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    ATP Electronics Inc AF2GSDI-EMI002L001

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    ATP Electronics Inc AF2GSDI-EMI001L001

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    TE Connectivity PROCRIMP DIE MPQS 0.5-1.0

    Procrimp Die Mpqs 0.5-1.0 |Amp Te Connectivity PROCRIMP DIE MPQS 0.5-1.0
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    TE Connectivity 58514-1

    Crimpers / Crimping Tools CRIMPER W/DIE SET 58514-2
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    ATP Electronics Inc AF2GUDI-EMI001L001

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    DIEM Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BT 1496

    Abstract: 34N80 diode 931 p 7
    Text: HiPerFETTM Power MOSFETs Single DieMOSFET IXFN 34N80 N-Channel Enhancement Mode Avalanche Rated, High dv/dt, Low trr RDS on D S Symbol Test Conditions VDSS TJ = 25°C to 150°C 800 V VDGR TJ = 25°C to 150°C; RGS = 1 MΩ 800 V VGS VGSM Continuous Transient


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    PDF 34N80 BT 1496 34N80 diode 931 p 7

    National Telephone Services

    Abstract: No abstract text available
    Text: N DIEmentions SURVEY – GIVE US YOUR COMMENTS AND BE ELIGIBLE TO WIN AN NEC READY 120LT NOTEBOOK PC. To help keep you well informed about National’s Die Products offerings, we’d like to know a little about you and your use of die products. Please complete this survey, fax it to us at 1-207-541-6140 U.S.A. . A drawing will be held from among


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    PDF 120LT National Telephone Services

    Untitled

    Abstract: No abstract text available
    Text: HiPerFETTM Power MOSFETs Single DieMOSFET IXFN 34N80 N-Channel Enhancement Mode Avalanche Rated, High dv/dt, Low trr VDSS = 800 V ID25 = 34 A RDS on = 0.24 W D trr £ 250 ns Preliminary data sheet S Symbol Test Conditions Maximum Ratings VDSS TJ = 25°C to 150°C


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    PDF 34N80 OT-227 E153432 125OC

    Untitled

    Abstract: No abstract text available
    Text: ˜Ando Electric Co., Ltd. Korea Fxp Limted,Inc.Mr.Geary Africa 2265 Wetwood Blvd #588,Los Angeles,Ca 90064 Ando Europe B. V. Headquarters Dalsteindreef 57-77 1112 XC Diemen The Netherlands Seoul Electronics co.,Ltd. 222-2 Hongje-dong,Seodaemooon-ku,Seoul


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    PDF Honm4-5141 y1000

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing V256.17x17C 256 PLASTIC BALL GRID ARRAY PACKAGE PBGA Rev 0, 6/13 Ø0.50(3X). REF COMMON SYMBOL DIEMENSIONS 1 2 3 4 5 6 7 8 9 10 1112 13 14 15 16 Package PBGA Body Size X D 17.00 Y E 17.00 X


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    PDF 17x17C

    Untitled

    Abstract: No abstract text available
    Text:  211 N. First Street 612-849-6205 Minneapolis, MN. 55401 www.soberton.com [email protected] PRODUCT NAME ELECTRET CONDENSER MICROPHONE PART NUMBER DIEMESION TYPE EM6050P Φ6.0x5.0mm PIN APPROVED BY CHECKED BY ISSUED BY Daniel Liu Max Pong Ryan Wei 50 100


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    PDF EM6050P EM6050P-42C10 33-LF 100mm 205mm 105mm 550mm 230mm

    Untitled

    Abstract: No abstract text available
    Text: HiPerFETTM Power MOSFETs Single DieMOSFET IXFN 34N80 N-Channel Enhancement Mode Avalanche Rated, High dv/dt, Low trr VDSS = 800 V ID25 = 34 A RDS on = 0.24 W D trr £ 250 ns Preliminary data sheet S Symbol Test Conditions Maximum Ratings VDSS T J = 25°C to 150°C


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    PDF 34N80 OT-227 E153432

    34N80

    Abstract: 125OC 34N8
    Text: HiPerFETTM Power MOSFETs Single DieMOSFET IXFN 34N80 N-Channel Enhancement Mode Avalanche Rated, High dv/dt, Low trr VDSS = 800 V ID25 = 34 A RDS on = 0.24 W D trr £ 250 ns Preliminary data sheet S Symbol Test Conditions Maximum Ratings VDSS T J = 25°C to 150°C


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    PDF 34N80 34N80 125OC 34N8

    Untitled

    Abstract: No abstract text available
    Text: Cooling to keep your Key Chips Alive Guy Diemunsch Aavid Thermalloy 70 Commercial Street, Suite 200 Concord, NH 03301 USA Abstract: plenty of cooling technologies are available, they can be used to spread the heat, conduct it to or exchange it with the cold source. We


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    Peltier Thermo

    Abstract: No abstract text available
    Text: Power Thermal Solution Solutions Division Cooling to keep your Key Chips Alive Guy Diemunsch Aavid Thermalloy diemunsch[email protected] Agenda Power Thermal Solution Solutions Division From the Chip to the Fluid The story of conductivity and heat density Technologies and Heat Transfer coefficients


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    PDF

    DS32ELX0124

    Abstract: DS32ELX0421 HDMI Fiber HDMI to SDI serializer AN-1887
    Text: National Semiconductor Application Note 1887 Nate Unger, Rodger Diemer September 12, 2008 1.0 Introduction During initialization, the data valid line to the serializer is set high. This sends IDLE characters from the serializer to the deserializer over each link. In response, the deserializer sets


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    PDF AN-1887 DS32ELX0124 DS32ELX0421 HDMI Fiber HDMI to SDI serializer AN-1887

    VFIR

    Abstract: TFDU4300 TFBS4711 TFBS5614 TFBS5617 TFBS5711 TFBS6614 TFDU4100 TFDU5103 TFDU5107
    Text: VISHAY Vishay Semiconductors Transceivers for Every Application Product Diemensions LxWxH Pins mm3 Pad Pitch Idle Shutdown Supply Current Current Transmit Distance Operating Voltage Logic Voltage Supply (V) (mm) (mA) (µA) (m) (V) Features Transceivers Recommended for New Designs


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    PDF TFDU4100 TFDU4300 TFBS4711 TFDU8108 OIM4232 14-May-04 VFIR TFDU4300 TFBS4711 TFBS5614 TFBS5617 TFBS5711 TFBS6614 TFDU4100 TFDU5103 TFDU5107

    RAMB16BWERs

    Abstract: AN1971 SPARTAN-3A 1800 SMPTE-424 digital clock using gates C259C digital clock using logic gates SPARTAN-3A DSP 1800A Xilinx Spartan 6 Eval Kit sdi converter
    Text: National Semiconductor Application Note 1971 Rod Diemer, Nate Unger May 6, 2009 Introduction HD portion of SMPTE 299. Below is a list of SDXILEVK FPGA IP features. • Standalone video generator with internal test patterns and standalone video termination


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    PDF LMH0340 AN-1971 RAMB16BWERs AN1971 SPARTAN-3A 1800 SMPTE-424 digital clock using gates C259C digital clock using logic gates SPARTAN-3A DSP 1800A Xilinx Spartan 6 Eval Kit sdi converter

    F-SW32

    Abstract: Sn96 soldering wire
    Text: ssAc 2010 SMD- Lötdrahtfür feinsteLötstellenmit 3 Metallen:Zinn - Silber - KuPfer SMD Solderingwire for smallestsoldering jointswith 3 metals:tin - silver- copper der Bauteileerschwert DieMiniaturisierung im von Kleinstbauteilen das Reoarieren Handlötbereich.


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    PDF 2010istvergleichbar SSAC2010 F-SW32 Sn96 soldering wire

    SMT pitch roadmap

    Abstract: bare die
    Text: N DEDICATED W elcome to National Semiconductor’s DIEmentions. Within these pages is information on how National is supporting the growing need for bare die, Known Good Die KGD , flexible processing flows, and assorted shipping carriers. In DIEmentions will be the latest information on die and packaging availability. There will be


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    Untitled

    Abstract: No abstract text available
    Text: TL2218-285, TL2218-285Y EXCALIBUR CURRENT-MODE SCSI TERMINATOR SLVS072C – DECEMBER 1992 – REVISED OCTOBER 1995 available features • • • • • • • • Fully Integrated 9-Channel SCSI Termination No External Components Required Maximum Allowed Current Applied at First


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    PDF TL2218-285, TL2218-285Y SLVS072C TL2218-285

    XP1073-BD

    Abstract: xp1073 DM6030HK XP107
    Text: 34.0-37.0 GHz GaAs MMIC Power Amplifier P1073-BD February 2010 - Rev 16-Feb-10 Features Ka-Band 6W Power Amplifier 22.0 dB Small Signal Gain +37.0 dBm Pulsed Saturated Output Power 24% Power Added Efficiency PAE % 100% On-Wafer RF, DC and Output Power Testing


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    PDF P1073-BD 16-Feb-10 MIL-STD-883 XP1073-BD XP1073-BD xp1073 DM6030HK XP107

    Untitled

    Abstract: No abstract text available
    Text: TL2218-285, TL2218-285Y EXCALIBUR CURRENT-MODE SCSI TERMINATOR SLVS072C – DECEMBER 1992 – REVISED OCTOBER 1995 available features • • • • • • • • Fully Integrated 9-Channel SCSI Termination No External Components Required Maximum Allowed Current Applied at First


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    PDF TL2218-285, TL2218-285Y SLVS072C

    Untitled

    Abstract: No abstract text available
    Text: r-0• 2E6TÖ88E09T 2EIOMUM0 «esCHOTZT M KM C O Pm C H T »990 TECHNISCHEM « » T SCHRiTT DIEMEN. 0 E - A/#> DEUTSCHLAHO «M9N A U E flCCKTi VOMEHJU.TEM Q D 1 pm POLZ. »HO L±Q. 4 « am * HAi. t£H Wtft UNS VOR K *Lftft£ «OtfUSE «DREHT A ’ 4 5


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    PDF 88E09T L0TSE17E»

    Untitled

    Abstract: No abstract text available
    Text: REVISIONS SYM ZO NE EC N , D K1 Q JO1 00 ERN PLATING NO. REVISED ADD DIEMNSIONS FOR SHIELD BOARD LOCK E APPRD. DATE L.C. A ug4/09 JUL25/12 S.MUGAN '-L 0 O .9 2 ± O . 0 5 !i [0 .0 3 6 ± .0 0 2 ] \ - 0 - \ O . 1 O \ w \ H 0 L E 4 R E Q 'D 0 2 .3 O ± O .O 5


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    PDF ug4/09 JUL25/12 JUL31

    A76 battery

    Abstract: 0B4 DC-DC
    Text: in ix Y s HiPerFET Power MOSFETs Single DieMOSFET ix f n 34N80 V.DSS I D25 RDS on N-Channel Enhancement Mode Avalanche Rated, High dv/dt, Lowtrr = 800 V = 34 A = 0.24 f t trr <250 ns Preliminary data sheet Symbol Test Conditions V„ss Vocn Tj =25°C to 150°C


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    PDF 34N80 A76 battery 0B4 DC-DC

    Untitled

    Abstract: No abstract text available
    Text: Ì 4 NICHT 5IND VERMASSTE KANTEN N I C HT MAßSTÄBLICH ÄNDERUNGEN N ISCHEN BEHALTEN X IN LZ Ln PO PRO L CD 1RF I HEI CM CO +0. 3 - . 1 D IE DE M UNS 2 ZEICHNUNG TECH­ FO RTSC H RITT W IR Í 3 GESCHÜTZT (C^COPY'R I G H T DIEM EN, AMR VOR ALLE DEUTSCHLAND


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    PDF AMP-EN-554 AH5200 G02U51 DEPT5200 AH5200 K829576

    Untitled

    Abstract: No abstract text available
    Text: MOLDED DIALLYL INSULATED TERMINALS DIALLYL PHTHALATE INSULATED TERMINALS M A T E R IA L S : D-:ai:yl P d h T a ts is recom m ended f ' co n tin u o u s d u ty tem ps up to 350° F . i t has a hiqh diem ctr breakdow n and nas r; 94 VO U P auny. T e rm in a l: Brass per QQ-B-626. A lloy 360


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    PDF QQ-B-626.

    Untitled

    Abstract: No abstract text available
    Text: □ IXYS H H ifl JL æ* X HiPerFET Power MOSFETs Single DieMOSFET ix f n 34N80 v , DSS ^D25 N-Channel Enhancement Mode Avalanche Rated, Highdv/dt, Lowtrr R DS on = 800 V = 34 A = 0.24 Q trr < 250 ns Preliminary data sheet Maximum Ratings Symbol Test C onditions


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    PDF 34N80 OT-227 E153432