Untitled
Abstract: No abstract text available
Text: SOT782-1 HV SO N8 HVSON8; reel pack; standard product orientation; 12NC ending 115 Rev. 1 — 7 September 2011 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal Preprinted ESD warning PQ-label permanent Circular sprocket holes opposite the
|
Original
|
PDF
|
OT782-1
001aak603
OT782-1
|
HVSON8
Abstract: TJA1028 circuit diagram of Garage Door Openers Rain alarm rain sensor J2602 so8 footprint
Text: TJA1028 NXP LIN2.x/J2602 transceiver with integrated voltage regulator Compact, cost-effective LIN slave SBC This system basis chip SBC combines a LIN2.x transceiver with a 70 mA voltage regulator. Available in both SO8 and HVSON8 package. With the HVSON8 package (3 x 3 mm), it provides excellent
|
Original
|
PDF
|
TJA1028
x/J2602
J2602
IEC61000-4-2
TJA1028
015aaa085
HVSON8
circuit diagram of Garage Door Openers
Rain alarm
rain sensor
so8 footprint
|
Untitled
Abstract: No abstract text available
Text: Package outline HVSON8: plastic, thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm SOT908-2 X A B D E A A1 c terminal 1 index area detail X e1 terminal 1 index area e C b 1 C A B C v w 4 y y1 C L k Eh 8 5 Dh 1 Dimensions
|
Original
|
PDF
|
OT908-2
MO-229
sot908-2
|
sot909
Abstract: philips amplifier dap 300
Text: SA58631 3 W BTL audio amplifier Rev. 01 — 8 March 2006 Product data sheet 1. General description The SA58631 is a one channel audio amplifier in an HVSON8 package. It provides power output of 3 W with an 8 Ω load at 9 V supply. The internal circuit is comprised of a BTL
|
Original
|
PDF
|
SA58631
SA58631
sot909
philips amplifier dap 300
|
Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of HVSON8 package SOT782-2 Gx P 0.105 D C SPx Hy Gy SLy SPy By Ay nSPy nSPx SLx solder land solder paste deposit solder land plus solder paste occupied area DIMENSIONS in mm P Ay By C
|
Original
|
PDF
|
OT782-2
sot782-2
|
SA58631
Abstract: SA58631TK MO-229
Text: SA58631 3 W BTL audio amplifier Rev. 02 — 12 October 2007 Product data sheet 1. General description The SA58631 is a one channel audio amplifier in an HVSON8 package. It provides power output of 3 W with an 8 Ω load at 9 V supply. The internal circuit is comprised of a BTL
|
Original
|
PDF
|
SA58631
SA58631
SA58631TK
MO-229
|
Untitled
Abstract: No abstract text available
Text: 333 SOT873-1 QF N3 HVSON8; reel pack; standard product orientation; 12NC ending 115 Rev. 1 — 21 September 2011 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal Preprinted ESD warning PQ-label permanent Circular sprocket holes opposite the
|
Original
|
PDF
|
OT873-1
001aak603
OT873-1
|
Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of HVSON8 package SOT908-1 Gx P D C nSPx Hy SPy Gy SLy By Ay nSPy SPx SLx solder land solder paste deposit solder land plus solder paste occupied area DIMENSIONS in mm P Ay By C D SLx SLy
|
Original
|
PDF
|
OT908-1
sot908-1
|
TJA1021
Abstract: TJA1021TK LIN2.1 RHF-2006 LIN21 ISO7637 TJA1020 MO-229 TJA1021T HVSON8
Text: NXP standalone LIN2.1 transceiver TJA1021TK/20 in HVSON8 Smaller, lighter LIN2.1 transceiver in leadless HVSON8 package To enable smaller, lighter, and more environmentally friendly LIN2.1 modules, the industry-leading TJA1021 transceiver is now available in a leadless HVSON8 package that measures only
|
Original
|
PDF
|
TJA1021TK/20
TJA1021
TJA1021TK/20/c
1/SAEJ2602
MO-229
sot782-1
TJA1021TK
LIN2.1
RHF-2006
LIN21
ISO7637
TJA1020
MO-229
TJA1021T
HVSON8
|
HVSON8
Abstract: HVSON-8
Text: PDF: 2002 Nov 27 Philips Semiconductors Package outline HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 6 x 5 x 0.85 mm SOT685-1 2.5 X 5 mm scale A B D A A1 c E detail X terminal 1 index area C e1 terminal 1 index area
|
Original
|
PDF
|
OT685-1
HVSON8
HVSON-8
|
Untitled
Abstract: No abstract text available
Text: SA58631 3 W BTL audio amplifier Rev. 02 — 12 October 2007 Product data sheet 1. General description The SA58631 is a one channel audio amplifier in an HVSON8 package. It provides power output of 3 W with an 8 Ω load at 9 V supply. The internal circuit is comprised of a BTL
|
Original
|
PDF
|
SA58631
SA58631
|
Untitled
Abstract: No abstract text available
Text: Package outline HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 4 x 4 x 0.85 mm SOT909-2 X B D A E A A1 c detail X terminal 1 index area e1 terminal 1 index area 1 4 C C A B C Øv Øw b e y1 C y L k Eh 8 5 Dh 1
|
Original
|
PDF
|
OT909-2
MO-229
sot909-2
|
Class-AB
Abstract: Class AB SOT909-1 SA58631 SA58631TK HVSON8
Text: NXP 3-W Class AB, BTL audio amplifier SA58631 Audio amplifier for portable applications This single-channel audio amplifier provides a power output of 3 W with an 8-Ω load using a 9-V supply. Housed in an HVSON8 package with an exposed die-attach paddle, it delivers
|
Original
|
PDF
|
SA58631
Class-AB
Class AB
SOT909-1
SA58631
SA58631TK
HVSON8
|
AN01026
Abstract: MO-229 SA58631 SA58631TK professional audio power amplifier schematics
Text: SA58631 3 W BTL audio amplifier Rev. 01 — 1 December 2005 Preliminary data sheet 1. General description The SA58631 is a one channel audio amplifier in a HVSON8 package. It provides power output of 3 W with a 8 Ω load at 9 V supply. The internal circuit is comprised of a BTL
|
Original
|
PDF
|
SA58631
SA58631
AN01026
MO-229
SA58631TK
professional audio power amplifier schematics
|
|
|
Untitled
Abstract: No abstract text available
Text: Package outline HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm SOT908-3 X A B D A E A1 c detail X terminal 1 index area e1 terminal 1 index area e 1 4 C C A B v w b y y1 C L k Eh 8 5 Dh 1 Dimensions mm are the original dimensions
|
Original
|
PDF
|
OT908-3
MO-229
sot908-3
|
Untitled
Abstract: No abstract text available
Text: HV SO N8 SOT909-1 HVSON8; reel pack; standard product orientation; 12NC ending 115 Rev. 1 — 21 September 2011 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal Preprinted ESD warning PQ-label permanent Circular sprocket holes opposite the
|
Original
|
PDF
|
OT909-1
001aak603
OT909-1
|
Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of HVSON8 package SOT909-1 Gx D P C SPx SPytot nSPx Hy Gy SPy SPxtot SLy By Ay nSPy SLx solder land solder paste deposit solder land plus solder paste occupied area DIMENSIONS in mm P Ay
|
Original
|
PDF
|
OT909-1
sot909-1
|
Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of HVSON8 package SOT782-1 Gx P D C nSPx Hy SPy Gy SLy By Ay nSPy SPx SLx solder land solder paste deposit solder land plus solder paste occupied area DIMENSIONS in mm P Ay By C D SLx SLy
|
Original
|
PDF
|
OT782-1
sot782-1
|
Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVSON8 package SOT685-1 Gx D 0.105 P C SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Generic footprint pattern Refer to the package outline drawing for actual layout
|
Original
|
PDF
|
OT685-1
OT685-1
|
Untitled
Abstract: No abstract text available
Text: Package outline HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 4 x 4 x 0.85 mm SOT909-1 1 2 mm scale X B D A A E A1 c detail X terminal 1 index area e1 terminal 1 index area v w b e 1 4 M M C C A B C y1 C y L
|
Original
|
PDF
|
OT909-1
MO-229
|
Untitled
Abstract: No abstract text available
Text: Package outline HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm SOT908-1 1 2 mm scale X B D A E A A1 c detail X terminal 1 index area e1 terminal 1 index area e v w b 1 4 M M C C A B C y1 C y L
|
Original
|
PDF
|
OT908-1
MO-229
|
Untitled
Abstract: No abstract text available
Text: Package outline HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm SOT782-2 X B D A A A1 E A3 terminal 1 index area detail X e1 terminal 1 index area e 1 C A B C v w b 4 C y y1 C L k E1 8 5 J D1 2 mm
|
Original
|
PDF
|
OT782-2
MO-229
sot782-2
|
Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of HVSON8 package SOT908-3 Gx P D C nSPx Hy SPy Gy SLy By Ay nSPy SPx SLx solder land solder paste deposit solder land plus solder paste occupied area DIMENSIONS in mm P Ay By C D SLx SLy
|
Original
|
PDF
|
OT908-3
sot908-3
|
SMD CODE N8
Abstract: No abstract text available
Text: HV SO N8 SOT908-1 HVSON8; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 2 — 19 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape
|
Original
|
PDF
|
OT908-1
001aak603
OT908-1
SMD CODE N8
|