CAD-0601-262
Abstract: amphenol sim block
Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under
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UL94V0,
CAD0601262
CAD-0601-262
amphenol sim block
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Untitled
Abstract: No abstract text available
Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Stainless steel Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,gold flash at solder tail and 1.27-2.54 micronnickel under plated.
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UL94V0,
CAD06WM242
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amphenol sim block
Abstract: No abstract text available
Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under
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UL94V0,
CAD0601242
amphenol sim block
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amphenol sim block
Abstract: SIM BLOCK
Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under
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UL94V0,
CAD0601282
amphenol sim block
SIM BLOCK
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sim block
Abstract: amphenol sim block
Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under
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UL94V0,
CAD0601222
sim block
amphenol sim block
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Untitled
Abstract: No abstract text available
Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Copper Alloy Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,gold flash at solder tail and 1.27-2.54 micronnickel under plated.
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UL94V0,
CAD06WS322
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Untitled
Abstract: No abstract text available
Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Copper Alloy Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,gold flash at solder tail and 1.27-2.54 micronnickel under plated.
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UL94V0,
CAD06WM312
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CAD-0601-302
Abstract: CAD0601302 amphenol sim block
Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under
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UL94V0,
CAD0601302
CAD-0601-302
amphenol sim block
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amphenol sim block
Abstract: No abstract text available
Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under
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UL94V0,
CAD0601402
amphenol sim block
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amphenol sim block
Abstract: SIM BLOCK
Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under
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PDF
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UL94V0,
CAD0601382
amphenol sim block
SIM BLOCK
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amphenol sim block
Abstract: SIM BLOCK
Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under
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PDF
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UL94V0,
CAD0601342
amphenol sim block
SIM BLOCK
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amphenol sim block
Abstract: sim block
Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under
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UL94V0,
CAD0601322
amphenol sim block
sim block
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SIM BLOCK amphenol
Abstract: amphenol sim block SIM BLOCK
Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under
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UL94V0,
CAD0601362
SIM BLOCK amphenol
amphenol sim block
SIM BLOCK
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Untitled
Abstract: No abstract text available
Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Stainless steel Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,1.27-2.54 micron matte tin at solder tail, 1.27-2.54 micronnickel under plated.
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UL94V0,
CAD06W7262
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CAD06W1292
Abstract: No abstract text available
Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Stainless steel Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,1.27-2.54 micron matte tin at solder tail, 1.27-2.54 micronnickel under plated.
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UL94V0,
CAD06W1292
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Untitled
Abstract: No abstract text available
Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Stainless steel Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,1.27-2.54 micron matte tin at solder tail, 1.27-2.54 micronnickel under plated.
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UL94V0,
CAD06L1272
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CAD06W2272
Abstract: No abstract text available
Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Stainless steel Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,1.27-2.54 micron matte tin at solder tail, 1.27-2.54 micronnickel under plated.
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UL94V0,
CAD06W2272
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corrugated carton
Abstract: corrugated SHEET carton box 0805-T
Text: Formosa MS Case No. 0805 Device Case No. 0805 Order code 0805-T 0.1 2 2 0.1 1.5 1.75 4.0 Index hole Taping 0.3 8 5.6 0.1 2.75 3.5 Dimensions 0.22 0.1 1.1 4.0 0.1 0.1 Material : Plastics Standard capacity : 3,000pcs / reel Quantity 13 o 0.5 12 0.5 Dimensions
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0805-T
000pcs
corrugated carton
corrugated SHEET
carton box
0805-T
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corrugated carton
Abstract: corrugated
Text: Formosa MS Case No. SMA Device SMA Case No. SMA-W SMA-T 0.1 1.5 2 2 0.1 4.0 1.75 Index hole 4.85 5.5 Dimensions 0.23 0.1 Taping 12 9.5 0.1 0.3 Order code 2.0 4.0 0.1 0.1 Material : Plastics Standard capacity : 5,000pcs / reel 13 o 0.5 12 0.5 75 2 Standard capacity : 2,000pcs / reel
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000pcs
corrugated carton
corrugated
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MELF
Abstract: MELF dimensions melf diode MELF Package plastics material datasheet PLASTICS CARD MATERIAL
Text: Formosa MS Case No. MELF Device Case No. MELF Order code MELF 0.1 2 2 0.1 1.5 1.75 4.0 Index hole Taping 12 9.5 0.1 0.3 4.85 5.5 Dimensions 0.2 0.1 2.7 4.0 0.1 0.1 Material : Plastics Quantity 12 13 o 2 0.5 Dimensions 330 80 2 0.5 Standard capacity : 5,000pcs / reel
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000pcs
MELF
MELF dimensions
melf diode
MELF Package
plastics material datasheet
PLASTICS CARD MATERIAL
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Untitled
Abstract: No abstract text available
Text: • E A ’ -y ?3 Ü 4 - - X < 7 X T - ’ -y ? C ase No. E-pack S tic k Packag e ^ - X No. Case No. E -j V E-pack type it f ê u - K Order code 4 10 1 rSA^hy/TR ubber end cap ■JXT'f 7 ? Ui *JpD = Dimensions D e vice Stick 6.0 3.0 0.6 "3 31 t i ft Material
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OCR Scan
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PDF
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80pcs/each
100pcs/each
60pcs/each
000pcs/carton
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Untitled
Abstract: No abstract text available
Text: tam m m y — Standard Package for Automated Assembly Tape and Reeled Package E /\°'y 7,0 91^4 7. Case No. E-pack Device V R33 ¿250) / U - ; u R33 (¿330) Reel size ¿250(EIAJ R 33)/R eel size ¿330(EIAJ R33) ^ - X No. Case No. E '* 'y 7 E-pack type Ü 3 - K
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OCR Scan
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PDF
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16mmfë
500pcs/reel
000pcs/reel
100pcs/each
50pcs/each
000pcs/carton
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shindengen m
Abstract: N39N ba41-01 shindengen 2f 45 2SB 407
Text: « m 15. 1— m ta m m m b f ^ •y Stan d ard Pa ck a g e fo r A u to m ated A sse m b ly Tape and Reeled Package A xial Taping Radial Taping 64 SHINDENGEN S tR R H M FS t ' r - Z i D T - ’s H X ' -;UR15 t 178) /') -;UR25( f 330) Reel size i 178{EIAJ R15) /Reel size i 330(E1AJ R25)
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OCR Scan
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PDF
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500pcs
STO-220
shindengen m
N39N
ba41-01
shindengen 2f 45
2SB 407
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JIS C 0806-1
Abstract: No abstract text available
Text: mmmm Standard Package for Automated Assembly 'J - l R33 ¿250) / ' J - J l r R33 (¿330) Case No. E-pack Device Reel size ¿250 (El A J R 3 3 )/R e e l size ¿330 (El A J R33) y - X No. C ase No. E '* 7 9 E-pack type ft« 3 - K O rd e r code 4 0 7 1 4 0 6 1
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OCR Scan
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PDF
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000pcs/reel
50pcs/each
000pcs/carton
JIS C 0806-1
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