ASTM-D-2393
Abstract: amicon "good adhesive bonding starts" ASTM-D-257 amicon silver Cuming Amicon die attach adhesive Amicon D 125 ASTM-D-792 ASTMD257
Text: Technical Data Sheet AMICON C 850-6 Internet Address: www.emersoncuming.com Key Feature: • One component • Silver filled • Low viscosity Silver Filled, Epoxy Die Attach Adhesive Benefit: • Ease of use • Yields excellent electrical and thermal conductivities
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B-2260
1755-C-850-6/09-00
ASTM-D-2393
amicon
"good adhesive bonding starts"
ASTM-D-257
amicon silver
Cuming
Amicon die attach adhesive
Amicon D 125
ASTM-D-792
ASTMD257
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Untitled
Abstract: No abstract text available
Text: Technical Data Sheet Product 3888 July 2003 PRODUCT DESCRIPTION LOCTITE 3888 Silver Filled Conductive Adhesive provides the following product characteristics: Technology Epoxy Chemical Type Epoxy Appearance Resin Silver pasteLMS Appearance (Hardener) Clear to amber liquidLMS
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IEC 68-2-27
Abstract: IEC 68-2-3 5A 125VAC 5A125VAC
Text: SPECIFICATIONS • CONSTRUCTION Washable miniature toggle switch for PC board. One pole. Designed for wave soldering. • MATERIALS Case and cover Contacts Actuator Terminal Seal : : : : UL94-V0 polyamide, glass filled orPES Silver Brass, nickel plated Epoxy
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UL94-V0
250VAC
125VAC
30VDC
10-500Hz/10g
50STRUCTION
IEC 68-2-27
IEC 68-2-3
5A 125VAC
5A125VAC
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glass filled polyester physical properties
Abstract: screen emulsion PK100 Loctite LOCTITE PASTE
Text: Research, Development & Engineering Technical Data Sheet Product 3880 Tallaght Business Park, Dublin, Ireland Worldwide Version, October 1998 PRODUCT DESCRIPTION LOCTITE Product 3880 is a silver filled, one-component, epoxy adhesive that can be cured by heat. It combines high
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TQFP 14X14
Abstract: No abstract text available
Text: Thermal Data TQFP 14x14 44, 80,100 leads 44 to 100 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 3.9 W/cm°C die attach epoxy glue silver filled 10-40 µm 0.01 W/cm°C molding compound epoxy resin
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14x14
063W/cm
14x14
TQFP 14X14
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cho-bond 1086
Abstract: cho-bond 1075 Cho-Bond 584-29 cho-bond 1029 584-29 cho-bond primer 1086 RTV silicone viscosity 51-00-1035-0000 50-02-1075-0000 CHO-SEAL 1285
Text: CONDUCTIVE COMPOUNDS CHO-BOND Conductive Adhesives Single- and two-component epoxy and silicone adhesives, with room temperature, elevated temperature or moisture cure mechanisms. Epoxies for Microelectronics Chomerics’ growing family of conductive epoxies now includes one-part, silver-filled pastes formulated for today’s
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MIL-I-45208.
cho-bond 1086
cho-bond 1075
Cho-Bond 584-29
cho-bond 1029
584-29
cho-bond primer 1086
RTV silicone viscosity
51-00-1035-0000
50-02-1075-0000
CHO-SEAL 1285
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TQFP 64 PACKAGE rth
Abstract: 10X10
Text: Thermal Data TQFP 10x10 44,64 leads 64 leads 44 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach epoxy glue silver filled
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10x10
063W/cm
10x10
TQFP 64 PACKAGE rth
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TQFP 14X14
Abstract: 14x14
Text: Thermal Data TQFP 14x14 80,100 leads 80 to 100 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.15 mm 3.9 W/cm°C die attach epoxy glue silver filled 10-40 µm 0.01 W/cm°C molding compound epoxy resin 1.4 mm
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14x14
063W/cm
TQFP 14X14
14x14
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tqfp 7x7
Abstract: No abstract text available
Text: Thermal Data TQFP 7x7 32 leads 32 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 3.9 W/cm°C die attach epoxy glue silver filled 10-40 µm 0.01 W/cm°C molding compound epoxy resin 1.4 mm 0.0063W/cm°C
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063W/cm
tqfp 7x7
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Untitled
Abstract: No abstract text available
Text: Thermal Data DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filled 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C
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063W/cm
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12THERMAL
Abstract: No abstract text available
Text: Thermal Data DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filled 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C
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063W/cm
12THERMAL
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heat sink
Abstract: No abstract text available
Text: Thermal Data POWER DIP 24 20+2+2 leads 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach epoxy glue silver filled 15-50 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C
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063W/cm
152x160
120x130
heat sink
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gold cap a57
Abstract: 8261
Text: C&K 8060 Series Alternate Action and Momentary Pushbutton Switches Features/Benefits • Long travel • Available with LED • Long life contact design • Epoxy terminial seal Pushbutton A Typical Applications • Instrumentation • Computers and peripherals
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RS-186E
Abstract: marking code Z3 marking CODE A3 8261SHZQE
Text: 8060 Series Alternate Action and Momentary Pushbutton Switches Features/Benefits • Long travel • Available with LED • Long life contact design • Epoxy terminial seal Pushbutton A Typical Applications • Instrumentation • Computers and peripherals
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RS-186E
Abstract: momentary SWITCH with cap PCB mount
Text: 8060 Series Alternate Action and Momentary Pushbutton Switches Features/Benefits • Long travel • Available with LED • Long life contact design • Epoxy terminial seal Pushbutton A Typical Applications • Instrumentation • Computers and peripherals
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RS-186E
Abstract: No abstract text available
Text: 8060 Series Alternate Action and Momentary Pushbutton Switches Features/Benefits • Long travel • Available with LED • Long life contact design • Epoxy terminial seal Pushbutton A Typical Applications • Instrumentation • Computers and peripherals
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Q 8060 p-5
Abstract: No abstract text available
Text: 8060 Series Alternate Action and Momentary Pushbutton Switches Features/Benefits • Long travel • Available with LED • Long life contact design • Epoxy terminial seal Pushbutton A Typical Applications • Instrumentation • Computers and peripherals
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Untitled
Abstract: No abstract text available
Text: 8060 Series Alternate Action and Momentary Pushbutton Switches Features/Benefits • Long travel • Available with LED • Long life contact design • Epoxy terminial seal Pushbutton A Typical Applications • Instrumentation • Computers and peripherals
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Untitled
Abstract: No abstract text available
Text: 8060 Series Alternate Action and Momentary Pushbutton Switches Features/Benefits • Long travel • Available with LED • Long life contact design • Epoxy terminal seal Pushbutton A Typical Applications • Instrumentation • Computers and peripherals
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U840 diode
Abstract: SP45Y0 SP35W0 U2400 SP35S0 U2900 U2510 .122 marking
Text: SP series Washable snap-action pushbutton switches Distinctive features and specifications ❑ Sealed • Secure assembly of the two case parts • Internally sealed bushing • Epoxy sealed terminals ❑ Process compatible plain bushing models • Wave solderable
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100mA
30VDC
120VAC
U2400
U2340
35-40UNS
1/4-40UNS)
U840 diode
SP45Y0
SP35W0
U2400
SP35S0
U2900
U2510
.122 marking
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SP35WW
Abstract: SP45Y0 SP35W0 SP35P0 U2900
Text: SP series Washable snap-action pushbutton switches Distinctive features and specifications UG1006-A ❑ Process sealed • Secure assembly of the two case parts • Internally sealed bushing • Epoxy sealed terminals ❑ Process compatible plain bushing models
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UG1006-A
100mA
30VDC
120VAC
30VDC
UL94-V0,
U2340
35-40UNS
1/4-40UNS)
SP35WW
SP45Y0
SP35W0
SP35P0
U2900
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MCD 8940
Abstract: RS-186E 8168
Text: 8060 Series Alternate Action and Momentary Pushbutton Switches Features/Benefits • Long travel • Available with LED • Long life contact design • Epoxy terminial seal Pushbutton A Typical Applications • Instrumentation • Computers and peripherals
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RS-186E
Abstract: panels
Text: 8060 Series Alternate Action and Momentary Pushbutton Switches Features/Benefits • Long travel • Available with LED • Long life contact design • Epoxy terminial seal Pushbutton A Typical Applications • Instrumentation • Computers and peripherals
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marking code 1AW
Abstract: tme57 E221SD1CGE h032
Text: Sealed* Snap-Acting Momentary Pushbutton Switches E020 Series •process sealed-withstands soldering and cleaning processes. SWITCHES WITH STANDARD OPTIONS C8K MARKING ON THIS SIDE EPOXY SEAL .030 TYP. 76 3 NC 2 NO “ 1 .1 8 5 TYP. T 4 , ?0) COMM. -^ .2 6 0 k (6,6 0)
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OCR Scan
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E121SD1CGE
E221SD1CGE
marking code 1AW
tme57
E221SD1CGE
h032
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