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    Abstract: No abstract text available
    Text: ThomasiBetts _ Cardedge Cantilever Beam-Dip Solder .125" CENTER-TO-CENTER .200" ROW-TO-ROW DIP SOLDER TAILS .265“ CARD SLOT DEPTH f t TO LR49571 ES0980 P hysic a l P ro per ties I n s u la tio n R e s is ta n c e : 5000 megohms minimum. I n s e r t io n / W it h d r a w a l F o r c e D a u g h te r C a rd :


    OCR Scan     		PDF LR49571 ES0980 C4D36DS29A1M396 C4D40DS29A1M396 C4D43DS29A1M396 C4D44DS29A1M396 C4D49QS29A1M396 G4D50DS29A1M396 C4D49DS29B1M3# C4D36DS29B1M396

    LA 4750 n

    Abstract: LT 5250 C4D28DS29A1 C4D22DS29C3 t 2295 a Ug 78A LA 2785
    Text: ThomasSBetts _ Cardedge Cantilever Beam-Dip Solder .125" CENTER-TO-CENTER .145" ROW-TO-ROW DIP SOLDER TAILS .265“ CARD SLOT DEPTH T O LR49571 £60080 P h y s ic a l P r o p e r t ie s In s u l a t i o n R e s i s t a n c e : 5 0 0 0 m e g o h m s m inim um .


    OCR Scan     		PDF LR49571 G4D15DS29A3 C4D18DS29A3 C4D200S29A3 C4D22DS29A3 C4D28DS29A3 C4D30DS29A3 C4D31DS29A3 C4D35DS29A3 C4D36DS29A3 LA 4750 n LT 5250 C4D28DS29A1 C4D22DS29C3 t 2295 a Ug 78A LA 2785