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    JEDEC TRAY DIMENSIONS QFN Search Results

    JEDEC TRAY DIMENSIONS QFN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    NBSG53AMNG Rochester Electronics LLC 53 SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16, 3 X 3 MM, LEAD FREE, QFN-16 Visit Rochester Electronics LLC Buy
    ISLA212P13IRZ Renesas Electronics Corporation 12-Bit, 130MSPS ADC, QFN, /Tray Visit Renesas Electronics Corporation
    D6417709SHF200BV Renesas Electronics Corporation 32-bit Microcontrollers, HFQFP, /Tray Visit Renesas Electronics Corporation
    JM38510/12203BGA Renesas Electronics Corporation Amplifiers, CAN, /Tray Visit Renesas Electronics Corporation
    DF38122WV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), TFQFP, /Tray Visit Renesas Electronics Corporation

    JEDEC TRAY DIMENSIONS QFN Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    JEDEC qfn tray

    Abstract: QFn Package tray JEDEC tray standard 13 QFN tray JEDEC TRAY QFN Package tray JEDEC TRAY DIMENSIONS QFN QFN JEDEC TRAY JEDEC tray standard JEDEC TRAY DIMENSIONS
    Text: TRAY CONTAINER A' 7.39 10.00 7.50 7.39 A 135° C MAX. 10.10 7.35 QFN7x7B NEC 121.2 135.9 PPE 13 × 31=403 UNIT : mm 300.0 315.0 322.6 SECTION A-A' 5.92 6.35 7.62 7.39 Applied Package Quantity (pcs) 48-pin Plastic WQFN (7×7) 403 MAX. Tray QFN 7×7B Material


    Original     		PDF 48-pin SSD-A-H7741 JEDEC qfn tray QFn Package tray JEDEC tray standard 13 QFN tray JEDEC TRAY QFN Package tray JEDEC TRAY DIMENSIONS QFN QFN JEDEC TRAY JEDEC tray standard JEDEC TRAY DIMENSIONS

    IC Package Names and Code Designations

    Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408
    Text: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages


    Original     		PDF 10-001A IC Package Names and Code Designations data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408

    HT 1200-4

    Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
    Text: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF March/98 intern844-347360 HT 1200-4 IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing

    IC51-128

    Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
    Text: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials


    Original     		PDF

    JEDEC Matrix Tray outlines

    Abstract: ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783
    Text: Application Report SZZA021C − September 2005 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


    Original     		PDF SZZA021C JEDEC Matrix Tray outlines ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783

    PT740 AB

    Abstract: diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48
    Text: Hitachi Semiconductor Package Data Book ADE–410–001G 8th Edition September/2000 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF September/2000 PT740 AB diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48

    HT 1200-4

    Abstract: YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341
    Text: Hitachi Semiconductor Package Data Book ADE–410–001B 3rd Edition March/97 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional


    Original     		PDF March/97 HT 1200-4 YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341

    PT740 AB

    Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A
    Text: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF ADE-410-001J March/2002 PT740 AB 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 BP-108 EDR7315 QP4-064050-002-A

    PT740 AB

    Abstract: PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311
    Text: Hitachi Semiconductor Package Data Book ADE–410–001H 9th Edition March/2001 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF March/2001 standard-856-8650 PT740 AB PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311

    tray lqfp

    Abstract: JEDEC qfn tray QFn Package tray JEDEC TRAY DIMENSIONS QFN
    Text: ARM-based Flash MCU SAM4S Series SUMMARY DATASHEET Description The Atmel SAM4S series is a member of a family of Flash microcontrollers based on the high-performance 32-bit ARM Cortex ® -M4 RISC processor. It operates at a maximum speed of 120 MHz and features up to 2048 Kbytes of Flash, with optional


    Original     		PDF 32-bit tray lqfp JEDEC qfn tray QFn Package tray JEDEC TRAY DIMENSIONS QFN

    Untitled

    Abstract: No abstract text available
    Text: AS1357 D a ta S he e t P r o g r a m m a b l e Tr i p l e L D O 2 Key Features 1 General Description The AS1357 is a high-performance triple CMOS lowdropout voltage regulator in a single QFN package. The efficient set of programmable power supplies is optimized to deliver the best compromise between quiescent current and regulator performance for mobile


    Original     		PDF AS1357 AS1357

    Untitled

    Abstract: No abstract text available
    Text: ARM-based Flash MCU SAM4N Series SUMMARY DATASHEET SAM4N8/16 Description The Atmel SAM4N series is a member of a family of Flash microcontrollers based on the high performance 32-bit ARM Cortex®-M4 RISC processor. It operates at a maximum speed of 100 MHz and features up to 1024 Kbytes of Flash and up to 80


    Original     		PDF SAM4N8/16 32-bit 16-bit 10-bit 12-bit

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		PDF DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram

    LGA 1156 PIN OUT diagram

    Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    LGA 1155 Socket PIN diagram

    Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    atmel 8051 microcontroller with built in ADC dac

    Abstract: AT89LP51ED2 atmel 8051 microcontroller with built in ADC AT89LP51RD2 atmel at89c51rd2 AT89C51ED2-RLTUM AT89C51RD2-RLTUM AT89LP51ID2 atmel AT89C51RD2 PROGRAMMER AT89C51ED2-SLSUM
    Text: Features • 8-bit Microcontroller Compatible with 8051 Products • Enhanced 8051 Architecture – – – – – – – – • • • • • Single Clock Cycle per Byte Fetch 12 Clock per Machine Cycle Compatibility Mode Up to 20 MIPS Throughput at 20 MHz Clock Frequency


    Original     		PDF 16x16 AT89LP51ED2/ID2 512-byte 3714AS atmel 8051 microcontroller with built in ADC dac AT89LP51ED2 atmel 8051 microcontroller with built in ADC AT89LP51RD2 atmel at89c51rd2 AT89C51ED2-RLTUM AT89C51RD2-RLTUM AT89LP51ID2 atmel AT89C51RD2 PROGRAMMER AT89C51ED2-SLSUM

    AT89LP51RB2

    Abstract: AT89LP51RC2 atmel 8051 microcontroller with built in ADC dac AT89LP51ED2 AT89C51RC2-RLTUM atmel 8051 microcontroller with built in ADC atmel dac adc 8051 AT89C51RC2-SLSUM TPS30 PDIP40
    Text: Features • 8-bit Microcontroller Compatible with 8051 Products • Enhanced 8051 Architecture – – – – – – – – • • • • • Single Clock Cycle per Byte Fetch 12 Clock per Machine Cycle Compatibility Mode Up to 20 MIPS Throughput at 20 MHz Clock Frequency


    Original     		PDF 16x16 1152KB 24KB/32KB 512-byte 3722AS AT89LP51RB2 AT89LP51RC2 atmel 8051 microcontroller with built in ADC dac AT89LP51ED2 AT89C51RC2-RLTUM atmel 8051 microcontroller with built in ADC atmel dac adc 8051 AT89C51RC2-SLSUM TPS30 PDIP40

    smd transistor M7A

    Abstract: ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747
    Text: CONTENTS 1. STANDARDIZATION OF PACKAGES 1.1 EIAJ Standards 1.2 JEDEC Standards 1.3 IEC Standards 2. NAME'S OF NEC'S PACKAGES 3. PACKAGE CODES BY EIAJ 3.1 Construction of package code 4. DIMENSION SYMBOL AND EXAMPLE DIMENSIONS 4.1 Example of dimensions of packages


    Original     		PDF PD41265L-12-E1 PD41256L PD23C32000AGX-$ PD23C32000A smd transistor M7A ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747

    NEC A39A

    Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
    Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES


    Original     		PDF C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B

    SMD MARKING CODE 071 A01

    Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
    Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods


    Original     		PDF LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga

    E131

    Abstract: MC100EP131 MC10EP131 QFN32
    Text: MC10EP131, MC100EP131 3.3V / 5V ECL Quad D Flip−Flop with Set, Reset, and Differential Clock Description The MC10/100EP131 is a Quad Master−slaved D flip−flop with common set and separate resets. The device is an expansion of the E131 with differential common clock and individual clock enables.


    Original     		PDF MC10EP131, MC100EP131 MC10/100EP131 EP131 E131 MC100EP131 MC10EP131 QFN32

    qfn 3x3 tray dimension

    Abstract: PEAK TRAY QFN 4x4 QFN tray qfn 4x4 qfn 3x3 tray dimension peak PEAK TRAY qfn 4 x 4 JEDEC qfn tray QFN tray 4x4 QFN tray 3x3 qfn 4x4 tray dimension F QFN 3X3
    Text: AS1357 D a ta S he e t P r o g r a m m a b l e Tr i p l e L D O 1 General Description 2 Key Features ! 3 Independent Voltage Regulators with Shutdown ! Output Current: 200mA each LDO ! One Time Programmable Output Voltage User- or Factory-Trimmed ! Programmable Output Voltage Range: 1.8 to 3.3V in


    Original     		PDF AS1357 200mA 100kHz 200mA qfn 3x3 tray dimension PEAK TRAY QFN 4x4 QFN tray qfn 4x4 qfn 3x3 tray dimension peak PEAK TRAY qfn 4 x 4 JEDEC qfn tray QFN tray 4x4 QFN tray 3x3 qfn 4x4 tray dimension F QFN 3X3

    JESD51-8

    Abstract: JESD51-2 JEDEC JESD51-8 qfn 44 PACKAGE footprint 9mm surface mount package dimensions FREESCALE PACKING jesd51 8 JEDEC-STD-020 JEDEC-STD020 tqfp 44 PACKAGE footprint
    Text: Freescale Semiconductor, Inc. ANALOG ICs INTEGRATED SOLUTIONS Freescale Semiconductor, Inc. PACKAGING Robust packaging is a key technology component of Analog Products. Motorola puts solutions together in single packages to accomodate power and high voltages.


    Original     		PDF BR1568/D JESD51-8 JESD51-2 JEDEC JESD51-8 qfn 44 PACKAGE footprint 9mm surface mount package dimensions FREESCALE PACKING jesd51 8 JEDEC-STD-020 JEDEC-STD020 tqfp 44 PACKAGE footprint