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Catalog Datasheet	MFG & Type	PDF	Document Tags
dallas date code ds1230 Abstract: 25091 e8 sot223 24446 Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 47 DS1869 A3 SEP '99 24445 9907 NSEB DJ824247ABA SOIC	Original	PDF	DS1621 DS1869 DK815282AAB DJ824247ABA DM846764AA DS2502 DS87C520 DN901118AAB DK935356AAB dallas date code ds1230 25091 e8 sot223 24446
Hyundai 9944 Abstract: nseb ds1000m-100 DS2165Q Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 DIP 300 CPS ChipPac, C 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7	Original	PDF	DS1000M-100 DS1000 DH927108AJC DS87C520 DN901118AAB Hyundai 9944 nseb DS2165Q
DS1233 a5 Abstract: e8 sot223 9915 dallas 25010 DN819 densit DS1232L ds1232l datasheet DS1869 DK815282AAB Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY DATE PRODUCT REV JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 45 DS1621 A7 SEP '99 24466 9930 ATP (Anam, PI) DK906731AAC SOIC	Original	PDF	DS1621 DK815282AAB DK906731AAC DS1869 DJ821534ABB DJ824252AAC DJ824247ABA DS1233 a5 e8 sot223 9915 dallas 25010 DN819 densit DS1232L ds1232l datasheet DS1869
fds5002 Abstract: dallas E8 24715 Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 45 DS1621 A7 SEP '99 24466 9930 ATP (Anam, PI) DK906731AAC SOIC	Original	PDF	DS1621 DS1869 DK815282AAB DK906731AAC DJ821534ABB DJ824252AAC DJ824247ABA fds5002 dallas E8 24715
DN901118AAB Abstract: c5 99 sot223 dk91 Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C2 JUN '99 24169 9915 Carsem S DM846764AA	Original	PDF	DM846764AA DM849359AC DS2502 DM849359AC DN901118AAB c5 99 sot223 dk91
ti 9919 Abstract: No abstract text available Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C2 JUN '99 24169 9915 Carsem S DM846764AA	Original	PDF	DM846764AA DM842206AL DM849359AC DS2502 DM849359AC ti 9919
DM92 Abstract: DM-92 472E-06 Text: RELIABILITY MONITOR DS1232L APR '99 MONITOR-CHIPPAC,KOREA DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1232L C2 SOIC 150 CPK ChipPac, K 9848 PROCESS Single Poly, Single Metal DL829603AAC 8 0.8 µm Standard Process JOB NO DESCRIPT	Original	PDF	DS1232L DL829603AAC DM92 DM-92 472E-06
74 HTC 00 Abstract: 74 HTC 08 DS1302 DIE REVISION Hyundai 9944 Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 300 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 PDIP CPS ChipPac, China 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%	Original	PDF	DS1000M-100 DS1000 DH927108AJC DK935356AAB J-STD-020 30C/60% 74 HTC 00 74 HTC 08 DS1302 DIE REVISION Hyundai 9944
218E-08 Abstract: ti 9919 Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY READ POINT QTY FAILS LOT NO. PACKAGE DS2502 C2 MAR '99 24153 9913 Carsem S DM842206AL	Original	PDF	DM842206AL DM846764AA DS2502 DM846764AA DM842206AL 218E-08 ti 9919