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    S57C128F Search Results

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    S57C128F Price and Stock

    Teledyne e2v WS57C128FB-70CMB

    PROM, UV ERASABLE, 16K X 8, 70 NS ACCESS - Rail/Tube (Alt: WS57C128FB-70CMB)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas WS57C128FB-70CMB Tube 250
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    S57C128F Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: S57C128FB HIGH SPEED 16K x 8 CMOS EPROM K E Y FEA TU R E S • Fast Access Time • EPI Processing — 35 ns — Latch up Im m unity Up to 200 mA • Low Power Consumption • DESC SMD No. 5962-87661 • Standard EPROM Pinout • DIP and Surface Mount Packaging


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    WS57C128FB PDF

    Untitled

    Abstract: No abstract text available
    Text: S57C128FB HIGH SPEED 16Kx 8 CMOS EPROM KEY FEATURES • Standard EPROM Pinout • Very Fast Access Time — 35 ns • DIP and Surface Mount Packaging Available • Low Power Consumption • EPI Processing — Lalch-up Immunity Up to 200 mA GENERAL DESCRIPTION


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    WS57C128FB MIL-STD-883C MIL-STD-883C WS57C128FB-35D S57C128FB-45D WS57C128FB-45DMB PDF

    Untitled

    Abstract: No abstract text available
    Text: bSE T > m ^53^0 0002535 soa h u a f S57C128F WAFER SCALE INTEGRATION HIGH SPEED 16Kx 8 CM OS EPROM FO R M A IN T E N A N C E P U R P O S E S ONLY! N O T TO B E USED FO R N E W D ESIG N S. S E E W S57C 128FB FO R N E W VERSIO N! KEY FEATURES • Fast Access Time


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    WS57C128F 128FB S57C128F MIL-STD-883C S57C128F-70CM S57C128F-70D WS57C128F-70DI S57C128F-70DM S57C128F-70DM PDF

    Untitled

    Abstract: No abstract text available
    Text: S57C128FB HIGH SPEED 16Kx 8 CMOS EPROM KEY FEATURES • Very Fast Access Time • Standard EPROM Pinout — 35 ns DIP and Surface Mount Packaging Available • Low Power Consumption • EPI Processing — Latch-up Immunity Up to 200 mA GENERAL DESCRIPTION


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    WS57C128FB S57C128FB MIL-STD-883C MIL-STD-883C WS57C128FB-35D S57C128FB-45D S57C128FB-45DMB PDF

    Untitled

    Abstract: No abstract text available
    Text: S57C128F HIGH SPEED 16Kx 8 CMOS EPROM FOR M A IN TE N A N C E PU R PO SES ONLY! N O T TO B E USED FOR N EW DESIGNS. SEE W S57C 128FB FOR N EW VERSION! KEY FEATURES • Fast Access Time • EPI Processing — 55 ns — Latch-up Immunity Up to 200 mA • Low Power Consumption


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    WS57C128F 128FB MIL-STD-883C MIL-STD-883C S57C128FB WS57C128F PDF

    Untitled

    Abstract: No abstract text available
    Text: WAFER SCALE IN TEGRATION 3TE D EB ^ 5 3 ^ 0 ODOQS'IS 4 E l tilAF _ S57C128F ""p - W AFERSCALE IN TE G R A T IO N , IN C. ~2_°l L\ HIGH SPEED 16K x 8 CM OS EPROM KEY FEATURES • Fast A c c e ss Time — • EPI P ro cessin g


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    WS57C128F T-46-13-29 128F-70D PDF

    5.6V TVS

    Abstract: No abstract text available
    Text: SME ì> • QÜ01E72 5TÖ «lilAF S57C128F WAFER SCALE INTEGRATION ffc>•“ / 5 — I HIGH SPEED 16K x £ CMOS EPflOM • KEY FEATURES • EPI Processing Fast Access Time — 55 ns — Latch-up Im munity Up to 200 mA • Low Power Consumption • DESC SMD No. 5962-87661


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    01E72 WS57C128F S57C128F WS57C128F-55D S57C128F-70CMB S57C128F-70D WS57C128F-70DI S57C128F-70DM 5.6V TVS PDF

    57C128FB-70

    Abstract: No abstract text available
    Text: S57C128FB HIGH SPEED 16Kx 8 CMOS EPROM KEY FEATURES • EPI Processing • Fast Access Time — 35 ns — Latch-up Immunity Up to 200 mA • Low Power Consumption • DESC SMD No. 5962-87661 • Standard EPROM Pinout * DIP and Surface Mount Packaging Available


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    WS57C128FB MIL-STD-883C MIL-STD-883C WS57C128FB-35D S57C128FB-45D WS57C128FB-45DMB 57C128FB-70 PDF

    A12C

    Abstract: WS27C128F WS27C128F-90 WS27C128F-90DM WS57C128FB
    Text: W S27C 128F M ILITA R Y 16K x 8 C M O S EPRO M FO R M A IN TE N A N C E PU R PO SES ONLY! N O T TO B E USED FOR N E W DESIGNS. S E E W S57C 128FB FO R N E W D ESIG N S! K E Y FEA TU R ES • Fast Access Time • EPI Processing — 90 ns Over Full Mil Temp Range


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    WS27C128F WS57C128FB WS27C128F WS27C128F-90DM MIL-STD-883C A12C WS27C128F-90 PDF