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    132261 Search Results

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    CnC Tech LLC 3132-26-1-0500-003-1-TS

    HOOK-UP STRND 26AWG YEL FEET
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    DigiKey 3132-26-1-0500-003-1-TS 7,223 1
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    CnC Tech LLC 3132-26-1-0500-011-1-TS

    HOOK-UP STRND 26AWG GRN/YEL FEET
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    DigiKey 3132-26-1-0500-011-1-TS 2,783 1
    • 1 $0.63
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    Mill-Max Mfg Corp 499-13-226-10-003000

    CONN RCPT 26POS 0.1 GOLD PCB R/A
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    DigiKey 499-13-226-10-003000 Tube 53 1
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    Mouser Electronics 499-13-226-10-003000 29
    • 1 $23.67
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    RS 499-13-226-10-003000 Bulk 60
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    Sager 499-13-226-10-003000 50
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    Molex 2132261410

    CLIK-MATE1.5 SRRA SMT AU0.1 ETP
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    DigiKey 2132261410 Reel 3,000
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    Molex 2132261171

    CLIK-MATE1.5 SRRA SMT AU0.76 ETP
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    DigiKey 2132261171 Reel 3,000
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    Sager 2132261171 3,000
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    132261 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    13226.1 CONTA-CLIP PLUG-IN CONNECTOR Original PDF

    132261 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    AMD79C978

    Abstract: CN7221 EPB5034
    Text: Home Phone Networking Analog Magnetics Module with 10/100 Base-T ELECTRONICS INC. EPB5034 • Optimized for AMD79C978, Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEE 802.3 Requirements •


    Original
    EPB5034 AMD79C978, CN7221 DP83851 CSB5034 AMD79C978 CN7221 EPB5034 PDF

    AMD79C978

    Abstract: CN7221 EPB5135G
    Text: Low Profile Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5135G • Optimized for AMD79C978, Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File # 132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes •


    Original
    EPB5135G AMD79C978, CN7221 DP83851 CSB5135G AMD79C978 CN7221 EPB5135G PDF

    AMD79C978

    Abstract: EPB5048G
    Text: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5048G • Optimized for AMD79C978, Conexant CN 7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes •


    Original
    EPB5048G AMD79C978, DP83851 CSB5048G AMD79C978 EPB5048G PDF

    AMD79C978

    Abstract: CN7221 EPB5032 RX513
    Text: Home Phone Networking Analog Magnetics Module with 10 Base-T ELECTRONICS INC. EPB5032 • Optimized for AMD79C978,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEE 802.3 Requirements •


    Original
    EPB5032 AMD79C978 CN7221 DP83851 CSB5032 CN7221 EPB5032 RX513 PDF

    AMD79C978

    Abstract: CN7221 EPB5035GM
    Text: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5035GM • Optimized for AMD79C978,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes •


    Original
    EPB5035GM AMD79C978 CN7221 DP83851 CSB5035GM CN7221 EPB5035GM PDF

    EPF8185SL

    Abstract: No abstract text available
    Text: 10/100 LAN Interface Module for PC Card Applications ELECTRONICS INC. EPF8185SL • UL/IEC 950 Approved File #132261 • including Nordic deviations for creepage and clearance • Guaranteed to operate with 8 mA DC bias at 70°C • • Low profile, fully integrated with two channels •


    Original
    EPF8185SL BT/100 EPF8185SL PDF

    AMD79C978

    Abstract: CN7221 EPB5037GM
    Text: Home Phone NetworkingAnalog Magnetics Module with 10/100 Base-T ELECTRONICS INC. EPB5037GM • Optimized for AMD79C978,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEE 802.3 Requirements •


    Original
    EPB5037GM AMD79C978 CN7221 DP83851 CSB5037GM CN7221 EPB5037GM PDF

    AMD79C978

    Abstract: CN7221 EPB5040GM SIDACTOR
    Text: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5040GM • Optimized for AMD79C978 ,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes •


    Original
    EPB5040GM AMD79C978 CN7221 DP83851 CSB5040GM AMD79C978 CN7221 EPB5040GM SIDACTOR PDF

    AMD79C978

    Abstract: CN7221 EPB5040G a539
    Text: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5040G • Opitimized for AMD79C978 , Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes •


    Original
    EPB5040G AMD79C978 CN7221 DP83851 CSB5040G AMD79C978 CN7221 EPB5040G a539 PDF

    CSB503

    Abstract: AMD79C978 EPB5032G CN7221
    Text: Home Phone Networking Analog Magnetics Module with 10 Base-T ELECTRONICS INC. EPB5032G • Optimized for AMD79C978,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEC 802.3 Requirements •


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    EPB5032G AMD79C978 CN7221 DP83851 CSB5032G CSB503 EPB5032G CN7221 PDF

    Untitled

    Abstract: No abstract text available
    Text: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5098G • Optimized for Intel Chipset • • UL/IEL 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes • • Temperature Range -40°C to +85°C •


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    EPB5098G EPB5098G CSB5098G PDF

    EPB5036G

    Abstract: AMD79C978 CN7221 132261
    Text: Home Phone Networking Analog Magnetics Module with 10 Base-T ELECTRONICS INC. EPB5036G • Optimized For AMD79C978, Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEE 802.3 Requirements •


    Original
    EPB5036G AMD79C978, CN7221 DP83851 CSB5036G EPB5036G AMD79C978 CN7221 132261 PDF

    AMD79C978

    Abstract: CN7221 EPB5036WG
    Text: Home Phone Networking Analog Magnetics Module with 10 Base-T ELECTRONICS INC. EPB5036WG • Optimized For AMD79C978 ,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEE 802.3 Requirements •


    Original
    EPB5036WG AMD79C978 CN7221 DP83851 AMD79C978 CN7221 EPB5036WG PDF

    EPB5047AS

    Abstract: No abstract text available
    Text: Home Phone Networking Magnetic Module ELECTRONICS INC. EPB5047AS • Designed to work with Broadcom’s BCM 4210 • • UL/IEC 950 Approved File #132261 • • Robust construction allows for IR processes • • 1500 Vrms Isolation • • Enhanced Common Mode Attenuation to pass FCC Class B •


    Original
    EPB5047AS CSB5047AS EPB5047AS PDF

    AMD79C978

    Abstract: CN7221 EPB5035G C 6090
    Text: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5035G • Optimized for AMD79C978, Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes •


    Original
    EPB5035G AMD79C978, CN7221 DP83851 CSB5035G AMD79C978 CN7221 EPB5035G C 6090 PDF

    AMD79C978

    Abstract: CN7221 EPB5037G
    Text: Home Phone Networking Analog Magnetics Module with 10/100 Base-T ELECTRONICS INC. EPB5037G • Optimized for AMD79C978,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEE 802.3 Requirements •


    Original
    EPB5037G AMD79C978 CN7221 DP83851 HPNA250 CSB5037G CN7221 EPB5037G PDF

    EPB5047S

    Abstract: No abstract text available
    Text: Home Phone Networking Magnetic Module ELECTRONICS INC. EPB5047S • Optimized for Broadcom’s BCM 4210 • • UL/IEC 950 Approved File #132261 • • Robust construction allows for IR/VP processes • • 1500 Vrms Isolation • • Enhanced Common Mode Attenuation to pass FCC Class B •


    Original
    EPB5047S CSB5047S EPB5047S PDF

    AMD79C978

    Abstract: CN7221 EPB5036GM
    Text: Home Phone Networking Analog Magnetics Module with 10 Base-T ELECTRONICS INC. EPB5036GM • Optimized for AMD79C978 & Conexant CN7221 Chips • • UL/IEC 950 Approved File #132261 • • Includes 10 Base-T Magnetics with Common Mode Chokes • • Supports TUT Systems HPN Architecture •


    Original
    EPB5036GM AMD79C978 CN7221 CSB5036GM AMD79C978 EPB5036GM PDF

    hpna

    Abstract: EPB5174G
    Text: Home Phone Networking Analog Magnetics Module with 10 Base-T ELECTRONICS INC. EPB5174G • Supports TUT Systems HPN Architecture • • UL/IEC 950 Approved File #132261 • • Meets UL 1950 Spplementary Insulation Requirements • • Meets or exceeds IEEE802.3 Requirements •


    Original
    EPB5174G IEEE802 10-Base-T CSB5174G hpna EPB5174G PDF

    AMD79C978

    Abstract: CN7221 EPB5045G
    Text: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5045G • Optimized for AMD79C978, Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • Supports TUT Sysems HPN Architecture • • Robust construction allows for reflow processes •


    Original
    EPB5045G AMD79C978, CN7221 DP83851 SB5045G AMD79C978 CN7221 EPB5045G PDF

    triac tag 8518

    Abstract: 70146 DS3654 X2864AD 7 segment display RL S5220 TC9160 la 4440 amplifier circuit diagram 300 watt philips ecg master replacement guide vtl 3829 A-C4 TCA965 equivalent
    Text: 1985 0 / 0 / CONTENTS VOLUME I Introduction to IC MASTER 3 Advertisers’ Index 8 Master Selection Guide Function Index I0 Part Number Index 40 Part Number Guide 300 Logo Guide 346 Application Note Directory 349 Military Parts Directory 50I Testing 506 Cross Reference


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