linear CCD
Abstract: No abstract text available
Text: CCD LINEAR IMAGE SENSOR 22PIN CERAMIC DIP CERDIP (400 mil) (Unit : mm) 1bit 5.0 9.65±0.3 1.5±0.3 39.0 43.6±0.3 (5.27) 0.46±0.06 4.34±0.4 2.54 1.02±0.15 4.61±0.5 (1.89) 10.16 2.52±0.2 0~10˚ 5 0.25±0.0 25.4 Name Dimensions Refractive index Glass cap
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22PIN
22D-1CCD-PKG5
linear CCD
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Untitled
Abstract: No abstract text available
Text: CCD LINEAR IMAGE SENSOR 22PIN CERAMIC DIP CERDIP (400mil) (Unit : mm) 1bit 9.65 ± 0.3 1.60±0.25 4.9 ± 0.3 42.2 ± 0.25 48.6 ± 0.5 (5.27) 0.46 ± 0.06 4.33±0.5 2.54 1.02 ± 0.15 4.68±0.5 (1.95) 10.16 2.38 ±0.3 0~10° .05 0.25±0 25.4 Name Dimensions
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22PIN
400mil)
22D-1CCD-PKG7
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Untitled
Abstract: No abstract text available
Text: 0.8 4.4 UNIT : mm 9.7 LB − 015 Iength : 475±2.0 thickness : 0.6 +0.3 −0.2 tolerance : ±0.4 material : plastic with antistatic finish Applied Package Quantity (pcs) 16pin ceramic QFN (LCC) MAX. 30 22pin ceramic QFN (LCC) MAX. 36
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16pin
22pin
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Untitled
Abstract: No abstract text available
Text: 22PIN PLASTIC DIP 300 mil 22 12 1 11 A K I L P J H G F D C N M M R B NOTES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. 2) ltem "K" indicates the distance between the center locations
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22PIN
P22C-100-300WA-1
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DIP22S
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Dual In-line Package 22Pin Plastic DIP22S 300mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
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22Pin
DIP22S
300mil)
ED-7303A
51min
DIP22S
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Untitled
Abstract: No abstract text available
Text: DC DC Part Num 13DS4 SERIES 1000Vdc Isolation Single & Dual Output 1watt Dc-Dc Converter 1000Vdc Isolation Single Features: & Dual Output 1watt Dc-Dc Con • • • • • • • • Small Footprint 22PIN SMD Package High Ef ciency up to 80% Unregulated Output Types
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13DS4
1000Vdc
22PIN
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Untitled
Abstract: No abstract text available
Text: DC DC Part Num 13DS1-2W SERIES 3000Vdc Isolation Single & Dual Output 2 Watt Dc-Dc Converter Features: • Small Footprint • 22PIN SMD Package • High Ef ciency up to 80% • Unregulated Output Types • High Power Density • No External Component Required
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13DS1-2W
3000Vdc
22PIN
13DS1-XXS09N2W
13DS1-XXS12N2W
13DS1-XXS15N2W
13DS1-XXD05N2W
13DS1-XXD09N2W
13DS1-XXD12N
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Untitled
Abstract: No abstract text available
Text: CCD LINEAR IMAGE SENSOR 22PIN PLASTIC DIP 400 mil (Unit : mm) 1bit 2.0 9.25±0.3 1.5±0.3 37.5 44.0±0.3 (5.42) 0.46±0.1 4.21±0.5 2.54 1.02±0.15 4.69±0.4 (2.29) 10.16 2.35±0.2 1 0.05 0~10° 0.25± 25.4 Name Dimensions Plastic cap 42.9 x 8.35 × 1.0
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22PIN
22C-1CCD-PKG
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MD400-1A
Abstract: 20pin 28PIN MD400
Text: Unit : mm 7.5 13.5 12.5 7.0 17.9 MD400-1A, MD400-2A Length : 500 ± 2.0 Thickness : 0.5 +0.2 −0.1 ± Tolerance : 0.4 Material : Plastic with antistatic finish Applied Package Quantity (pcs) 20pin plastic DIP 17 22pin plastic DIP/ceramic DIP 17 28pin plastic DIP
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MD400-1A,
MD400-2A
20pin
22pin
28pin
30pin
MD400-1A
MD400
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Untitled
Abstract: No abstract text available
Text: CCD LINEAR IMAGE SENSOR 22PIN PLASTIC DIP 400 mil (Unit : mm) 1bit 9.25±0.3 3 2.0 2.0±0.8 37.5 44.0±0.3 10.16 (1.79) 2.55±0.2 1 (5.42) 2.54 1.02±0.15 0~10° 4.21±0.5 0.46±0.1 0.05 0.25± 4.39±0.4 25.4 Name Plastic cap Dimensions 42.9 x 8.35 x 0.7
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22PIN
22C-1CCD-PKG8
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Untitled
Abstract: No abstract text available
Text: CCD LINEAR IMAGE SENSOR 22PIN PLASTIC DIP 400 mil (Unit : mm) 1bit 9.25±0.3 3 2.0 2.0±0.8 37.5 44.0±0.3 10.16 (1.79) 2.55±0.2 1 (4.61) 2.54 1.02±0.15 0~10° 3.40±0.5 0.46±0.1 0.05 0.25± 4.39±0.4 25.4 Name Plastic cap Dimensions 42.9 x 8.35 x 0.7
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22PIN
22C-1CCD-PKG9
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Untitled
Abstract: No abstract text available
Text: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. • Available on .300 [7.62] centers. Consult Data No. 18011 for adapters on .400 [10.16] or .600 [15.24] centers.
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24Pin
22Pin
75ALS162
C36000
ASTM-B-16-85.
MIL-P-81728
QQN-290.
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Untitled
Abstract: No abstract text available
Text: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.
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24Pin
22Pin
75ALS162
C36000
ASTM-B-16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
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Untitled
Abstract: No abstract text available
Text: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.
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24Pin
22Pin
75ALS162
C36000
ASTM-B-16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
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Untitled
Abstract: No abstract text available
Text: CCD LINEAR IMAGE SENSOR 22PIN PLASTIC DIP 400 mil (Unit : mm) 1bit 9.25±0.3 2.0 1.7±0.3 37.5 44.0±0.3 (5.42) 4.21±0.5 2.54 1.02±0.15 0.46±0.1 4.39±0.4 (1.99) 10.16 2.35±0.2 1 0.05 0~10° 0.25± 25.4 Name Dimensions Plastic cap 42.9 x 8.35 × 0.7
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22PIN
22C-1CCD-PKG2
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Untitled
Abstract: No abstract text available
Text: 22P4H Plastic 22pin 300mil DIP Weight g 1.5 JEDEC Code – Lead Material Alloy 42 12 1 11 E 22 e1 c EIAJ Package Code DIP22-P-300-2.54 D L A1 A A2 Symbol SEATING PLANE e b1 b b2 A A1 A2 b b1 b2 c D E e e1 L Dimension in Millimeters Min Nom Max – – 4.7
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22P4H
22pin
300mil
DIP22-P-300-2
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Untitled
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Dual In-line Package 22Pin Plastic DIP22S 300mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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22Pin
DIP22S
300mil)
ED-7303A)
51min
DIP22S
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Untitled
Abstract: No abstract text available
Text: SANYO Semiconductor Dual In-line Package 22Pin Plastic DIP22 400mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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22Pin
DIP22
400mil)
ED-7303A)
51MIN
95ormation
95MAX
DIP22
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Untitled
Abstract: No abstract text available
Text: 22P4 Plastic 22pin 400mil DIP Lead Material Alloy 42/Cu Alloy 12 1 11 E 22 c Weight g 2.2 JEDEC Code – e1 EIAJ Package Code DIP22-P-400-2.54 D A A2 Symbol L A1 SEATING PLANE e b1 b A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.08
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22pin
400mil
42/Cu
DIP22-P-400-2
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Untitled
Abstract: No abstract text available
Text: CCD LINEAR IMAGE SENSOR 22PIN PLASTIC DIP 400 mil (Unit : mm) 1bit 9.25±0.3 2.0 1.6±0.3 37.5 44.0±0.3 (5.42) 0.46±0.1 4.39±0.4 2.54 1.02±0.15 4.21±0.5 (1.79) 10.16 2.55±0.2 1 0.05 0 ~ 10° 0.25± 25.4 Name Plastic cap Dimensions 42.9 8.35 1 The bottom of the package
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22PIN
22C-1CCD-PKG5
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Untitled
Abstract: No abstract text available
Text: CCD LINEAR IMAGE SENSOR 22PIN PLASTIC DIP 400 mil (Unit : mm) 1bit 9.25±0.3 2.0 0.5±0.3 37.5 44.0±0.3 10.16 (1.79) 2.55±0.2 1 1.02±0.15 (5.42) 2.54 4.21±0.5 0.46±0.1 0 ~ 10° 0.05 0.25± 4.39±0.4 25.4 Name Plastic cap Dimensions 42.9 x 8.35 × 0.7
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22PIN
22C-1CCD-PKG6
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MB81C71-55
Abstract: LH5161-25 MCM6287-35 mcm6287 KHB165L-35 KM6165-45 KM6165L-25 KME165-35 M5M5187AP-25 MB81C71
Text: - 66 - 4 K X m £ ît * CC TAAC max ns) TCAC (ns) TOE max (ns) CMOS y A f- > TOH rain (ns) TOD max (ns) S t a t i c ;/ TWP min (ns) RAM ( 6 5 5 3 6 x 1 ) tt n < TDS min (ns) TDH (ns) TWD nin (ns) TWF max (ns) V D D or V C C (V) 22PIN 1DD max <mA) 6287 À
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65536x1)
IMS1601P/S/H-55L
IMS1601P/S/W-
KM6165
KME165-35
MT5C6401-35
P4C187-10
P4C187-12
P4C187-15
P4C187-20
MB81C71-55
LH5161-25
MCM6287-35
mcm6287
KHB165L-35
KM6165-45
KM6165L-25
M5M5187AP-25
MB81C71
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SDMP30
Abstract: T0-220F
Text: i. ma *« *>''• •/r —yumvt, m m «œ * * <t v r c b k # * l -cjs»>*+„ it. ft B - fi Suffix TO-92 TO-220F TO-252 8 Pin 9 Pin 14Pin l6Pin l8Pin 20Pin 22Pin O - - - - - - - - - O O O - o o D /N L M G E V R S /L ZIP Q FP DIP SDIP DMP SOP EMP SSOP
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20Pin
22Pin
T0-220F
O-252
OT-89
24Pin
28Pin
30Pin
40Pin
42Pinâ
SDMP30
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ci d 4800
Abstract: EGG RETICON "Bandpass Filter" 50 hz
Text: J ^ E E kG RM5637A HIGH-SPEED MODEM COMBO FILTER r e t ic o n Device Description .LNE J EQUALIZER IN The Reticon RM5637 is a monolithic switched-capacitor combo filter I.e . designed 1o be incorporated in 4800 BPS modem applications. This four-filter device is offered in a 22pin package.
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RM5637A
RM5637
22pin
RM5S37
23/Bell
ci d 4800
EGG RETICON
"Bandpass Filter" 50 hz
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