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    T6083

    Abstract: foxconn motherboard HC96227 8484 au mc 14003
    Text: REV. A B ECN. NO. APPD. HC96334 H.T.P. Mr 7 B D '•X.±2P J ± CQ.i-51 i:a±K&&Î i m x± .mi ¡UNITS MM [INCH] mri ■m s« NAME0NTENDED USE STRADDLE MOUNT M CA CDMNJ PART N X(INTENDED USE) EH260S»*-* APPO: ïiæst mxmss m m u m m m mi <3FW3N HW ?3£&VS0lK WO.


    OCR Scan     		PDF HC96334 EH260S» L9603 E35G3 T6083 foxconn motherboard HC96227 8484 au mc 14003

    Untitled

    Abstract: No abstract text available
    Text: ITEM Q 1TY DESC. 1 HOUSING 2 CONTACT 1 MATERIAL TREATMENT THERMOPLASTIC MEETING UL 94V- 0 MOLDED WHITE COPPER ALLOY PLATIN, 100-200U" TIN /LEAD PLATING O N TAIL CONTACT AREA PLATING REMARK 50-90u" NICKEL BASE SEE REMARK SEE BELOW. REMARK: 1 . PROD. NO.: EH


    OCR Scan     		PDF 50-90u" 100-200U" HC96526 EH29291