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    DIE PADDLE Search Results

    DIE PADDLE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    ISL70062SEHX/SAMPLE Renesas Electronics Corporation Radiation Hardened 10A NMOS Load Switch, DIE, /Die Waffle Pack Visit Renesas Electronics Corporation
    ISL70061SEHX/SAMPLE Renesas Electronics Corporation Radiation Hardened 10A PMOS Load Switch, DIE, /Die Waffle Pack Visit Renesas Electronics Corporation
    ISL73062SEHX/SAMPLE Renesas Electronics Corporation Radiation Hardened 10A NMOS Load Switch, DIE, /Die Waffle Pack Visit Renesas Electronics Corporation
    ISL73061SEHX/SAMPLE Renesas Electronics Corporation Radiation Hardened 10A PMOS Load Switch, DIE, /Die Waffle Pack Visit Renesas Electronics Corporation
    HS0-26CT31RH-Q Renesas Electronics Corporation Radiation Hardened Quad Differential Line Drivers, DIE, / Visit Renesas Electronics Corporation

    DIE PADDLE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    lqfp 64 Shipping Trays

    Abstract: DS310H
    Text: LEADFRAME data sheet Multi-Chip & Stacked-Die Leadframe Packages Features: Multi-Chip Package MCP & Stacked-Die Leadframe Package Amkor's multi-chip package and stacked-die leadframe designs enable package level integration in a low cost, leadframe-based form factor. Leveraging


    Original     		PDF

    3w high power white led driver circuit diagram

    Abstract: LM3404 LM3404HV psop-8 CMSH2-60 LM3404HVMA LM3404HVMR SLF10145T-470M1R4
    Text: National Semiconductor Application Note 1629 Chris Richardson May 2007 Introduction ible PSOP-8 package with an exposed thermal pad also called a die-attach paddle, or DAP will be compared to help the user estimate the die temperature under various conditions, and determine which package is best for their application.


    Original     		PDF LM3404HV AN-1629 3w high power white led driver circuit diagram LM3404 psop-8 CMSH2-60 LM3404HVMA LM3404HVMR SLF10145T-470M1R4

    Multicore 96SC

    Abstract: 96SC soldering temperature CR32 recommended reflow profile LPCC2x2 multicore solder paste CR32 JEDEC SMT reflow profile 629002 5988-7963EN multicore solder paste 2C
    Text: The LPCC2x2 Package Application Note 1316 1. Introduction Avago’s LPCC2x2 package is a highly thermal efficient leadless package offering improved RF response over a wide operating frequency, DC - 6 GHz. The exposed die-attach paddle acts as a device grounding, heat


    Original     		PDF 5988-7963EN Multicore 96SC 96SC soldering temperature CR32 recommended reflow profile LPCC2x2 multicore solder paste CR32 JEDEC SMT reflow profile 629002 multicore solder paste 2C

    SA58670ABS

    Abstract: SA58670A 741 IC data sheet IC 741 data sheet pdf of 741 ic portable dvd player schematic diagram of video 8 channel audio amplifier circuit diagram 1 W stereo amplifier class d power amplifier data sheet IC 741
    Text: SA58670A 2.1 W/channel stereo class-D audio amplifier Rev. 02 — 23 October 2008 Product data sheet 1. General description The SA58670A is a stereo, filter-free class-D audio amplifier which is available in an HVQFN20 package with the exposed Die Attach Paddle DAP .


    Original     		PDF SA58670A SA58670A HVQFN20 SA58670ABS 741 IC data sheet IC 741 data sheet pdf of 741 ic portable dvd player schematic diagram of video 8 channel audio amplifier circuit diagram 1 W stereo amplifier class d power amplifier data sheet IC 741

    Untitled

    Abstract: No abstract text available
    Text: SA58670 2.1 W/channel stereo class-D audio amplifier Rev. 03 — 11 June 2009 Product data sheet 1. General description The SA58670 is a stereo, filter-free class-D audio amplifier which is available in an HVQFN20 package with the exposed Die Attach Paddle DAP .


    Original     		PDF SA58670 SA58670 HVQFN20

    Untitled

    Abstract: No abstract text available
    Text: SA58670A 2.1 W/channel stereo class-D audio amplifier Rev. 02 — 23 October 2008 Product data sheet 1. General description The SA58670A is a stereo, filter-free class-D audio amplifier which is available in an HVQFN20 package with the exposed Die Attach Paddle DAP .


    Original     		PDF SA58670A SA58670A HVQFN20

    jedec package MO-247

    Abstract: qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline
    Text: Application Note AC322 Assembly and PCB Layout Guidelines for QFN Packages Introduction The dual-row or multi-row QFN package is a near Chip Scale, plastic-encapsulated package with a copper leadframe substrate. The exposed die attach paddle on the bottom efficiently conducts heat to the PCB


    Original     		PDF AC322 jedec package MO-247 qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline

    Untitled

    Abstract: No abstract text available
    Text: SA58670 2.1 W/channel stereo class-D audio amplifier Rev. 02 — 23 October 2008 Product data sheet 1. General description The SA58670 is a stereo, filter-free class-D audio amplifier which is available in an HVQFN20 package with the exposed Die Attach Paddle DAP .


    Original     		PDF SA58670 SA58670 HVQFN20

    SA58670

    Abstract: SA58670BS portable dvd player schematic diagram of video HVQFN20 MO-220
    Text: SA58670 2.1 W/channel stereo class-D audio amplifier Rev. 03 — 11 June 2009 Product data sheet 1. General description The SA58670 is a stereo, filter-free class-D audio amplifier which is available in an HVQFN20 package with the exposed Die Attach Paddle DAP .


    Original     		PDF SA58670 SA58670 HVQFN20 SA58670BS portable dvd player schematic diagram of video MO-220

    741 IC data sheet

    Abstract: portable dvd player schematic diagram of video class-d amplifier IC 741 data sheet pin diagram of ic 741 AUX0025 HVQFN20 MO-220 SA58670ABS AP-585
    Text: SA58670A 2.1 W/channel stereo class-D audio amplifier Rev. 01 — 20 February 2008 Product data sheet 1. General description The SA58670A is a stereo, filter-free class-D audio amplifier which is available in an HVQFN20 package with the exposed Die Attach Paddle DAP .


    Original     		PDF SA58670A SA58670A HVQFN20 741 IC data sheet portable dvd player schematic diagram of video class-d amplifier IC 741 data sheet pin diagram of ic 741 AUX0025 MO-220 SA58670ABS AP-585

    portable dvd player

    Abstract: portable dvd player schematic diagram of video HVQFN20 MO-220 SA58670 SA58670BS portable dvd player schematic diagram
    Text: SA58670 2.1 W/channel stereo class-D audio amplifier Rev. 01 — 4 January 2008 Product data sheet 1. General description The SA58670 is a stereo, filter-free class-D audio amplifier which is available in an HVQFN20 package with the exposed Die Attach Paddle DAP .


    Original     		PDF SA58670 SA58670 HVQFN20 portable dvd player portable dvd player schematic diagram of video MO-220 SA58670BS portable dvd player schematic diagram

    HVQFN20

    Abstract: MO-220 SA58670 SA58670BS sot917 portable dvd player power supply
    Text: SA58670 2.1 W/channel stereo Class D audio amplifier Rev. 01 — 22 June 2007 Objective data sheet 1. General description The SA58670 is a stereo, filter-free Class D audio amplifier which is available in an HVQFN20 package with the exposed Die Attach Paddle DAP .


    Original     		PDF SA58670 SA58670 HVQFN20 MO-220 SA58670BS sot917 portable dvd player power supply

    30392

    Abstract: ALM-1106 stencil Layout JEDEC SMT reflow profile stencil
    Text: ALM-1106 MCOB Package Packge Application Note 5282 Introduction PCB Land Pattern and Stencil Design Avago Technologies’s ALM-1106 MCOB 2.0x2.0x1.1mm is an economical , easy to use GaAs MMIC GPS Low Noise Amplifier LNA with bypass and Shutdown mode. The exposed die-attach paddle acts as device grounding,


    Original     		PDF ALM-1106 ALM-1106 AV01-0246EN 30392 stencil Layout JEDEC SMT reflow profile stencil

    Class-AB

    Abstract: Class AB SOT909-1 SA58631 SA58631TK HVSON8
    Text: NXP 3-W Class AB, BTL audio amplifier SA58631 Audio amplifier for portable applications This single-channel audio amplifier provides a power output of 3 W with an 8-Ω load using a 9-V supply. Housed in an HVSON8 package with an exposed die-attach paddle, it delivers


    Original     		PDF SA58631 Class-AB Class AB SOT909-1 SA58631 SA58631TK HVSON8

    A3P1000

    Abstract: 160 e7 Datasheet A3P125 FBGA A3P250 A3P030 FBGA A3P600
    Text: ProASIC3 Packaging 3 – Package Pin Assignments 48-Pin QFN Pin 1 48 1 Notes: 1. This is the bottom view of the package. 2. The die attach paddle center of the package is tied to ground GND . Note For Package Manufacturing and Environmental information, visit the Resource Center at


    Original     		PDF 48-Pin A3P030 IO82RSB1 IO24RSB0 GEC0/IO73RSB1 IO22RSB0 GEA0/IO72RSB1 A3P1000 160 e7 Datasheet A3P125 FBGA A3P250 FBGA A3P600

    A3P060

    Abstract: A3P125 A3P400 A3P030 FBGA A3P600 A3P1000
    Text: ProASIC3 Packaging 3 – Package Pin Assignments 48-Pin QFN Pin 1 48 1 Notes: 1. This is the bottom view of the package. 2. The die attach paddle center of the package is tied to ground GND . Note For Package Manufacturing and Environmental information, visit the Resource Center at


    Original     		PDF 48-Pin A3P030 IO82RSB1 IO24RSB0 GEC0/IO73RSB1 IO22RSB0 GEA0/IO72RSB1 A3P060 A3P125 A3P400 FBGA A3P600 A3P1000

    actel vqfp

    Abstract: IO87RSB1
    Text: ProASIC3 nano Packaging 3 – Package Pin Assignments 48-Pin QFN Pin 1 48 1 Notes: 1. This is the bottom view of the package. 2. The die attach paddle of the package is tied to ground GND . Note For Package Manufacturing and Environmental information, visit the Resource Center at


    Original     		PDF 48-Pin A3PN010 GEC0/IO37RSB1 IO06RSB0 IO36RSB1 GDA0/IO05RSB0 GEA0/IO34RSB1 actel vqfp IO87RSB1

    G43-87

    Abstract: AN9207 G42-88
    Text: Temperature Considerations Application Note January 1994 AN9207 Junction Temperature Once the designer has selected an IC and calculated the clock frequency that meets the needs of the application, the operating temperature of the die junction temperature must


    Original     		PDF AN9207 G43-87 AN9207 G42-88

    land pattern for DFN

    Abstract: "exposed pad" PCB via QFN PACKAGE Junction to PCB thermal resistance "thermal via" qfn44 QFN PACKAGE thermal resistance AN-121 QFN footprint DFN PACKAGE thermal resistance QFN44-24
    Text: AN-121 Application Note Mounting Considerations for Exposed-Paddle Packages Introduction Many of AnalogicTech's products incorporate exposed paddles in their packages. The exposed paddle or exposed pad packages operationally decrease the thermal resistance, thereby providing superior heat dissipation from the die. The packages fall into two main categories: quad LLP leadless lead frame package QFN


    Original     		PDF AN-121 AN-121 land pattern for DFN "exposed pad" PCB via QFN PACKAGE Junction to PCB thermal resistance "thermal via" qfn44 QFN PACKAGE thermal resistance QFN footprint DFN PACKAGE thermal resistance QFN44-24

    QFN-6x6 0.5mm

    Abstract: QFN-6x6 48 qfn 6x6 foot print qfn 44 PACKAGE footprint qfn stencil AN3111
    Text: AN3111 Rev 3, 07/2008 Freescale Semiconductor Application Note Soldering the QFN Stacked Die Sensors to a PC Board by: Dave Mahadevan, Russell Shumway, Thomas Koschmieder, Cheol Han, Kimberly Tuck, John Dixon Sensor and Actuator Solutions Division Tempe, Arizona


    Original     		PDF AN3111 QFN-6x6 0.5mm QFN-6x6 48 qfn 6x6 foot print qfn 44 PACKAGE footprint qfn stencil AN3111

    mark AT0

    Abstract: 676-Pin B27 QFN ACTEL FBGA 144 R13NC IO30PDB1V1 IO06PDB0V1 IO10PDB0V1 AFS090
    Text: Actel Fusion Mixed-Signal FPGAs 4 – Package Pin Assignments 108-Pin QFN A44 A56 B41 B52 Pin A1 Mark A1 A43 B40 B1 B13 A14 B27 A29 B26 B14 A28 A15 Note: The die attach paddle center of the package is tied to ground GND . Note For Package Manufacturing and Environmental information, visit the Resource Center at


    Original     		PDF 108-Pin AFS090 GCB1/IO35PDB1V0 GAA2/IO52PDB3V0 mark AT0 676-Pin B27 QFN ACTEL FBGA 144 R13NC IO30PDB1V1 IO06PDB0V1 IO10PDB0V1

    IO01

    Abstract: mark AT0 IO30PDB1V1 IO06PDB0V1 IO10PDB0V1
    Text: Actel Fusion Mixed-Signal FPGAs 4 – Package Pin Assignments 108-Pin QFN A44 A56 B41 B52 Pin A1 Mark A1 A43 B40 B1 B13 A14 B27 A29 B26 B14 A28 A15 Note: The die attach paddle center of the package is tied to ground GND . Note For Package Manufacturing and Environmental information, visit the Resource Center at


    Original     		PDF 108-Pin AFS090 GCB1/IO35PDB1V0 GAA2/IO52PDevice IO01 mark AT0 IO30PDB1V1 IO06PDB0V1 IO10PDB0V1

    IR 423f

    Abstract: 30392 stencil Layout AV01-0210EN stencil MGA-635T6 JEDEC SMT reflow profile solder powder a/IR 423f
    Text: MGA-635T6 UTSLP Package Application Note 5278 Introduction PCB Land Pattern and Stencil Design Avago Technologies's MGA-635T6 UTSLP 2x1.3x0.4 is an economical ,easy to use GaAs MMIC GPS Low Noise Amplifier LNA with bypass and Shutdown mode. The exposed die-attach


    Original     		PDF MGA-635T6 AV01-0210EN IR 423f 30392 stencil Layout stencil JEDEC SMT reflow profile solder powder a/IR 423f

    aws duplexer

    Abstract: 12M05019A73 019 triquint TQP4M3019 laser diode marking code
    Text: TQP4M3019 Data Sheet SP3T High Power 2.6V 2x2 mm CDMA Antenna Switch Functional Block Diagram Features • • • • • • • • • • Product Description pHEMT GaAs MMIC Die Excellent Cross-Modulation Performance 108 dBm Typ @Cellular 106 dBm @AWS


    Original     		PDF TQP4M3019 TQP4M3019 aws duplexer 12M05019A73 019 triquint laser diode marking code