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    Infineon Technologies AG IRGC100B60KC

    IGBT CHIP
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    Infineon Technologies AG IRGC100B60KB

    IGBT CHIP
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    Untitled

    Abstract: No abstract text available
    Text: PD - 94618A IRGC100B60KB Die in Wafer Form Features C • • • • • GEN5 Non Punch Through NPT Technology Low VCE(on) 10µs Short Circuit Capability Square RBSOA Positive VCE(on) Temperature Coefficient • • • • Benchmark Efficiency for Motor Control Applications


    Original     		PDF 4618A IRGC100B60KB 150mm

    IRGC100B60K

    Abstract: 1kA IGBT 4kA IGBT
    Text: PD - 94618 IRGC100B60KB Die in Wafer Form Features • • • • • GEN5 Non Punch Through NPT Technology Low VCE(on) 10µs Short Circuit Capability Square RBSOA Positive VCE(on) Temperature Coefficient • • • • Benchmark Efficiency for Motor Control Applications


    Original     		PDF IRGC100B60KB 150mm IRGC100B60K 1kA IGBT 4kA IGBT

    IRGC100B60K

    Abstract: HF100D060ACE
    Text: PD - 94619 HF100D060ACE Hexfred Die in Wafer Form Features • GEN3 Hexfred Technology • Low VF • Low IRR • Low tRR • Soft Reverse Recovery Benefits • • • • • Benchmark Efficiency for Motor Control Applications Rugged Transient Performance Low EMI


    Original     		PDF HF100D060ACE 125mm 12-Mar-07 IRGC100B60K HF100D060ACE

    HF100D060ACE

    Abstract: IRGC100B60K
    Text: PD - 94619 HF100D060ACE Hexfred Die in Wafer Form Features • GEN3 Hexfred Technology • Low VF • Low IRR • Low tRR • Soft Reverse Recovery Benefits • • • • • Benchmark Efficiency for Motor Control Applications Rugged Transient Performance Low EMI


    Original     		PDF 125mm HF100D060ACE IRGC100B60K HF100D060ACE IRGC100B60K