DH50206 Search Results

DH50206 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
DH50206		Temex	MICROWAVE SILICON COMPONENTS		Original	PDF

DH50206 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
RSF 800 Abstract: F27D EH50151 DH50204 EH50204 DH50156 M208 Text: SILICON PIN DIODES Microwave applications FAST SWITCHING SILICON PIN DIODES Description For fast switching, these passivated mesa diodes have a medium I layer < 50 µm . Electrical characteristics CHIP DIODES L CHIP E AND C PACKAGED T R IDIODES C A E Characteristics Gold Breakdown Junction	Original	PDF	EH50151 EH50152 EH50153 EH50154 EH50155 EH50156 EH50157 EH50201 EH50202 EH50203 RSF 800 F27D DH50204 EH50204 DH50156 M208
EH76150 die Abstract: DH252 DH256 all diodes ratings step recovery diode dh252 temex dh292 DH315 DH303 DH324 DH312 Text: SILICON MICROWAVE DIODES Step Recovery Diodes MICROWAVE SILICON MICROWAVE DIODES STEP RECOVERY DIODES All the detail specification shall be read in conjunction with ESA/SCC Generic Specification N° 5010, the special requirements are included in the detail specification.	Original	PDF	ESA/SCC5512/016 DH252 DH256 DH292 DH267 ESA/SCC5512/016 EH76150 die DH252 DH256 all diodes ratings step recovery diode dh252 temex dh292 DH315 DH303 DH324 DH312
DH80102 Abstract: DH80106 DH80050 DH80052 Text: SILICON PIN DIODES Square ceramic surface mountable PIN diodes MICROWAVE SQUARE CERAMIC SURFACE MOUNTABLE PIN DIODES Description These PIN diodes are manufactured in a square package SMD for surface mount applications. These packages utilize ceramic package technology with low inductance and axial terminations. This design	Original	PDF	DH50107 DH50205 DH50206 DH50209 DH80050 DH80051 DH80052 DH80053 DH80082 DH80100 DH80102 DH80106
M208 Abstract: No abstract text available Text: SILICON PIN DIODES Microwave applications Fast switching silicon PIN diodes Description For fast switching, these passivated mesa diodes have a medium I layer < 50 µm . Electrical characteristics CHIP DIODES E L CHIP E AND C PACKAGED T R IDIODES C A Characteristics Gold Breakdown Junction	Original	PDF	EH50151 EH50152 EH50153 EH50154 EH50155 EH50156 EH50157 EH50201 EH50202 EH50203 M208
sqm1150 Abstract: smd diode f54 sqm1250 DH60034 srd dh294 bh16 transistor step recovery diode dh252 temex DH252 M208 B1 DH294 Text: MICROWAVE SILICON COMPONENTS Contents MICROWAVE SILICON COMPONENTS CONTENTS CONTENTS w e N f o t i y Spir nolog Tech PAGE INTRODUCTION / SYMBOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-2 All specifications contained in that catalog are subject to change without notice.	Original	PDF
Untitled Abstract: No abstract text available Text: SILICON PIN DIODES Microwave applications FAST SWITCHING SILICON PIN DIODES Description For fast switching, these passivated mesa diodes have a medium I layer < 50 µm . Electrical characteristics CHIP DIODES L CHIP E AND C PACKAGED T R IDIODES C A E Characteristics Gold Breakdown Junction	Original	PDF	BH142 EH50256, EH50404 EH50405