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    KMC288P Search Results

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    Catalog Datasheet MFG & Type PDF Document Tags

    F741583

    Abstract: sp3721d d741667bpgf F741583PGF f721501apgf tnetv901apag F711862PGE F721730EPBK f721905pag F731891PDV
    Text: 12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Final Notification of Qualification of New Environmentally Friendly green Mold Compound for TQFP/LQFP Packages Assembled at TI Philippines and TI Taiwan Assembly Sites Change Notification Letter PCN# 20040714001


    Original     		PDF EN-4085S2K3 96mils L3/260C UL94-V0 TMS471R1F138 85C/85 3/260C F741583 sp3721d d741667bpgf F741583PGF f721501apgf tnetv901apag F711862PGE F721730EPBK f721905pag F731891PDV

    CEL-9240

    Abstract: CEL9240HF10 EN4900F sumitomo crm en4900 CEL9240HF10AKG 1076DS ase qfn EN-4900 KMC288P
    Text: July 23, 2009 CN-072309 Customer Notification M02067L-09-T Package Change Dear Valued Customer: This notification is for the purpose of informing you of a package change from the 4mm BCC package to the 4mm QFN package. Purpose ASE has informed us that the mold compound used for the non-RoHS BCC packages has been discontinued.


    Original     		PDF CN-072309 M02067L-09-T 900ppm, 1500ppm. CEL-9240 CEL9240HF10 EN4900F sumitomo crm en4900 CEL9240HF10AKG 1076DS ase qfn EN-4900 KMC288P

    QMI519

    Abstract: KEG3000D QMI-519 ra3906 GR828FC Kyocera mold compound Hitachi Datecode KE-G300 KE-G3000 Henkel
    Text: Date Created: 1/28/2004 Date Issued: 3/2/2004 PCN # 20040411 DESIGN/PROCESS CHANGE NOTIFICATION - FINAL This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence.


    Original     		PDF epax02 Ext686 MM74HCT00MTCX MM74HCT05MTC MM74HCT08MTCX MM74HCT14MTC MM74HCT240MTCX QMI519 KEG3000D QMI-519 ra3906 GR828FC Kyocera mold compound Hitachi Datecode KE-G300 KE-G3000 Henkel