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    SL2ICS5001 Search Results

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    SL2ICS5001 Price and Stock

    NXP Semiconductors SL2ICS5001EW-V7,00

    IC I-CODE SLI SMART LABEL DIE
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    DigiKey SL2ICS5001EW-V7,00 Bulk
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    NXP Semiconductors SL2ICS5001EW/V7,00

    SL2ICS5001EW/UNCASED/FOIL//V7 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SL2ICS5001EW/V7,00)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SL2ICS5001EW/V7,00 Waffle Pack 776,775
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    SL2ICS5001 Datasheets (3)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SL2ICS5001EW/V1 NXP Semiconductors SL2 ICS50/SL2 ICS51 ICODE SLI-L/ I CODE SLI-L/HC Original PDF
    SL2ICS5001EW/V7 NXP Semiconductors SL2 ICS50 Wafer addendum Original PDF
    SL2ICS5001EW/V7,00 NXP Semiconductors SL2ICS5001EW/V7 - SL2 ICS50/SL2 ICS51 ICODE SLI-L/ I CODE SLI-L/HC, NAU000 Package, No Marking, Chips On Wafer, Pre-Sawn, On FFC Original PDF

    SL2ICS5001 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: SL2MOS5001 Contactless chip card module specification Rev. 3.0 — 21 January 2010 Product data sheet addendum 187130 PUBLIC 1. General description This document gives specifications for the product SL2MOS5001. • The SL2MOS5001 is the integrated circuit SL2ICS5001 in the package SOT500AA1.


    Original     		SL2MOS5001 SL2MOS5001. SL2MOS5001 SL2ICS5001 OT500AA1. SL2ICS50/SL2ICS51â PDF