BGA256
Abstract: sot466 BGA256 17 X 17
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 D D1 ball A1 index A2 A A1 E1 E detail X k k A ZD b e ∅w M y v A ZE Y W V U T R P e N M L K J H G F E D C B A 2 1
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BGA256:
OT466-1
BGA256
sot466
BGA256 17 X 17
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BGA256
Abstract: BGA256 17 X 17
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K
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Original
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BGA256:
OT466-1
BGA256
BGA256 17 X 17
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PDF
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BGA256
Abstract: MS-034 BGA256 17 X 17 BGA-256 BGA256 17
Text: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W e V U T R P N M L
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Original
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BGA256:
OT466-1
MS-034
ED-7311-9A
BGA256
MS-034
BGA256 17 X 17
BGA-256
BGA256 17
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Untitled
Abstract: No abstract text available
Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10
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MBL179
BGA156
OT472-1
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA316
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Philips tea1090
Abstract: tea1090 tea1402 pcf2705p philips TEA1090T SAA7321GP TDA2579A LMT 393 N TDA3653bq TEA5713
Text: PHILIPS SEMICONDUCTORS PRODUCT DISCONTINUATION NOTICE NUMBER DN-41 DATED JUNE 30, 1999 EXHIBIT 'A' PHILIPS PHILIPS PHILIPS PART NUMBER PKG PART DESCRIPTION PHILIPS LAST TIME LAST TIME REPLACEMENT STATUS 12 NC NUMBER BUY DATE DLVY DATE PART CODES COMMENTS
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DN-41
LO9585/WD
LO9585
LO9700
OQ8845T/K3
OQ8868HP/K6
QFP47)
X2G-BUK5R3-100B
Philips tea1090
tea1090
tea1402
pcf2705p
philips TEA1090T
SAA7321GP
TDA2579A
LMT 393 N
TDA3653bq
TEA5713
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handbook philips ic26 packaging
Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
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AN01026
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA304
OT550-1
BGA316
handbook philips ic26 packaging
AN01026
BGA304
land pattern BGA 0.75
BGA OUTLINE DRAWING
BGA and QFP Package
LFBGA80
LR-735
stencil tension
land pattern BGA 0,50
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PDF
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JEDEC TRAY DIMENSIONS
Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors
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manuf86
TQFP80
OT357
TQFP64
OT543
TFBGA64
JEDEC TRAY DIMENSIONS
HSSOP20
ic packages
TRAY TSSOP20 14 X 35
SO16 package trays
BGA304
HLQFP100
MSD504
LQFP64 reel size
PLCC84 package
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PDF
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