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    80312 Search Results

    80312 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    68031-203HLF Amphenol Communications Solutions 68031-203HLF-B/S II SR Visit Amphenol Communications Solutions
    76345-803-12LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 12 Positions, 2.54mm (0.100in) Pitch Visit Amphenol Communications Solutions
    68031-220HLF Amphenol Communications Solutions BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail. Visit Amphenol Communications Solutions
    G832ME110803122HR Amphenol Communications Solutions Pitch 0.8mm, Height 5.7 mm, 80 Positions, Dual Row, BTB Vertical Plug SMT, 15u\\ Gold Black Visit Amphenol Communications Solutions
    68031-226HLF Amphenol Communications Solutions BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail. Visit Amphenol Communications Solutions
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    80312 Price and Stock

    Shiu Li Technology LLC PR27-18.03-12.7-0.127

    THERM PAD 18.03MMX12.7MM GRAY
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey PR27-18.03-12.7-0.127 Bag 39,925 1
    • 1 $0.71
    • 10 $0.626
    • 100 $0.556
    • 1000 $0.49329
    • 10000 $0.4536
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    Molex 1054180312

    MALE TML 15 GOLD 10AWG PLT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 1054180312 Cut Tape 14,349 1
    • 1 $2.16
    • 10 $1.622
    • 100 $1.2621
    • 1000 $1.02438
    • 10000 $1.02438
    		Buy Now
    1054180312 Reel 12,500 2,500
    • 1 -
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    • 100 -
    • 1000 -
    • 10000 $0.57295
    		Buy Now
    Avnet Abacus 1054180312 18 Weeks 15,000
    • 1 -
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    The Bergquist Company 803124

    STAR THERM CLAD BRD LUMEX SML-LX
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 803124 Bulk 9,544 1
    • 1 $1.2
    • 10 $0.963
    • 100 $0.7705
    • 1000 $0.61517
    • 10000 $0.5248
    		Buy Now

    The Bergquist Company 803126

    STAR THERM CLAD BOARD LUXEON K2
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 803126 Bulk 8,039 1
    • 1 $1.21
    • 10 $0.97
    • 100 $0.7753
    • 1000 $0.61866
    • 10000 $0.5276
    		Buy Now

    Mill-Max Mfg Corp 0369-0-67-80-31-27-10-0

    RECEPTACLE WITH OFP SOLDER BARRI
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 0369-0-67-80-31-27-10-0 Cut Tape 3,289 1
    • 1 $1.89
    • 10 $1.439
    • 100 $1.1075
    • 1000 $0.86601
    • 10000 $0.86601
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    0369-0-67-80-31-27-10-0 Digi-Reel 3,289 1
    • 1 $1.89
    • 10 $1.439
    • 100 $1.1075
    • 1000 $0.86601
    • 10000 $0.86601
    		Buy Now
    Mouser Electronics 0369-0-67-80-31-27-10-0 6,482
    • 1 $1.53
    • 10 $1.33
    • 100 $1.19
    • 1000 $0.882
    • 10000 $0.726
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    Find more 80312 price and stock on Findchips.com

    80312 Datasheets (17)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    80312 Intel I/O Companion Chip Original PDF
    803-12 Klein Tools Tools - Hammers - HAMMER BALL PEEN WOOD HICKORY Original PDF
    803121 Bergquist LED Thermal Products, Optoelectronics, BRD STAR LED IMS AVAGO MOONSTONE Original PDF
    80312-13 Honeywell Sensing and Productivity Solutions Uncategorized - Miscellaneous - CLAMP Original PDF
    803122 Bergquist LED Thermal Products, Optoelectronics, BOARD LED IMS CREE X-LAMP Original PDF
    803122 Phoenix Contact Connectors, Interconnects - Terminal Blocks - Accessories - Marker Strips - UBE/D N+C Original PDF
    80312-26 Honeywell Sensing and Productivity Solutions Uncategorized - Miscellaneous - CLAMP Original PDF
    803123 Bergquist LED Thermal Products, Optoelectronics, BRD STAR LED IMS LITE-ON LOPL Original PDF
    803124 Bergquist LED Thermal Products, Optoelectronics, BRD STAR LED IMS LUMEX SML-LX Original PDF
    803125 Bergquist LED Thermal Products, Optoelectronics, BRD STAR LED IMS LUXEON I/III/V Original PDF
    8031-256-A RAF Electronic Hardware ROUND HANDLEPLAIN ALUMINUM1/8 OD Original PDF
    8031-256-B RAF Electronic Hardware ROUND HANDLEPLAIN BRASS1/8 OD X Original PDF
    8031-256-S RAF Electronic Hardware ROUND HANDLEPLAIN STEEL1/8 OD X Original PDF
    803126 Bergquist LED Thermal Products, Optoelectronics, BRD STAR LED IMS LUXEON K2 Original PDF
    803127 Bergquist LED Thermal Products, Optoelectronics, BRD STAR LED IMS LUXEON REBEL Original PDF
    803128 Bergquist LED Thermal Products, Optoelectronics, BRD STAR LED IMS GOLDEN DRAGON Original PDF
    803129 Bergquist LED Thermal Products, Optoelectronics, BOARD LED IMS SEOUL SEMI Z-PWR Original PDF

    80312 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    intel G31 circuit diagram

    Abstract: intel 845 circuit diagram all chip socket AM2 pinout P5 microarchitecture socket am3 pinout Thermocouple K bead type am3 socket pin diagram am3 socket pinout intel 845 SERVICE MANUAL intel p30
    Text: Intel 80312 I/O Companion Chip Datasheet Product Features • ■ ■ ■ Core Interface Unit —100 MHz Request Bus —Data Bus shared with Intel® 80200 processor and SDRAM —4-Entry Request Buffer PCI-to-PCI Bridge Unit —Primary and Secondary 66 MHz/64-bit


    Original     		PDF Hz/64-bit 64-Bit intel G31 circuit diagram intel 845 circuit diagram all chip socket AM2 pinout P5 microarchitecture socket am3 pinout Thermocouple K bead type am3 socket pin diagram am3 socket pinout intel 845 SERVICE MANUAL intel p30

    a8293

    Abstract: A8294 A8264 PC 1498H 1250H a8296 BA RV cb rv 1050H REQ64
    Text: Intel 80312 I/O Companion Chip Developer’s Manual December 2000 Order Number: 273410-002 Intel® 80312 I/O Companion Chip Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF 181CH 1820H 1824H 1828H 182CH 1830H 1834H 1838H 183CH 18FFH a8293 A8294 A8264 PC 1498H 1250H a8296 BA RV cb rv 1050H REQ64

    CAPT3216

    Abstract: PAD35 PTC1111 I82559ER l28c PTC111 HEAD2X10 ptc1111-00 8 pin LM393 ic for 12v swdip
    Text: A B C D E F G H 1 1 80312/Coyanosa DECOUPLING SPCI DECOUPLING IC DECOUPLING +3V +3V SDRAM DECOUPLING +3V +3V +3V +3V +5V +3V +5V 2 C139 1 2 C61 1 2 C161 1 2 2 3 4 5 CAPT7343 47uF C23 2 1 CAP0805 0.1uF C154 2 1 CAP0805 0.1uF C117 2 1 CAP0805 0.1uF C22 2 1 CAP0805


    Original     		PDF 80312/Coyanosa CAP0805 CAPT3216 PAD35 PTC1111 I82559ER l28c PTC111 HEAD2X10 ptc1111-00 8 pin LM393 ic for 12v swdip

    intel G31 circuit diagram

    Abstract: 52III 273425 intel G31 circuit diagram free
    Text: Intel 80312 I/O Companion Chip • ■ ■ Interfaces directly to the Intel® 80200 Processor 66 MHz PCI-to-PCI Bridge 100 MHz SDRAM and Internal Bus Datasheet Product Features ■ ■ ■ ■ Core Interface Unit —100 MHz Request Bus —Data Bus shared with Intel® 80200


    Original     		PDF Hz/64-bit 64-Bit 1710H intel G31 circuit diagram 52III 273425 intel G31 circuit diagram free

    GC80312

    Abstract: 80312 SL57U 273425 REQ64 273410
    Text: Intel 80312 I/O Companion Chip Specification Update November 2001 Notice: The Intel® 80312 processor may contain design defects or errors known as errata. Characterized errata that may cause the product’s behavior to deviate from published specifications are documented in this specification update.


    Original     		PDF REQ64# GC80312 80312 SL57U 273425 REQ64 273410

    intel G31 circuit diagram

    Abstract: P5 microarchitecture am3 socket pin diagram intel 845 SERVICE MANUAL socket am3 pinout M66EN PAR64 REQ64 BGA-540-0-02-3201 BGA-540-0-02-3201-0275P-130
    Text: Intel 80312 I/O Companion Chip Datasheet Product Features • ■ ■ ■ Core Interface Unit —100 MHz Request Bus —Data Bus shared with Intel® 80200 processor and SDRAM —4-Entry Request Buffer PCI-to-PCI Bridge Unit —Primary and Secondary 66 MHz/64-bit


    Original     		PDF Hz/64-bit 64-Bit intel G31 circuit diagram P5 microarchitecture am3 socket pin diagram intel 845 SERVICE MANUAL socket am3 pinout M66EN PAR64 REQ64 BGA-540-0-02-3201 BGA-540-0-02-3201-0275P-130

    GC80312

    Abstract: SP006 21308A 21308
    Text: Intel 80312 I/O Companion Chip Specification Update March 2007 Notice: The Intel® 80312 I/O Processor may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.


    Original     		PDF SU900-614372 ylnO-tnemucoD--21308 GC80312 SP006 21308A 21308

    80312

    Abstract: MAX921
    Text: SCKE Circuit Description for the Intel 80303 I/O Processor and Intel® 80312 I/O Companion Chip White Paper April 2001 Order Number: 273394-003 SCKE Circuit Description for the Intel® 80303 I/O Processor and Intel® 80312 I/O Companion Chip Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF MAX921 A7693-01 80312 MAX921

    Intel PR 21154

    Abstract: LADR0 82559ER AD17 0x00001270 0x00001428 0x00001204 0x00001210
    Text: Initializing Intel 80312 I/O Companion Chip Secondary PCI Bus Private Devices Application Note January 3, 2002 Document Number: 273619-001 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF UINT16 0x0823; 0x03FF; Intel PR 21154 LADR0 82559ER AD17 0x00001270 0x00001428 0x00001204 0x00001210

    I82559ER

    Abstract: PTC1111 T2D19 CAPT3216 14C431 PM66EN sad48 CAPT7343 CAP1206 C101
    Text: A B C D E F G H 1 1 80312/Coyanosa DECOUPLING SPCI DECOUPLING IC DECOUPLING +3V +3V SDRAM DECOUPLING +3V +3V +3V +3V +5V +3V +5V C68 1 2 C139 1 2 C61 1 2 C161 1 2 2 4 5 CAP0805 0.1uF C154 2 1 CAP0805 0.1uF C117 2 1 CAP0805 0.1uF C22 2 1 CAP0805 0.1uF C12 2 1


    Original     		PDF 80312/Coyanosa CAP0805 I82559ER PTC1111 T2D19 CAPT3216 14C431 PM66EN sad48 CAPT7343 CAP1206 C101

    intel G31 circuit diagram

    Abstract: 273425
    Text: Intel 80312 I/O Companion Chip Datasheet Product Features • ■ ■ ■ Core Interface Unit —100 MHz Request Bus —Data Bus shared with Intel® 80200 processor and SDRAM —4-Entry Request Buffer PCI-to-PCI Bridge Unit —Primary and Secondary 66 MHz/64-bit


    Original     		PDF Hz/64-bit 64-Bit 1710H intel G31 circuit diagram 273425

    D03316P-103

    Abstract: 4.7kohm resistor 88638-61102 DRFC16H st lm385 bcr beckman resistor R36-R38 74C32 Framatome 74c32 datasheet
    Text: 0700D _BoM Location Part Descripition QTY U21 IC/SM 74LVC04AD SOIC14 3.3V 1 U4,U26 IC/SM 74LVC08 3.3V TSSOP-14 2 U22 IC/SM 74LVC14 3.3V TSSOP-14 1 U7,U8 IC/SM 74LVTH273 TSSOP-20 3.3V 2 U14,U15 IC/SM 74LVC573 SOIC20 No Bus H 2 U3 IC/SM 74C32 TSSOP-14 1 Q3,Q6,Q7


    Original     		PDF 0700D 74LVC04AD SOIC14 74LVC08 TSSOP-14 74LVC14 74LVTH273 TSSOP-20 74LVC573 D03316P-103 4.7kohm resistor 88638-61102 DRFC16H st lm385 bcr beckman resistor R36-R38 74C32 Framatome 74c32 datasheet

    geiger

    Abstract: Siemens 1985
    Text: Semiconductors For the trade and technical press May 1997 Siemens Semiconductor Partners with ADTRAN to Develop DSL Products; Endorses ADTRAN DSL Technology as Industry Standard Siemens, Berlin and Munich, and ADTRAN NASDAQ: ADTN , Huntsville, announced today that they have signed an agreement to jointly develop highly integrated chip


    Original     		PDF D-81617 geiger Siemens 1985

    register electronica

    Abstract: No abstract text available
    Text: Semiconductors HL For the trade and technical press electronica ‘96 DOC: New PBX Controller Dramatically Shrinks PBX Size and Costs − Contains On-Chip, User-Programmable 40 MIPS Digital Signal Processor Siemens has developed a new telecommunication chip that provides almost


    Original     		PDF 160-pin D-81617 register electronica

    mhw 602

    Abstract: 87C562 83C592 8051FA icemaster-pe 87C51 assembler pe837 mhw803-1 80C31 83C751
    Text: METALINK CORPORATION 602 Ă926Ć0797 FAX: (602)Ă926Ć1198 Ordering Information Philips Semiconductors 8051 Family Microcontroller Support iceMASTER-PE Emulators The iceMASTER-PE emulators for the 8051 family are self-contained units, each dedicated to a particular member of the


    Original     		PDF RS-232 MSW-BSO/A51 MSW-BSO/C51 MSW-BSO/PLM51 MSW-F/4010 MSW-F/5020 MSW-F/8220 MSW-F/8310 mhw 602 87C562 83C592 8051FA icemaster-pe 87C51 assembler pe837 mhw803-1 80C31 83C751

    273414

    Abstract: No abstract text available
    Text: Intel 80200 Processor based on Intel® XScale Microarchitecture Datasheet Advance Information Product Features • ■ ■ ■ High Performance Processor based on Intel® XScale™ Microarchitecture — 7-8 stage Intel® Superpipelined Technology — 32-Entry Instruction Memory


    Original     		PDF 32-Entry 32-way 128-Entry 100MHz PC-100 10pF/pin 273414

    schematic diagram atx Power supply 500w

    Abstract: pioneer PAL 012A 1000w inverter PURE SINE WAVE schematic diagram 600va numeric ups circuit diagrams winbond bios 25064 TLE 9180 infineon smsc MEC 1300 nu TBE schematic diagram inverter 2000w DK55 circuit diagram of luminous 600va UPS
    Text: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 Digital Signal Processors, iCoupler , iMEMS® and iSensor . . . . . 805, 2707, 2768-2769 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-568 RF Connectors . . . . . . . . . . . . . . . . . . . . . . Pages 454-455


    Original     		PDF P462-ND P463-ND LNG295LFCP2U LNG395MFTP5U US2011) schematic diagram atx Power supply 500w pioneer PAL 012A 1000w inverter PURE SINE WAVE schematic diagram 600va numeric ups circuit diagrams winbond bios 25064 TLE 9180 infineon smsc MEC 1300 nu TBE schematic diagram inverter 2000w DK55 circuit diagram of luminous 600va UPS

    FR-4 substrate 1.6mm

    Abstract: 803268 R-032 Luxeon I Star LED 803293 Luxeon III Star LED SEOUL 1219 LED 803127
    Text: Bergquist Standard Configurations Thermal Clad POWER LED IMS® SUBSTRATES Bergquist shortens the design cycle and speeds up your time to market. Thermal Clad substrates offer more flexibility in selecting LED components Bergquist offers a family of standard thermally conductive insulated


    Original     		PDF

    a006

    Abstract: 0xA0020010 0x00000010
    Text: Running RAM RedBoot to Move Flash from Outbound Direct Addressing Window Application Note January 2002 Document Number: 273660-001 Running RAM RedBoot to Move Flash from Outbound Direct Addressing Window Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF iq80310 a006 0xA0020010 0x00000010

    01-1010-1-0210

    Abstract: 01-1001-9-XX PB08NA02 PB08NA01
    Text: 5IVE W A Y BINDING POSTS - LEXAN T H IS SERIES OF B IN D IN G POSTS INCORPORATES THE FEATURES A N D F L E X IB IL IT Y OF THE CONCORD 5IV E W AY B IN D IN G POST IN TO TH IS CO NTEM PO RARY DESIGN. THE SOFT GRAY COLOR GOES WELL V\ ITH THE LOOK OF M ODERN EQ UIPM ENT. TH E S IX COLORED RINGS PROVIDE


    OCR Scan     		PDF 10-3te 01-1001-9-XX MIL-P-55149/8 PB08NA01 PB08NA02 01-1010-1-0210 01-1001-9-XX

    ba 5412

    Abstract: LT 5251 4012 4341-11 display L5431 la 3041 la 5622-11 LS5631-13 LT 5252
    Text: LED DISPLAY ' SINGLE DIGIT AND OVERFLOW DIGIT HEIGHT EMITTING COL.OR DEVICE NUMBER c O U o •• 0 .3 " n o O 0 .3" LA c 3021-16 GREEN 1.65 LA(c)3031-16 YELLO W 1.6 LA(c)3041*16 ORANGE 1.8 G aP R E D 0.7 a/L H I-E FF. R E D 1.8 0 .4 " LA 3 0 1 1 -1 2 (LC3011-11)


    OCR Scan     		PDF

    LT 5247 H

    Abstract: FLD-30 LT 5247 74hc241 em c244
    Text: MOTOROLA S C -CLOGIC} 0 5 D E I b 3 t.7 E S 5 □ 0 flD3 0 c] 5 g T '5 3 '6 ? MOTOROLA SEM ICONDUCTOR TECHNICAL DATA MC54/74HC241 Octal 3-State Noninverting Buffer/Line Driver/Line Receiver J S U FF IX CERAM IC C A S E 732-03 High-Performance Silicon-Gate CM OS


    OCR Scan     		PDF MC54/74HC241 C54/74H HC241 LT 5247 H FLD-30 LT 5247 74hc241 em c244

    Untitled

    Abstract: No abstract text available
    Text: L o o k w a s h e r T e rm in a ls , 0.31 3 ± 0 .0 15 7.9 5* 0 .38 0.17 5 /0.18 5 ' (4.45/4.72) 0 .08 9 /0.09 5 (2.26/2.41) 0 .07 8 (1.98) 0.07 8 ± 0 .0 15 R (1.98± 0.38) P a rt Num ber M a te r ia l Type 922-092 0 .0 1 3 '(0.33mm) Ph. Bronze F in is h


    OCR Scan     		PDF

    LC373

    Abstract: 805111 235141
    Text: F E n A ELECTRONICS CORP SIE D S IN G L E D IG IT A N D O V E R F L O W D E V IC E NUMBER D IG IT H E IG H T u # HJ u. O j a 0 .6 3 ” ¿ a ad 0 .6 3 " GREEN 1.85 LS5631-13 4 YELLO W 1.75 LS 5641-13 (4) ORANGE 2.0 GaP R E D 0.9 H I-E F F . R E D 2.0 L A (C) 6011-11


    OCR Scan     		PDF LS5621-13 LS5631-13 LS5641-13 LS5651-13 LSS641R-13 6341R-21 6341R-23 8041R-11 2341R-41 4141R-82 LC373 805111 235141