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    CC44 Search Results

    CC44 Result Highlights (1)

    Part ECAD Model Manufacturer Description Download Buy
    UCC44273DBVR Texas Instruments 4-A/4-A single-channel low-side gate driver with 5-V UVLO 5-SOT-23 -40 to 140 Visit Texas Instruments
    SF Impression Pixel

    CC44 Price and Stock

    KEMET Corporation R82CC4470Z330J

    CAP FILM 4.7UF 5% 50VDC RADIAL
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    DigiKey R82CC4470Z330J Bulk 4,935 1
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    Mouser Electronics R82CC4470Z330J 5,647
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    TME R82CC4470Z330J 750
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    KEMET Corporation R82CC4470AA30J

    CAP FILM 4.7UF 5% 50VDC RADIAL
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    DigiKey R82CC4470AA30J Bulk 4,389 1
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    Mouser Electronics R82CC4470AA30J 3,950
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    Newark R82CC4470AA30J Bulk 1,404 1
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    Adam Technologies Inc PLCC-44-AT-SMT

    PLCC SOCKET 44P SMT
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    DigiKey PLCC-44-AT-SMT Tube 3,341 1
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    Master Electronics PLCC-44-AT-SMT 2,602
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    New Advantage Corporation PLCC-44-AT-SMT 12,950 1
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    Citizen Finedevice Co Ltd CSX-750FCC44000000T

    XTAL OSC XO 44.0000MHZ CMOS TTL
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    DigiKey CSX-750FCC44000000T Cut Tape 2,961 1
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    CSX-750FCC44000000T Reel 2,000 1,000
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    Texas Instruments UCC44273DBVR

    4-A/4-A SINGLE-CHANNEL LOW-SIDE
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    DigiKey UCC44273DBVR Cut Tape 2,478 1
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    Mouser Electronics UCC44273DBVR 5,879
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    Find more CC44 price and stock on Findchips.com

    CC44 Datasheets (8)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    CC4408-000 TE Connectivity Raychem Cable Protection Cables, Wires - Management - Labels, Labeling - HEATSHRNK 19.0MM PRESCORE BLU Original PDF
    CC4427-000 TE Connectivity Cables, Wires - Management - Heat Shrink Boots, Caps - STD POLY MOLDED PARTS Original PDF
    CC4445 Unknown Semiconductor Master Cross Reference Guide Scan PDF
    CC4445 Unknown Basic Transistor and Cross Reference Specification Scan PDF
    CC4445 Unknown Shortform Datasheet & Cross References Data Short Form PDF
    CC4446 Unknown Semiconductor Master Cross Reference Guide Scan PDF
    CC4446 Unknown Shortform Datasheet & Cross References Data Short Form PDF
    CC4471-000 TE Connectivity Cables, Wires - Management - Heat Shrink Boots, Caps - BLOW-MOLDED PARTS Original PDF

    CC44 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CC44

    Abstract: xilinx cc-44
    Text: R PK064 v1.0 October 28, 2002 Ceramic Chip Carrier (CC44) Package 2002 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.


    Original     		PDF PK064 CC44 xilinx cc-44

    VQFP44 package

    Abstract: isp Cable Version 3.0 VQ44 XQR18V04 XQVR1000 XQVR300 XQVR600 fpga radiation XQR2V1000 XQR18V04VQ44N
    Text: QPro XQR18V04 Radiation Hardened 4Mbit QML ISP Configuration Flash PROM R DS082 v1.4 December 15, 2003 5 Features • Description Operating Temperature Range: –55° C to +100° C MeV/cm2/mg • Latch-Up Immune to LET >120 • Guaranteed TID of 30 kRad(Si) per spec 1019.5


    Original     		PDF XQR18V04 DS082 CascadV04CC44M XQR18V04CC44V XQR18V04VQ44N XQ18V04. VQFP44 package isp Cable Version 3.0 VQ44 XQVR1000 XQVR300 XQVR600 fpga radiation XQR2V1000 XQR18V04VQ44N

    18V04

    Abstract: XQ18V04 600E VQ44 XQR18V04 XQV100 18V00
    Text: QPRO XQ18V04 XQR18V04 QML In-System Programmable Configuration PROMs R DS082 (v1.1) July 27, 2001 5 Preliminary Product Specification Features Description • Xilinx introduces the QPro XQ18V04 and XQR18V04 series of in-system programmable and radiation hardenned


    Original     		PDF XQ18V04 XQR18V04) DS082 XQ18V04 XQR18V04 44-pin 18V04 600E VQ44 XQR18V04 XQV100 18V00

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    xilinx pq-160

    Abstract: xcs20 316 SO8 XC95 XC95144XL XC95144XL prom XC1700 XC4000XV XC40110XV XC40150XV
    Text: Device Selection Guide 384 600 864 1,176 1,536 2,400 3,456 4,704 6,144 1,536 2,400 3,456 4,704 6,144 9,600 13,824 18,816 24,576 180 196 260 284 324 404 500 510 510 see note 2 Total CLBs Total CLBs Total Flip-Flops Max. I/O Package 196 400 576 1,024 1,024


    Original     		PDF

    XQR18V04

    Abstract: XQVR1000 XQVR300 XQVR600 SelectMAP Out-14 CC-44 XQR2V1000
    Text: R < B L QPro XQR18V04 Radiation-Tolerant 4-Mbit QML ISP Configuration Flash PROM DS082 v1.6 March 15, 2007 Product Specification Features • Operating temperature range: –55°C to +100°C • IEEE STD 1149.1 Boundary-Scan (JTAG) support • Program/erase temperature range: 0°C to +85°C


    Original     		PDF XQR18V04 DS082 XQ18V04. UG112, XQVR1000 XQVR300 XQVR600 SelectMAP Out-14 CC-44 XQR2V1000

    fpga radiation

    Abstract: XAPP185 HW-130 XQR1704L XQR4013XL XQR4036XL XQ1701LCC44B 1704L XQR4000XL XQR4
    Text: QPRO Series Configuration PROMs XQ including Radiation-Hardened Series (XQR) R DS062 (v2.0) June 1, 2000 2 Advance Product Specification Features Description • Configuration one-time programmable (OTP) read-only memory designed to store configuration bitstreams of


    Original     		PDF DS062 XQ1701L XQ1704L XQR1701L XQR1704L 1019line 44-pin MIL-PRF-38535 XQR1704LCC44M fpga radiation XAPP185 HW-130 XQR4013XL XQR4036XL XQ1701LCC44B 1704L XQR4000XL XQR4

    HN27C4096HG

    Abstract: HN27C4096HG-85 HN27C4906HCC-85 cm218
    Text: HN27C4096HG/HCC Series 262,144-word x 16-bit CMOS UV Erasable and Programmable ROM Description HN27C4096HG/HCC is a 4-Mbit ultraviolet erasable and electrically programmable ROM, featuring high speed and low power dissipation. Fabricated on advanced fine process and high speed circuitry technique, the


    Original     		PDF HN27C4096HG/HCC 144-word 16-bit 16bit 32-bit 40-pin 44-pin. HN27C4096HG HN27C4096HG-85 HN27C4906HCC-85 cm218

    HN27C4096AG-12

    Abstract: HN27C4096ACC-10 HN27C4096AG-10 HN27C4096A HN27C4096ACC-12 HN27C4096ACC-15 HN27C4096AG-15 CC44 Hitachi DSA00314
    Text: HN27C4096AG/ACC Series 262144-word x 16-bit CMOS UV Erasable and Programmable ROM Description The Hitachi HN27C4096AG/ACC is a 4-Mbit ultraviolet erasable and electrically programmable ROM, featuring high speed and low power dissipation. Fabricated on advanced fine process and high speed circuitry


    Original     		PDF HN27C4096AG/ACC 262144-word 16-bit HN27C4096A 16-bit HN27C4096A cerdip-40pin JLCC-44pin. ns/120 HN27C4096AG-12 HN27C4096ACC-10 HN27C4096AG-10 HN27C4096ACC-12 HN27C4096ACC-15 HN27C4096AG-15 CC44 Hitachi DSA00314

    IC51-128

    Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
    Text: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials


    Original     		PDF

    CC44

    Abstract: packages
    Text: Package Drawings February 2, 1999 Version 1.3 11 R Package Drawings Ceramic DIP Package - DD8 11-24 February 2, 1999 (Version 1.3) R Package Drawings Plastic DIP Package - PD8 11 February 2, 1999 (Version 1.3) 11-25 R Package Drawings SOIC and TSOP Packages - SO8, VO8


    Original     		PDF CB164 XC3000) CB100, CB164, CB196 XC4000 CB228 FG256 FG456 FG680 CC44 packages

    1156-BALL

    Abstract: bga 896 411PI BF957 132-ball package
    Text: DataSource CD-ROM Q1-02 Contents Package Drawings Products Guide Product Data Sheets Package Drawings Packaging and Thermal Characteristics Application Notes White Papers Software/Hardware Manuals Xcell Journal Online Xcell Journal Archives Inside Out Columns


    Original     		PDF Q1-02 XAPP415 CG1156 CB100 CB164 CB196 CB228 PG120 PG132 PG156 1156-BALL bga 896 411PI BF957 132-ball package

    XC2S200

    Abstract: XCV1000E
    Text: Reference QPRO QPRO QML-Certified FPGAs and PROMs The Xilinx QPRO family of Radiation Hardened FPGAs and PROMs are finding homes in many new satellite and space applications. Both the XQR4000XL and XQVR Virtex products are being designed into space systems that will utilize reconfigurable technology. Numerous communications and GPS satellites, space probe, and


    Original     		PDF XQR4000XL XCV1000E XCV3200E XCV405EM XCV812EM XC2S200) XC9500 XC4000E/L/EX XC4000XL/XLA XC4020) XC2S200

    MIL-PRF-35835

    Abstract: MIL-PRF-38585
    Text: Reference QPRO QML Certified FPGAs X in production for an extended time. ilinx is the leading suppler of HighReliability programmable logic devices to the aerospace and defense markets. These devices are used in a wide range of applications such as electronic warfare, missile guidance and targeting, RADAR, SONAR, communications, signal processing, avionics, and satellites. The Xilinx QPRO family of ceramic and


    Original     		PDF MIL-PRF-38585, 10K-30K 22K-65K 40K-130K 55K-180K 72K-109K 176K-323K 365K-661K 622K-1 24x24 MIL-PRF-35835 MIL-PRF-38585

    sony ps3 eye camera

    Abstract: 6d40 engine diagram sgx530* vector graphics manual dsi CVBS BTA 16 6008 PowerVR SGX series 5 "cmos camera "mc 7258 wiring diagram ccd camera mc 7218 wiring diagram ET 439 power module fuji
    Text: Public Version AR Y OMAP OMAP34xx Multimedia Device Silicon Revision 3.1, 3.1.1 Texas Instruments OMAP™ Family of Products EL IM IN Version R PR Technical Reference Manual Literature Number: SWPU114R July 2007 – Revised April 2009 Public Version www.ti.com


    Original     		PDF OMAP34xx SWPU114R sony ps3 eye camera 6d40 engine diagram sgx530* vector graphics manual dsi CVBS BTA 16 6008 PowerVR SGX series 5 "cmos camera "mc 7258 wiring diagram ccd camera mc 7218 wiring diagram ET 439 power module fuji

    HT 1200-4

    Abstract: YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341
    Text: Hitachi Semiconductor Package Data Book ADE–410–001B 3rd Edition March/97 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional


    Original     		PDF March/97 HT 1200-4 YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341

    XAPP185

    Abstract: XQR4000XL rad hard PROM Single Event Latchup FPGA X318
    Text: XQR1700L QPRO Series Radiation Hardened Serial Configuration PROMs R DS062 v1.0 April 20, 2000 8* Advance Product Specification Features Description • The XQR1701L and XQR1704L are Xilinx 3.3v series high density, radiation hardened serial configuration PROMs


    Original     		PDF XQR1700L DS062 XQR4000XL/Virtex exce30 200mV 1701L 44-Pin MIL-PRF-38535 1704L 1701L XAPP185 XQR4000XL rad hard PROM Single Event Latchup FPGA X318

    Untitled

    Abstract: No abstract text available
    Text: 40303.06 FSWLD 3/11/02 3:45 PM Page 237 Cable to Cable CC4 Cat. No. B • Stranded Conductor • Solid Circular Conductor A 4 2 2 solid 1 1/0 2/0 3/0 4/0 250 300 350 350 500 2002 Thomas & Betts Corporation. Specifications are subject to change without notice.


    Original     		PDF 45RTB 65RTB 90RTB

    1702L

    Abstract: 17512L HW-130 XC1701 XC1701L XC1702L XC1704L XC17512L XC4020 1704L
    Text: XC1700L Series High Density Serial Configuration PROMs Including XQ1701L QPROTM Series R January 27, 1999 Version 2.2 8* Product Specification Features Description • The XC1704L, XC1702L, XC1701L, and the XC17512L are Xilinxs 3.3V series of high density serial configuration


    Original     		PDF XC1700L XQ1701L XC1704L, XC1702L, XC1701L, XC17512L XC1701 XQ1701L 1702L 17512L HW-130 XC1701 XC1701L XC1702L XC1704L XC4020 1704L

    mcc4412i01b

    Abstract: ixys mcc95 mcc56-12i08b MCC44-12I01B MDD95-16N1 MCC72-12I01 T0240AA MCC95-08I08B IXYS MCC44 IXYS MDD95
    Text: MHTEPTEKC www.i-t.su [email protected] Ten: 495 739-09-95, 644-41-29 TupucTopHbie m .qMOflHbie MOflynM ^ m p m u IXYS Kofl: U r rm I t(r m s ) I t (a v ) M CC44-12I01B M CC56-12I08B M CC72-12I01B M CC95-08I01B M CC95-08I08B MCC162-08I01 M CD26-08I08B M CD56-08I08B


    OCR Scan     		PDF MCC44-12I01B T0240AA MCC56-12I08B MCC72-12I01B MCC95-08I01B MCC95-08I08B mcc4412i01b ixys mcc95 MDD95-16N1 MCC72-12I01 T0240AA IXYS MCC44 IXYS MDD95

    Untitled

    Abstract: No abstract text available
    Text: HN27C4096H Series 4M 256K x 16-bit UV EPROM • DESCRIPTION The Hitachi HN27C4096H is a 4-Megabit Ultraviolet Erasable and Electrically Programmable Read Only Memory organized as 262,144 x 16-bits. The HN27C4096H features high speed access times of 70 and


    OCR Scan     		PDF HN27C4096H 16-bit) 16-bits. 32-bit 40-pin

    HM51W16405

    Abstract: No abstract text available
    Text: Package Information There are four types of package for the Hitachi IC Memories, Plastic Mold DIP, CERDIP, Flat Package and Chip Carrier. Please select a suitable package in consideration o f your circumstance. When you use the package that has the material variation, please write down the package name in a form in


    OCR Scan     		PDF DP-22N DP-22NB HM6287 HM6288 DP-24NC DP-28 HM6208H HM6207H HM62256B HM51W16405

    HN27C4096

    Abstract: HN27C4096HCC HN27C4096HG HN27C4096HG-85 HN27C4906HCC-85 Hitachi Scans-001
    Text: blE D • 44^203 002214^ ^ 7 ■HIT2 HN27C4096HG/HCC Series-262,144-word x 16-Wl C M O S U V Era sa b le and Program m able ROM HITACHI/ LOGIC/ARRAYS/MEM HN27C4096HG/HCC is a 4-M bit u ltravio let erasable and electrically programmable RO M , featuring high speed and low power dissipation.


    OCR Scan     		PDF HN27C4096HG/HCC 144-word 16-bJt HN27C4096HG 16-bit 32-bit HN27C4096 40-pin 44-pin. HN27C4096HCC HN27C4096HG-85 HN27C4906HCC-85 Hitachi Scans-001

    rca thyristor manual

    Abstract: HN623258 101490
    Text: Quick Reference Guide to Hitachi 1C Memories Package Information Reliability of Hitachi 1C Memories Applications MOS Static RAM MOS Pseudo Static RAM Application Specific Memory MOS Dynamic RAM MOS Dynamic RAM Module MOS Mask ROM MOS PROM ECL RAM P> Jc^< j


    OCR Scan     		PDF