HTQFP48
Abstract: PTQP0048KB-A
Text: JEITA Package Code P-HTQFP48-7x7-0.50 RENESAS Code PTQP0048KB-A Previous Code 48PFW-A MASS[Typ.] 0.1g NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 3. *4 THERE ARE SOME VARIATIONS FOR D2/E1. HD
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P-HTQFP48-7x7-0
PTQP0048KB-A
48PFW-A
HTQFP48
PTQP0048KB-A
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Untitled
Abstract: No abstract text available
Text: Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 10 x 10 x 1 mm; exposed die pad SOT1181-1 c y X exposed die pad A Dh 36 25 37 24 ZE e Eh HE E A A2 A3 A1 w θ bp pin 1 index 48 Lp 13 1 L detail X 12 v ZD w bp A e B D
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HTQFP48:
OT1181-1
MS-026
sot1181-1
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Untitled
Abstract: No abstract text available
Text: Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad SOT545-2 c y exposed die pad side X Dh 36 25 A 24 37 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index 13 48 detail X 1 12 ZD w M bp
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HTQFP48:
OT545-2
MS-026
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HTQFP48
Abstract: sot545
Text: PDF: 1999 Aug 05 Philips Semiconductors Package outline HTQFP48: plastic, heatsink thin quad flat package; 48 leads; body 7 x 7 x 1 mm SOT545-2 c y heatsink side X Dh 36 25 37 A 24 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index 13 48 detail X 1 12 ZD
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HTQFP48:
OT545-2
OT545-2
HTQFP48
sot545
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HTQFP48
Abstract: MS-026
Text: PDF: 2002 May 22 Philips Semiconductors Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad SOT545-1 c y exposed die pad X Dh 36 25 37 A 24 ZE e E HE Eh A 3 A A2 A1 w M θ bp pin 1 index
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HTQFP48:
OT545-1
MS-026
HTQFP48
MS-026
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SOT1181-2
Abstract: No abstract text available
Text: Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 10 x 10 x 1 mm; exposed die pad SOT1181-2 c y X exposed die pad A Dh 36 25 37 24 ZE e Eh A HE E A2 A3 A1 w θ bp pin 1 index 48 Lp 13 1 12 e v ZD w bp A B D HD v B 5 max
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HTQFP48:
OT1181-2
MS-026
sot1181-2
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HTQFP48
Abstract: MS-026 HTQFP-48
Text: PDF: 2004 Feb 19 Philips Semiconductors Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad SOT545-2 c y exposed die pad side X Dh 36 25 A 24 37 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index
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HTQFP48:
OT545-2
MS-026
HTQFP48
MS-026
HTQFP-48
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Untitled
Abstract: No abstract text available
Text: Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad SOT545-2 c y exposed die pad side X Dh 36 25 A 24 37 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index 13 48 detail X 1 12 e ZD w M bp
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HTQFP48:
OT545-2
MS-026
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Untitled
Abstract: No abstract text available
Text: Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad SOT545-3 c y exposed die pad side X Dh 36 25 A 24 37 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index 13 48 detail X 1 12 e ZD w M bp
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HTQFP48:
OT545-3
MS-026
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HTQFP48
Abstract: sot545
Text: PDF: 2000 Apr 10 Philips Semiconductors Package outline HTQFP48: plastic, heatsink thin quad flat package; 48 leads; body 7 x 7 x 1.0 mm SOT545-1 c y heathsink side X Dh 36 25 37 A 24 ZE e E HE Eh A 3 A A2 A1 w M θ bp pin 1 index Lp L 13 48 detail X 1 12
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HTQFP48:
OT545-1
HTQFP48
sot545
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HTQFP48 package SOT545-2 Hx Gx P2 0.125 P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout
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HTQFP48
OT545-2
OT545-2
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HTQFP48
Abstract: MS-026 sot545
Text: PDF: 2004 Feb 05 Philips Semiconductors Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad SOT545-3 c y exposed die pad side X Dh 36 25 A 24 37 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index
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HTQFP48:
OT545-3
MS-026
HTQFP48
MS-026
sot545
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HTQFP48
Abstract: No abstract text available
Text: PDF: 2000 Feb 02 Philips Semiconductors Package outline HTQFP48: plastic, heatsink thin quad flat package; 48 leads; body 7 x 7 x 1.0 mm SOT545-2 c y heatsink side X Dh 36 25 37 A 24 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index 13 48 detail X 1 12
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HTQFP48:
OT545-2
HTQFP48
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Untitled
Abstract: No abstract text available
Text: ADS5413 www.ti.com SLWS153 − DECEMBER 2003 SINGLE 12-BIT, 65-MSPS IF SAMPLING ANALOG-TO-DIGITAL CONVERTER FEATURES D 48-Pin TQFP Package With PowerPad D D D D D D D D D D 64.5-dBFS SNR and 72-dBc SFDR at 65 MSPS 7 mm x 7 mm body size 12-Bit Resolution
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ADS5413
SLWS153
12-BIT,
65-MSPS
12-Bit
400-mW
48-Pin
190-MHz
72-dBc
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Untitled
Abstract: No abstract text available
Text: THS7327 SLOS502C – SEPTEMBER 2006 – REVISED OCTOBER 2011 www.ti.com 2 3-Channel RGBHV Video Buffer with I C Control, Selectable Filters, Monitor Pass-Thru, 2:1 Input MUX, and Selectable Input Bias Modes Check for Samples: THS7327 FEATURES • 1 • 3-Video Amplifiers for CVBS, S-Video,
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THS7327
SLOS502C
16-MHz,
35-MHz,
75-MHz
500-MHz)
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tas5717l
Abstract: No abstract text available
Text: User's Guide SLOU331 – December 2011 TAS5731EVM Evaluation Module This manual describes the operation of the TAS5731EVM to evaluate the performance of the TAS5731 integrated digital audio power amplifier. The main contents of this document are: • Details on how to properly connect a TAS5731 Evaluation Module EVM and the details of the EVM.
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SLOU331
TAS5731EVM
TAS5731
TAS5731
TAS5731EVM.
tas5717l
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ADS5413
Abstract: ADS5413IPHP OPA690
Text: ADS5413 www.ti.com SLWS153 − DECEMBER 2003 SINGLE 12-BIT, 65-MSPS IF SAMPLING ANALOG-TO-DIGITAL CONVERTER FEATURES D 48-Pin TQFP Package With PowerPad D D D D D D D D D D 64.5-dBFS SNR and 72-dBc SFDR at 65 MSPS 7 mm x 7 mm body size 12-Bit Resolution
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ADS5413
SLWS153
12-BIT,
65-MSPS
48-Pin
72-dBc
12-Bit
190-MHz
400-mW
ADS5413
ADS5413IPHP
OPA690
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TAS5412
Abstract: TAS5422 audio guide TAS5707 300w stereo amplifier with bass and treble TAS3308 TLV320AIC34 TMS320C6747 purepath studio bass treble using ne5532
Text: Audio Guide Class-AB, Class-D and Class-G Amplifiers, Audio Converters, Clocks, Digital Signal Processing, Interface, Switches and USB Audio www.ti.com/audio 1Q 2009 2 Audio Guide ➔ Table of Contents Audio Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
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VSP6244
Abstract: hp laptop ac adapter schematics diagram 3 phase dc converter afe circuit diagram igbt omap3530 GPMC NORFLASH klixon 8-S msp430F5438 usart examples ir remote control transmitter ABC T2 vsp6822 STB 2300 HD Streaming IP Set Top Box UCC28070
Text: 2 Introduction and Table of Contents TI’s Solutions Cover the Entire Video Chain TI has been involved in the video market for more than 25 years. The steps in the video chain span everything from the creation of the original content to the final viewing
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NXP Solutions for In-Vehicle Networking
Abstract: 75017381 TJA1044TK AH1014 TJA1085
Text: NXP Solutions for In-Vehicle Networking High-Speed CAN Status Physical-Layer Compliance Bit Rate bps Operating Modes Package Lead Free PCA82C250T PCA82C251T TJA1050T TJA1051T TJA1051T/3 TJA1051T/E TJA1051TK/3 Production Production Production TJA1042T TJA1042T/3
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PCA82C250T
PCA82C251T
TJA1042T
TJA1042T/3
TJA1042TK/3
TJA1057T
TJA1057TK
40kbps
TJA1040T
TJA1044T
NXP Solutions for In-Vehicle Networking
75017381
TJA1044TK
AH1014
TJA1085
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TTL transformer to RF
Abstract: PCB1337-1 F6905 HTQFP48 TDA9910 AN1035
Text: AN10352 -TDA9910HW- 12-bit High Speed A/D Converter Demonstration board Rev. 01 — 01 July 2005 Application note Document information Info Content Keywords AN10352, TDA9910HW/6, TDA9910HW/8, Demoboard, 12-bit ADC, High speed, Application Note Abstract This document describes the design and the main features of the
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AN10352
-TDA9910HW-
12-bit
AN10352,
TDA9910HW/6,
TDA9910HW/8,
TDA9910
PCB1337-1)
TTL transformer to RF
PCB1337-1
F6905
HTQFP48
AN1035
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philips capacitor 1000uf 25V
Abstract: HF70ACB HTQFP48 LM317MDT TDA9910 TL431CPK HD 4480
Text: TDA9910 12-bit, up to 80 Msample/s, Analog-to-Digital Converter ADC direct/ultra high IF sampling Rev. 02 — 9 December 2004 Objective data sheet 1. General description The TDA9910 is a 12-bit Analog-to-Digital Converter (ADC) optimized for direct IF sampling, and supporting the most demanding use conditions in ultra high IF radio
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TDA9910
12-bit,
TDA9910
12-bit
philips capacitor 1000uf 25V
HF70ACB
HTQFP48
LM317MDT
TL431CPK
HD 4480
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MC57XXPSIA
Abstract: coaxial input to rca 5.1 audio output circuit optical input to rca 5.1 output circuit SUBWOOFER BOARD coaxial to analog 5.1 rca converter circuit TAS570x GDE PCE3878CT gde 41 C1680X5R0J475M TAS5713EVM
Text: User's Guide SLOU281 – January 2010 25W Digital Input Amplifier With EQ and 2-Band DRC This manual describes the operation of the TAS5713EVM to evaluate the performance of the TAS5713 integrated digital audio power amplifier. The main contents of this document are:
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SLOU281
TAS5713EVM
TAS5713
TAS5713EVM
MC57xxPSIA
coaxial input to rca 5.1 audio output circuit
optical input to rca 5.1 output circuit
SUBWOOFER BOARD
coaxial to analog 5.1 rca converter circuit
TAS570x GDE
PCE3878CT
gde 41
C1680X5R0J475M
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Untitled
Abstract: No abstract text available
Text: ADS5413-11 www.ti.com SLWS156 − MARCH 2004 SINGLE 11ĆBIT, 65ĆMSPS HIGH IF SAMPLING ANALOGĆTOĆDIGITAL CONVERTER D Single-Ended or Differential Clock D 1-GHz −3-dB Input Bandwidth D 48-Pin TQFP Package With PowerPad FEATURES D 11-Bit Resolution D 65-MSPS Maximum Sample Rate
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ADS5413-11
SLWS156
11BIT,
65MSPS
11-Bit
65-MSPS
400-mW
220-MHz
48-Pin
IS-95,
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