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    Untitled

    Abstract: No abstract text available
    Text: 107-68823 Packaging Specification 03July08 Rev B Floating Conn. HSG 1. PURPOSE 目的 Define the packaging specifiction and packaging method of Floating Conn. HSG . 订定 Floating Conn. HSG 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围


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    PDF 03July08 229x318 102x51 349x298x146 349x304x12 102X102 QR-ME-030B

    Untitled

    Abstract: No abstract text available
    Text: 3x3 mm LGA Package Guidelines for Printed Circuit Board Design This technical note is intended to provide information about Kionix’s 3 x 3 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices.


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    PDF 03-July-08

    Untitled

    Abstract: No abstract text available
    Text: M ICROWAVE A Division of Crystek Corporation PERFORMANCE SPECIFICATION MIN TYP Lower Frequency: Upper Frequency: MAX UNITS 2032 MHz 4.5 VDC 2032 MHz Tuning Voltage: 0.5 Supply Voltage: 4.75 5.0 5.25 VDC Output Power: +3.0 +4.5 +6.0 dBm 33 37 mA Supply Current:


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    PDF 10kHz 100kHz CVCO55CC-2032-2032 03-July-08

    Untitled

    Abstract: No abstract text available
    Text: M ICROWAVE A Division of Crystek Corporation PERFORMANCE SPECIFICATION MIN TYP Lower Frequency: Upper Frequency: MAX UNITS 2207 MHz 4.5 VDC 2207 MHz Tuning Voltage: 0.5 Supply Voltage: 4.75 5.0 5.25 VDC Output Power: +3.0 +4.5 +6.0 dBm 33 37 mA Supply Current:


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    PDF 10kHz 100kHz CVCO55CC-2207-2207 03-July-08

    Untitled

    Abstract: No abstract text available
    Text: M ICROWAVE A Division of Crystek Corporation PERFORMANCE SPECIFICATION MIN TYP Lower Frequency: Upper Frequency: MAX UNITS 2207 MHz 4.5 VDC 2207 MHz Tuning Voltage: 0.5 Supply Voltage: 4.75 5.0 5.25 VDC Output Power: +3.0 +4.5 +6.0 dBm 33 37 mA Supply Current:


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    PDF 10kHz 100kHz CVCO55CC CVCO55CC-2207-2207 03-July-08