NSR01L30NXT5G
Abstract: No abstract text available
Text: NSR01L30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN
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NSR01L30NXT5G
NSR01L30/D
NSR01L30NXT5G
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152AA-01
Abstract: 0201 footprint marking 2x
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DSN2, 0.6x0.3, 0.4P, 0201 CASE 152AA−01 ISSUE O DATE 06 MAY 2009 SCALE 8:1 A B D 2X DIM A A1 b D E e L E 0.06 C 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.
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152AA-01
152AA
152AA-01
0201 footprint
marking 2x
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NSR02F30NXT5G
Abstract: No abstract text available
Text: NSR02F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN
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NSR02F30NXT5G
NSR02F30/D
NSR02F30NXT5G
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NSR02F30NXT5G
Abstract: No abstract text available
Text: NSR02F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN
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NSR02F30NXT5G
NSR02F30/D
NSR02F30NXT5G
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NSR01L30NXT5G
Abstract: No abstract text available
Text: NSR01L30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN
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NSR01L30NXT5G
NSR01L30/D
NSR01L30NXT5G
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152AD-01
Abstract: 152AD dsn2
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DSN2, 1.4x0.6, 0.75P CASE 152AD−01 ISSUE A DATE 18 MAR 2010 SCALE 8:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 0.05 C A B D DIM A A1 b D E L L2 L3 E 0.05 C
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152AD-01
152AD
152AD-01
152AD
dsn2
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AND8464
Abstract: PNC0106A Soldering guidelines pin in paste reflow profile
Text: AND8464/D Board Level Application Note for 0402, 0502 and 0603 DSN2 Packages Prepared by: Denise Thienpont, Steve St. Germain ON Semiconductor http://onsemi.com APPLICATION NOTE Introduction Recommendations for each of these items are included in this application note. Figure 2 illustrates the color scheme
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AND8464/D
AND8464
PNC0106A
Soldering guidelines pin in paste
reflow profile
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Untitled
Abstract: No abstract text available
Text: NSR02L30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN
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NSR02L30NXT5G
NSR02L30/D
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NSR02L30NXT5G
Abstract: 0201 footprint
Text: NSR02L30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN
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NSR02L30NXT5G
NSR02L30/D
NSR02L30NXT5G
0201 footprint
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NSR01F30NXT5G
Abstract: No abstract text available
Text: NSR01F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN
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NSR01F30NXT5G
NSR01F30/D
NSR01F30NXT5G
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NSR01F30NXT5G
Abstract: No abstract text available
Text: NSR01F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN
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NSR01F30NXT5G
NSR01F30/D
NSR01F30NXT5G
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Untitled
Abstract: No abstract text available
Text: NSR02F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN
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NSR02F30NXT5G
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152AB
Abstract: CASE 152AB
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DSN2, 1.6x0.8, 0.9P, 0603 CASE 152AB−01 ISSUE A DATE 18 MAR 2010 SCALE 8:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 0.05 C A B D DIM A A1 b D E L L2
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152AB-01
152AB
152AB
CASE 152AB
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Untitled
Abstract: No abstract text available
Text: NSR01F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN
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NSR01F30NXT5G
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AND8398
Abstract: stencil tension PNC0106A
Text: AND8398/D Board Level Application Note for 0201 DSN2 0.6 x 0.3mm Package Prepared by: Steve St. Germain, Roger Arbuthnot, Denise Thienpont, Lon Robinson, Darrell Truhitte ON Semiconductor http://onsemi.com APPLICATION NOTE Introduction Board Mounting Process
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AND8398/D
AND8398
stencil tension
PNC0106A
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152AC
Abstract: No abstract text available
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DSN2, 1.0x0.6, 0.575P, 0402 CASE 152AC−01 ISSUE B DATE 18 MAR 2010 SCALE 8:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 0.05 C A B D DIM A A1 b D E L L2
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152AC-01
152AC
152AC
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NSR01F30NXT5G
Abstract: No abstract text available
Text: NSR01F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN
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NSR01F30NXT5G
NSR01F30/D
NSR01F30NXT5G
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NSR02L30NXT5G
Abstract: DSN2 0201 DSN footprint
Text: NSR02L30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN
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NSR02L30NXT5G
NSR02L30/D
NSR02L30NXT5G
DSN2
0201 DSN footprint
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digital dts dolby 5.1 ic
Abstract: ac3 7.1 decoder ic YAMAHA DSP ac3 dts decoder dts decoder dts decoder ic YSS912-F dolby to dts circuit DSP DTS YSS902
Text: YSS912 AC3D2 Dolby Digital AC-3 / Pro Logic / DTS decoder + Sub DSP INTRODUCTION The YSS912 is one chip LSI consisting two built-in DSP’s ; Dolby Digital (AC-3) / Pro Logic / DTS decoder (Main DSP) and a sound processing DSP (Sub DSP). Sub DSP is capable of realizing various sound fields, such as
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YSS912
YSS912
YSS902,
YSS902
YSS912.
YSS902
digital dts dolby 5.1 ic
ac3 7.1 decoder ic
YAMAHA DSP
ac3 dts decoder
dts decoder
dts decoder ic
YSS912-F
dolby to dts circuit
DSP DTS
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Untitled
Abstract: No abstract text available
Text: CM1282-01D1 1-Channel Ultra-Low Capacitance ESD Protection Device Product Description http://onsemi.com The CM1282−01D1 is an ultra−low capacitance, 1−channel ESD protection device. The CM1282−01D1 is fully compliant with IEC 61000−4−2 and is also RoHS−compliant.
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CM1282-01D1
CM1282â
IEC61000â
152AE
01D1/D
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Untitled
Abstract: No abstract text available
Text: NSR05F40QNXT5G Schottky Diode Optimized for High Frequency Switching Power Supplies These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current and are offered in a Chip Scale Package CSP to reduce board space. The low thermal resistance
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NSR05F40QNXT5G
NSR05F40Q/D
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nsr05f40nxt5g
Abstract: NSR05F40
Text: NSR05F40NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current and are offered in a Chip Scale Package CSP to reduce board space. The low thermal resistance enables designers to meet the challenging task of achieving higher
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NSR05F40NXT5G
NSR05F40/D
nsr05f40nxt5g
NSR05F40
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NSR20F30NXT5G
Abstract: 20F30 NSR20F30NXT5 of665
Text: NSR20F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current and are offered in a Chip Scale Package CSP to reduce board space. The low thermal resistance enables designers to meet the challenging task of achieving higher
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NSR20F30NXT5G
NSR20F30/D
NSR20F30NXT5G
20F30
NSR20F30NXT5
of665
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Untitled
Abstract: No abstract text available
Text: Biased Schottky Diode Detectors BROADBAND BIASED DETECTORS DSN Series HIGH SENSITIVITY/LOW VSWR DETECTORS DQN Series 500 MHz to 26.0 GHz ♦ Fast Response Time ♦ High Sensitivity ♦ Wide Dynamic Range ♦ Coaxial ♦ Drop-In ♦ Replaceable Connectors 100 MHz to 3.5 GHz
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200mW
DTP2018M2
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