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    Carling Technologies BA1-B0-24-615-K11-E

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    BA1 K11 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ty9000

    Abstract: TY9000A ty9000a400 MCP 256M nand toshiba TY9000A400BMGF 1g nand mcp toshiba mcp 512M nand mcp ty90 MCP 1g nand toshiba
    Text: TY9000A400BMGF TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS Low Power SDRAM and Nand E2PROM Mixed Multi-Chip Package Lead-Free DESCRIPTION The TY9000A400BMGF is a mixed multi-chip package containing a 536,870,912-bit 268,435,456-bit x 2devices


    Original     		PDF TY9000A400BMGF TY9000A400BMGF 912-bit 456-bit 256-bit 149-pin P-FBGA149-1013-0 N-29/29 ty9000 TY9000A ty9000a400 MCP 256M nand toshiba 1g nand mcp toshiba mcp 512M nand mcp ty90 MCP 1g nand toshiba

    ty9000

    Abstract: TY9000A 1g nand mcp TY9000A000CMGF SD4051 TY9000A000 tc58dyg02f2 nand toshiba ty9000 FBGA149 toshiba mcp
    Text: TY9000A000CMGF TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS TENTATIVE Low Power SDRAM and Nand E2PROM Mixed Multi-Chip Package Lead-Free DESCRIPTION The TY9000A000CMGF is a mixed multi-chip package containing a 536,870,912-bit Low Power Synchronous


    Original     		PDF TY9000A000CMGF TY9000A000CMGF 912-bit 256-bit 149-pin P-FBGA149-1013-0 N-29/29 ty9000 TY9000A 1g nand mcp SD4051 TY9000A000 tc58dyg02f2 nand toshiba ty9000 FBGA149 toshiba mcp

    ty9000

    Abstract: MCP 256M nand toshiba ty90 TY90009400DMGF toshiba mcp ty900 nand toshiba ty9000 FBGA149 toshiba nand TM P-FBGA149-1013-0
    Text: TY90009400DMGF TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS Low Power SDRAM and Nand E2PROM Mixed Multi-Chip Package Lead-Free DESCRIPTION The TY90009400DMGF is a mixed multi-chip package containing a 536,870,912-bit 268,435,456-bit x 2devices


    Original     		PDF TY90009400DMGF TY90009400DMGF 912-bit 456-bit 128-bit 149-pin P-FBGA149-1013-0 N-29/29 ty9000 MCP 256M nand toshiba ty90 toshiba mcp ty900 nand toshiba ty9000 FBGA149 toshiba nand TM

    MCP 256M nand toshiba

    Abstract: TY80009000AMGF toshiba mcp FBGA149 toshiba mcp nand 512M nand mcp nand sdram mcp TOSHIBA M9
    Text: TY80009000AMGF TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS Low Power SDRAM and Nand E2PROM Mixed Multi-Chip Package Lead-Free DESCRIPTION The TY80009000AMGF is a mixed multi-chip package containing a 268,435,456-bit Low Power Synchronous DRAM and a 553,648,128-bit Nand E2PROM. The TY80009000AMGF is available in a 149-pin BGA package


    Original     		PDF TY80009000AMGF TY80009000AMGF 456-bit 128-bit 149-pin P-FBGA149-1013-0 N-39/39 MCP 256M nand toshiba toshiba mcp FBGA149 toshiba mcp nand 512M nand mcp nand sdram mcp TOSHIBA M9

    TY9000

    Abstract: MCP 256M nand toshiba toshiba mcp nand toshiba mcp ty900 TY90009 512M x 8 Bit nand FBGA149 toshiba nand TM TY90009400FMGF
    Text: TY90009400FMGF TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS TENTATIVE Low Power SDRAM and Nand E2PROM Mixed Multi-Chip Package Lead-Free DESCRIPTION The TY90009400FMGF is a mixed multi-chip package containing a 536,870,912-bit 268,435,456-bit x 2devices


    Original     		PDF TY90009400FMGF TY90009400FMGF 912-bit 456-bit 128-bit 149-pin P-FBGA149-1013-0 N-29/29 TY9000 MCP 256M nand toshiba toshiba mcp nand toshiba mcp ty900 TY90009 512M x 8 Bit nand FBGA149 toshiba nand TM

    EM6A9320BIA-4H

    Abstract: EM6A9320BIA ba1s EM6A9320BI EM6A9320 EM6A9320BIA-5H J3J10 e-tron
    Text: EtronTech EM6A9320BIA 4M x 32 bit DDR Synchronous DRAM SDRAM Etron Confidential Preliminary (Rev 1.7 Nov. /2009) Features Overview • Fast clock rate: 200/250 MHz • Differential Clock CK & CK input The EM6A9320 DDR SDRAM is a high-speed CMOS double data rate synchronous DRAM


    Original     		PDF EM6A9320BIA EM6A9320 EM6A9320BIA-4H EM6A9320BIA ba1s EM6A9320BI EM6A9320BIA-5H J3J10 e-tron

    TYAD00AC00BUGK

    Abstract: SCR Handbook, rca GBNAND P-FBGA224-1218-0 THGV ACMD18 ACMD42 p-fbga224 Toshiba confidential NAND THGVS1G3D1CXGI1
    Text: TYAD00AC00BUGK TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS TENTATIVE Low Power SDRAM, Nand E2PROM and Giga Byte Nand E2PROM Mixed Multi-Chip Package DESCRIPTION Lead-Free The TYAD00AC00BUGK is a mixed multi-chip package containing a 1,073,741,824-bit 536,870,912-bit x 2devices


    Original     		PDF TYAD00AC00BUGK TYAD00AC00BUGK 824-bit 912-bit 256-bit 224-pin 001e800 001e810 003d400 SCR Handbook, rca GBNAND P-FBGA224-1218-0 THGV ACMD18 ACMD42 p-fbga224 Toshiba confidential NAND THGVS1G3D1CXGI1

    136ball

    Abstract: No abstract text available
    Text: 256M GDDR3 SDRAM K4J55323QG-BC 256Mbit GDDR3 SDRAM Revision 1.0 June 2005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,


    Original     		PDF K4J55323QG-BC 256Mbit 136ball

    K4J55323QG-BC20

    Abstract: K4J55323QG-BC14 K4J55323QG K4J55323QG-BC12 K4J55323QG-BC16
    Text: 256M GDDR3 SDRAM K4J55323QG 256Mbit GDDR3 SDRAM Revision 1.1 November 2005 Notice INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,


    Original     		PDF K4J55323QG 256Mbit K4J55323QG-BC20 K4J55323QG-BC14 K4J55323QG K4J55323QG-BC12 K4J55323QG-BC16

    Untitled

    Abstract: No abstract text available
    Text: 256M GDDR3 SDRAM K4J55323QG 256Mbit GDDR3 SDRAM Revision 1.3 June 2006 Notice INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,


    Original     		PDF K4J55323QG 256Mbit

    Untitled

    Abstract: No abstract text available
    Text: 256M GDDR3 SDRAM K4J55323QG 256Mbit GDDR3 SDRAM Revision 1.2 March 2006 Notice INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,


    Original     		PDF K4J55323QG 256Mbit

    K4J10324KE-HC1A

    Abstract: K4J10324KE-HC14 T21N K4J10324KE k4j10324 K4J10324KE-HC12
    Text: Target 1Gb GDDR3 SDRAM K4J10324KE 1Gbit GDDR3 SDRAM 136FBGA with Halogen-Free & Lead-Free RoHS compliant Revision 0.1 December 2008 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,


    Original     		PDF K4J10324KE 136FBGA 10tCK 10MAX K4J10324KE-HC1A K4J10324KE-HC14 T21N K4J10324KE k4j10324 K4J10324KE-HC12

    144L

    Abstract: DDR400 DDR500
    Text: W9464G2IB 512K x 4 BANKS × 32 BITS GDDR SDRAM Table of Contents1. GENERAL DESCRIPTION .4 2. FEATURES .4


    Original     		PDF W9464G2IB 144L DDR400 DDR500

    K4J55323QI

    Abstract: K4J55323QI-BC14 K4J55323QI-BC12 K4J55323
    Text: 256M GDDR3 SDRAM K4J55323QI 256Mbit GDDR3 SDRAM Revision 1.3 May 2007 Notice INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,


    Original     		PDF K4J55323QI 256Mbit K4J55323QI K4J55323QI-BC14 K4J55323QI-BC12 K4J55323

    Untitled

    Abstract: No abstract text available
    Text: 256M GDDR3 SDRAM K4J55323QI 256Mbit GDDR3 SDRAM Revision 1.1 February 2007 Notice INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,


    Original     		PDF K4J55323QI 256Mbit

    AS4DDR232M72APBG

    Abstract: No abstract text available
    Text: iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS  DDR2 Data rate = 667, 533, 400  Available in Industrial, Enhanced and Military Temp  Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm


    Original     		PDF AS4DDR232M72APBG 32Mx72 AS4DDR232M72APBG 2010Preliminary

    Untitled

    Abstract: No abstract text available
    Text: i PEM 2.1 G b SDRAM-DDR2 Gb Austin Semiconductor, Inc. AS4DDR232M64PBG 32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit BENEFITS FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Extended Temp


    Original     		PDF AS4DDR232M64PBG 32Mx64 AS4DDR232M64PBG

    AS4DDR232M64PBG

    Abstract: No abstract text available
    Text: i PEM 2.1 G b SDRAM-DDR2 Gb Austin Semiconductor, Inc. AS4DDR232M64PBG 32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit BENEFITS FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp


    Original     		PDF AS4DDR232M64PBG 32Mx64 AS4DDR232M64PBG

    AS4DDR232M72PBG

    Abstract: AS4DDR264M72PBG
    Text: i PEM 2.4 G b SDRAM-DDR2 Gb Austin Semiconductor, Inc. AS4DDR232M72PBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit BENEFITS FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Extended Temp


    Original     		PDF AS4DDR232M72PBG 32Mx72 AS4DDR232M72PBG AS4DDR264M72PBG

    AS4DDR232M64PBG

    Abstract: No abstract text available
    Text: i PEM 2.1 G b SDRAM-DDR2 Gb Austin Semiconductor, Inc. AS4DDR232M64PBG 32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit BENEFITS FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Extended Temp


    Original     		PDF AS4DDR232M64PBG 32Mx64 AS4DDR232M64PBG

    K4J10324QD

    Abstract: k4j10324qd-hj1a K4J10324QD-HC14 K4J10324QD-HC12 GDDR3 SDRAM 256Mb T21N 32MX32 k4j10324qdhj1a gddr3
    Text: 1Gb GDDR3 SDRAM K4J10324QD 1Gbit GDDR3 SDRAM 136FBGA with Halogen-Free & Lead-Free RoHS compliant Revision 1.2 May 2008 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,


    Original     		PDF K4J10324QD 136FBGA 10MAX K4J10324QD k4j10324qd-hj1a K4J10324QD-HC14 K4J10324QD-HC12 GDDR3 SDRAM 256Mb T21N 32MX32 k4j10324qdhj1a gddr3

    K4J10324KE-HC14

    Abstract: K4J10324KE-HC1A K4J10324KE k4j10324 K4J10324KEHC12 k4j10324ke-hc1 T21N K4J10324KE-HC7A K4J10324KE-HC12 gddr3
    Text: 1Gb GDDR3 SDRAM K4J10324KE 1Gbit GDDR3 SDRAM 136FBGA with Halogen-Free & Lead-Free RoHS compliant Revision 1.0 May 2009 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,


    Original     		PDF K4J10324KE 136FBGA 10MAX K4J10324KE-HC14 K4J10324KE-HC1A K4J10324KE k4j10324 K4J10324KEHC12 k4j10324ke-hc1 T21N K4J10324KE-HC7A K4J10324KE-HC12 gddr3

    AS4DDR232M64PBG

    Abstract: No abstract text available
    Text: iPEM 2.1 Gb SDRAM-DDR2 AS4DDR232M64PBG 32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm


    Original     		PDF AS4DDR232M64PBG 32Mx64 AS4DDR232M64PBG

    EM6A9320BI-5MG

    Abstract: ba1s EM6A9320 EM6A9320BI em6a9320bi-5
    Text: EtronTech EM6A9320BI Revision History Revision 1.0 Mar., 2007 Delete ‘Preliminary’ Revise the AC characteristics Revision 0.9E(Sep., 2006) Revise the AC characteristics Revise CAS Latency Revision 0.9D(Jul., 2006) Revise the AC characteristics Revision 0.9C(Jul., 2006)


    Original     		PDF EM6A9320BI 4Mx32 200uS 200xCK EM6A9320BI-5MG ba1s EM6A9320 EM6A9320BI em6a9320bi-5