M C A B y y1 C ∅w M C Y W V U T R P N M L K J H G F E D C B A e e2 1/2 e shape optional 4x
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BGA292:
OT489-1
MS-034
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Untitled
Abstract: No abstract text available
Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10
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MBL179
BGA156
OT472-1
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA316
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SMD Transistor Y02
Abstract: SAA7113 Application notes SMD Transistor Y13 SAA7113A p87c695 sMD .v05 smd V05 BGA292 SAA6721E SAA7113
Text: INTEGRATED CIRCUITS DATA SHEET SAA6721E SXGA RGB to TFT graphics engine Preliminary specification File under Integrated Circuits, IC02 1999 May 11 Philips Semiconductors Preliminary specification SXGA RGB to TFT graphics engine SAA6721E CONTENTS 8.4 1 FEATURES
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SAA6721E
545004/750/01/pp72
SMD Transistor Y02
SAA7113 Application notes
SMD Transistor Y13
SAA7113A
p87c695
sMD .v05
smd V05
BGA292
SAA6721E
SAA7113
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SOT411
Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which
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PBG1 smd
Abstract: P87C695
Text: INTEGRATED CIRCUITS DATA SHEET SAA6712E XGA RGB to TFT graphics engine Preliminary specification File under Integrated Circuits, IC02 1999 Aug 25 Philips Semiconductors Preliminary specification XGA RGB to TFT graphics engine SAA6712E CONTENTS 8.4 1 FEATURES
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SAA6712E
SAA6721E
SAA6721E.
25-Aug-99
PBG1 smd
P87C695
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P87C695
Abstract: VPC3 C upscaler pab7 SMD Transistor Y02
Text: INTEGRATED CIRCUITS DATA SHEET SAA6721E SXGA RGB to TFT graphics engine Preliminary specification File under Integrated Circuits, IC02 1999 May 11 Philips Semiconductors Preliminary specification SXGA RGB to TFT graphics engine SAA6721E CONTENTS 8.4 1 FEATURES
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SAA6721E
11-May-99
P87C695
VPC3 C
upscaler
pab7
SMD Transistor Y02
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handbook philips ic26 packaging
Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
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AN01026
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA304
OT550-1
BGA316
handbook philips ic26 packaging
AN01026
BGA304
land pattern BGA 0.75
BGA OUTLINE DRAWING
BGA and QFP Package
LFBGA80
LR-735
stencil tension
land pattern BGA 0,50
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JEDEC TRAY DIMENSIONS
Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors
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manuf86
TQFP80
OT357
TQFP64
OT543
TFBGA64
JEDEC TRAY DIMENSIONS
HSSOP20
ic packages
TRAY TSSOP20 14 X 35
SO16 package trays
BGA304
HLQFP100
MSD504
LQFP64 reel size
PLCC84 package
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SMD TRANSISTOR Y2
Abstract: vpc3 b SMD TRANSISTOR w18 BGA292 p87c695 SAA6721E SAA6712E smd transistor G18 RW203 MHB250
Text: INTEGRATED CIRCUITS DATA SHEET SAA6712E XGA RGB to TFT graphics engine Preliminary specification File under Integrated Circuits, IC02 1999 Aug 25 Philips Semiconductors Preliminary specification XGA RGB to TFT graphics engine SAA6712E CONTENTS 8.4 1 FEATURES
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SAA6712E
545004/01/pp64
SMD TRANSISTOR Y2
vpc3 b
SMD TRANSISTOR w18
BGA292
p87c695
SAA6721E
SAA6712E
smd transistor G18
RW203
MHB250
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12x16 font
Abstract: transistor SMD .v05
Text: INTEGRATED CIRCUITS o y e W M M Vm W M : SAA6721E SXGA RGB to TFT graphics engine Preliminary specification File under Integrated Circuits, IC02 Philips Semiconductors 1999 May 11 PHILIPS PHILIPS Philips Semiconductors Preliminary specification SXGA RGB to TFT graphics engine
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OCR Scan
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SAA6721E
545004/750/01/pp72
12x16 font
transistor SMD .v05
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