Untitled
Abstract: No abstract text available
Text: Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 b 1/2 e e ∅v M C A B y y1 C ∅w M C Y W V U T R P N M L K J H G F E D C B A e e2 1/2 e shape optional 4x
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BGA292:
OT489-1
MS-034
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BGA-292
Abstract: BGA292 C BGA292 MS-034
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W V U T R P N M L K
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BGA292:
OT489-1
MS-034
BGA-292
BGA292
C BGA292
MS-034
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C BGA292
Abstract: BGA292 MS-034 BGA-292 sot881
Text: Package outline Philips Semiconductors BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.55 mm D SOT881-1 B A D1 ball A1 index area A A2 A1 E1 E detail X C e1 e ∅v ∅w b 1/2 e y1 C C A B C M M y Y W e V U T R P N M L e2 K J H 1/2 e G
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BGA292:
OT881-1
OT881-1
MS-034
C BGA292
BGA292
MS-034
BGA-292
sot881
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MO-151
Abstract: BGA292 transistor t 04 27 C BGA292
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K
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BGA292:
OT489-1
MO-151
MO-151
BGA292
transistor t 04 27
C BGA292
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Untitled
Abstract: No abstract text available
Text: Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.55 mm D SOT881-1 B A D1 ball A1 index area A A2 A1 E1 E detail X C e1 e Y V W T P M K H F D B ∅v ∅w b 1/2 e e U R N L e2 J 1/2 e G E C A shape optional 4x 1 2 3 4 5
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BGA292:
OT881-1
MS-034
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FD-235HF jumper
Abstract: Senstron SQH-4154 chicony keyboard pinout chicony schematic lcd inverter ibm PSA-2054C ISA S20 teac fd-235hf gtc6r-1 teac fd 235hf
Text: ÉlanSC400 Microcontroller Evaluation Board User’s Manual Release 2.0 A D V A N C E D M I C R O D E V I C E S frt Page ii Thursday, January 29, 1998 1:34 PM Élan SC400 Microcontroller Evaluation Board User’s Manual, Release 2.0 1998 by Advanced Micro Devices, Inc.
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lanSC400
lanTMSC400
FD-235HF jumper
Senstron SQH-4154
chicony keyboard pinout
chicony
schematic lcd inverter ibm
PSA-2054C
ISA S20
teac fd-235hf
gtc6r-1
teac fd 235hf
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BGA292
Abstract: SF-BGA292B-B-11
Text: D Package Code: BGA292B C 22.86mm [0.900"] 0.71mm [0.028"] See BGA pattern code to the right for actual pattern layout Y 0.58mm [0.023"] X 22.86mm [0.900"] Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.71mm [0.028"] 5.33mm 3.74mm [0.147"]
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BGA292B
FR4/G10
SF-BGA292B-B-11
BGA292
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BGA292-P-2727
Abstract: MLGA100-L-1010 005MAX
Text: Unit:mm FLGA424-C-1717 MLGA100-L-1010 MLGA239-C-1111 ± ± ± 9.00max 11.00±0.15 0.05 ± 0.40 0.625±0.2 0.65 T R P N M L K J H G F E D C B A ± 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 4- φ1.05 0.625±0.2 ± 16.00 φ 1 2 3 4 5 6 7 8 9 101112131415161718192021
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FLGA424-C-1717
MLGA100-L-1010
MLGA239-C-1111
00max
00max
BGA292-P-2727
05max
BGA292-P-2727
MLGA100-L-1010
005MAX
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Untitled
Abstract: No abstract text available
Text: AM33 MN103E Series The AM33 (MN103E) series is a group of 32-bit microprocessors suitable for multimedia uses such as movie, voice, graphics and communication. Its C-language-oriented architecture and C compiler which optimizes and outputs instruction code realize high performance with minimum
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MN103E)
32-bit
MN103)
VDD33
VDD18
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SF-BGA292A-B-11
Abstract: No abstract text available
Text: D Package Code: BGA292A C 24.13mm [0.950"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] 1.27 mm [0.050"] X Top View reference only 24.13mm [0.950"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]
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BGA292A
FR4/G10
SF-BGA292A-B-11
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Untitled
Abstract: No abstract text available
Text: AM33 MN103E Series AM33 (MN103E) Series The AM33 (MN103E) series is a group of 32-bit microprocessors suitable for multimedia uses such as movie, voice, graphics and communication. Its C-language-oriented architecture and C compiler which optimizes and outputs instruction code realize high performance with minimum
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MN103E)
32-bit
MN103)
VDD33
VDD18
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VDD18
Abstract: CLK48
Text: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Instruction Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 *Lead-free FLGA424-C-1717 *Lead-free
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MN103E010HRA,
MN103E040HYB
MN103E010HRA
BGA292-P-2727
FLGA424-C-1717
16/24/32-bit
16-bit
timerSA27
VDD33
VDD18
CLK48
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SD2608
Abstract: IEEE754 MN103E010HRA MN103E040HYB
Text: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Command Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 *Lead-free FLGA424-C-1717 *Lead-free
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MN103E010HRA,
MN103E040HYB
MN103E010HRA
BGA292-P-2727
FLGA424-C-1717
16/24/32-bit
SD2608
IEEE754
MN103E010HRA
MN103E040HYB
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sd2608
Abstract: 9801 nec IEEE754 MN103E010HRA MN103E040HYB pc9801 nec c bus
Text: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Instruction Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 *Lead-free FLGA424-C-1717 *Lead-free
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MN103E010HRA,
MN103E040HYB
MN103E010HRA
BGA292-P-2727
FLGA424-C-1717
16/24/32-bit
PC-9801
sd2608
9801 nec
IEEE754
MN103E010HRA
MN103E040HYB
pc9801 nec c bus
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0.3mm pitch BGA
Abstract: micro pitch BGA SF-BGA292D-B-11 1mm pitch BGA BGA 20x20
Text: C BGA292D D Ø 0.396mm x2 See BGA pattern code to the right for actual pattern layout Y (optional alignment hole) 1mm pitch typ. 19mm X Top View (reference only) Ø 0.508mm pad 3.48mm [0.137"] 2 0.5mm 0.3mm [0.012"] dia. 5.32mm [0.210"] 0.635mm 19mm B 1
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BGA292D
396mm
508mm
635mm
FR4/G10
20X20
488mm
SF-BGA292D-B-11
0.3mm pitch BGA
micro pitch BGA
1mm pitch BGA
BGA 20x20
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MD-001A
Abstract: No abstract text available
Text: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Command Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 FLGA424-C-1717 7.5 ns (at 1.8 V tolerance = ± 5%, 133 MHz)
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MN103E010HRA,
MN103E040HYB
MN103E010HRA
BGA292-P-2727
FLGA424-C-1717
16/24/32-bit
16-bit
MD-001A
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BGA292
Abstract: sot489 C BGA292
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 D D1 ball A1 corner A2 A A1 E1 E detail X k k A ZD b e ∅w M y v A ZE Y W V U T R P e N M L K J H G F E D C B A 2 1
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BGA292:
OT489-1
BGA292
sot489
C BGA292
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panasonic WM-54BT
Abstract: C143 led 10w TC51V18160AFTS-70 SMT18 WM-54BT PANASONIC WM 403A-03 TC51V18160AFTS toshiba SS24 motorola MC33174
Text: UFORCE20 uforCE Demo Board Revised: Tuesday, October 14, 1997 uforCE.SCH Revision: 2.0 C Advanced Micro Devices, Inc. (800) 222-9323 5204 E. Ben White Blvd. Austin, TX 78741 AMD Proprietary/All Rights Reserved Bill Of Materials Oct. 14,1997 Item Quantity Reference
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UFORCE20
001uF
CT244
MIC2563A-1
74ACT125
LT1478CS
LTC1327CG
TFDS6000
74ACT00
TR88802CS
panasonic WM-54BT
C143 led 10w
TC51V18160AFTS-70
SMT18
WM-54BT
PANASONIC WM
403A-03
TC51V18160AFTS
toshiba SS24
motorola MC33174
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Untitled
Abstract: No abstract text available
Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10
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MBL179
BGA156
OT472-1
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA316
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panasonic WM-54BT
Abstract: toshiba SS24 TC51V18160AFTS-70 tpo610 TPO610T 53556-6810 WM-54BT 1UF 50V SMT CASE C 47UF 50V SMT CASE C Switchcraft 712
Text: UFORCE20 uforCE Demo Board Revised: Tuesday, June 24, 1997 uforCE.SCH Revision: 2.0 C Advanced Micro Devices, Inc. (800) 222-9323 5204 E. Ben White Blvd. Austin, TX 78741 AMD Proprietary/All Rights Reserved Bill Of Materials July 16,1997 15:50:00 Item Quantity
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UFORCE20
1/10W,
KT11P2SM
ElanSC400
74ACT04
AM29F016EC-120
panasonic WM-54BT
toshiba SS24
TC51V18160AFTS-70
tpo610
TPO610T
53556-6810
WM-54BT
1UF 50V SMT CASE C
47UF 50V SMT CASE C
Switchcraft 712
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BGA-169
Abstract: TQFP112 BGA169 PQFP144 BGA-421 BQFP-84 qfp132 BGA196 PLCC18 BGA-256
Text: НАКОНЕЧНИКИ Изображения наконечников Наименование/размер A/B/C/D Наконечники для монтажа (для паяльника PS90) PS, 0.4 мм, конический PS, 0.8 мм, конический
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SOIC-14
SOIC-16
05x10
BGA-100
16x16
BGA-86
25x17
BGA-121/196/68
15x15
BGA-144
BGA-169
TQFP112
BGA169
PQFP144
BGA-421
BQFP-84
qfp132
BGA196
PLCC18
BGA-256
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LGA 1156 PIN OUT diagram
Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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LGA 1155 Socket PIN diagram
Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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12x16 font
Abstract: transistor SMD .v05
Text: INTEGRATED CIRCUITS o y e W M M Vm W M : SAA6721E SXGA RGB to TFT graphics engine Preliminary specification File under Integrated Circuits, IC02 Philips Semiconductors 1999 May 11 PHILIPS PHILIPS Philips Semiconductors Preliminary specification SXGA RGB to TFT graphics engine
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OCR Scan
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PDF
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SAA6721E
545004/750/01/pp72
12x16 font
transistor SMD .v05
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