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Catalog Datasheet	MFG & Type	PDF	Document Tags
CAD06W2272 Abstract: No abstract text available Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Stainless steel Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,1.27-2.54 micron matte tin at solder tail, 1.27-2.54 micronnickel under plated.	Original	PDF	UL94V0, CAD06W2272

Catalog Datasheet

MFG & Type

PDF

Document Tags

CAD06W2272

Abstract: No abstract text available
Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Stainless steel Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,1.27-2.54 micron matte tin at solder tail, 1.27-2.54 micronnickel under plated.

Original

PDF

UL94V0, CAD06W2272