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Catalog Datasheet	MFG & Type	PDF	Document Tags
61995AB124D1 Abstract: No abstract text available Text: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS AND ASICs Pin Fin Heat Sink/Clip Assembly for PowerPC™ 601, 604 304 C4QFP, 255 CBGA 609 SERIES Standard P/N 609-50AB 609-100AB 40mm C4QFP 21mm CBGA Base Dimensions in. (mm	Original	PDF	609-50AB 609-100AB 609-50AB) 609-100AB) 61995AB124D1
BGA 64 PACKAGE thermal resistance Abstract: BGA PACKAGE thermal resistance 624-25AB 612-Series 643-35AP 655-53AB Text: Thermal Management Solutions for BGAs PENGUIN COOLERS: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 624 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Standard P/N Base Dimensions in. Sq. Fin Height “A” in. mm Typical Applications Weight	Original	PDF	624-25AB 624-35AB 624-45AB 624-60AB BGA 64 PACKAGE thermal resistance BGA PACKAGE thermal resistance 624-25AB 612-Series 643-35AP 655-53AB
7476 Abstract: P628 CX486slc D10650-40 pin fin heat sink 624-25AB 655-26AB 655-53AB 658-25AB 658-35AB Text: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs Unidirectional Fin Heat Sink for AMD Am386 , PowerPC™ 601 659 SERIES Standard P/N 659-65AB ̆ 14 x 14, 38, 40 mm CQFP Base Dimensions in. mm Height in. (mm)	Original	PDF	Am386 659-65AB 7476 P628 CX486slc D10650-40 pin fin heat sink 624-25AB 655-26AB 655-53AB 658-25AB 658-35AB
Wakefield Thermal Solutions Abstract: Chomerics* T405 Bergquist BP-108 D10650-40 658-35AB 77AB datasheet of BGAS T405 bga package weight T411 Text: Cover.qxd 11/3/05 1:00 PM Page 1 THERMAL MANAGEMENT SOLUTIONS FOR BGAs DESIGN • ANALYSIS • FABRICATION CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES:	Original	PDF
T405R Abstract: Chomerics* T405 BERGQUIST softface T410R intel 82495 Bergquist BP-108 intel 80486sx Intel 82495 Cache Controller 651b thermal printer 2 inch Text: Thermal Interface THERMAL INTERFACE MATERIAL PART NUMBER GUIDE All of the heat sinks shown in this catalog are available with any of the following thermal tape and interface materials, pre-applied at the factory. Use the “T” series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide	Original	PDF	0486SX I860XR I960CA, I960CF AM486DX2, AM486DX4 669-32AG 669-32AG 669-33AB 669-40AB T405R Chomerics* T405 BERGQUIST softface T410R intel 82495 Bergquist BP-108 intel 80486sx Intel 82495 Cache Controller 651b thermal printer 2 inch
T405R Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF Text: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink	Original	PDF	WTS001 p1-25 220486SX I860XR I960CA, I960CF AM486DX2, AM486DX4 669-32AG 669-32AG T405R Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412
BERGQUIST softface Abstract: 61995AB124D1 Text: Thermal Management Solution for BGA and Pow e r P C packages Wakefield Engineering’s Series 619 fan heat sink provides processor spot cooling with direct impingement air flow. Features and Benefits : ♦ Captivated clips for ease of assembly Designed for use on a variety	Original	PDF	619rev2 61995AB124D1S4 61995AB124D1 BERGQUIST softface 61995AB124D1