0201 DSN FOOTPRINT Search Results

0201 DSN FOOTPRINT Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
HI4-0201/B		Rochester Electronics LLC	HI4-0201 - Differential Multiplier
MD28F020-12/B		Rochester Electronics LLC	Replacement for Intel part number MD28F020-12. Buy from authorized manufacturer Rochester Electronics.
MD28F020-12/R		Rochester Electronics LLC	28F020 - 256K X 8 Flash, Mil Temp
TN28F020-150		Rochester Electronics LLC	28F020 - 256K X 8 Flash
100201SCX		Rochester Electronics LLC	100201 - OR/NOR Gate, 100K Series, 1-Func, 2-Input, ECL, PDSO8

0201 DSN FOOTPRINT Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
NSR01F30NXT5G Abstract: No abstract text available Text: NSR01F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN	Original	PDF	NSR01F30NXT5G NSR01F30/D NSR01F30NXT5G
NSR02L30NXT5G Abstract: DSN2 0201 DSN footprint Text: NSR02L30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN	Original	PDF	NSR02L30NXT5G NSR02L30/D NSR02L30NXT5G DSN2 0201 DSN footprint
NSR01L30NXT5G Abstract: No abstract text available Text: NSR01L30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN	Original	PDF	NSR01L30NXT5G NSR01L30/D NSR01L30NXT5G
NSR02F30NXT5G Abstract: No abstract text available Text: NSR02F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN	Original	PDF	NSR02F30NXT5G NSR02F30/D NSR02F30NXT5G
NSR02F30NXT5G Abstract: No abstract text available Text: NSR02F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN	Original	PDF	NSR02F30NXT5G NSR02F30/D NSR02F30NXT5G
NSR02L30NXT5G Abstract: 0201 footprint Text: NSR02L30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN	Original	PDF	NSR02L30NXT5G NSR02L30/D NSR02L30NXT5G 0201 footprint
NSR01F30NXT5G Abstract: No abstract text available Text: NSR01F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN	Original	PDF	NSR01F30NXT5G NSR01F30/D NSR01F30NXT5G
NSR01F30NXT5G Abstract: No abstract text available Text: NSR01F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN	Original	PDF	NSR01F30NXT5G NSR01F30/D NSR01F30NXT5G
Untitled Abstract: No abstract text available Text: NSR02F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN	Original	PDF	NSR02F30NXT5G NSR02F30/D
NSR01L30NXT5G Abstract: No abstract text available Text: NSR01L30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN	Original	PDF	NSR01L30NXT5G NSR01L30/D NSR01L30NXT5G
Untitled Abstract: No abstract text available Text: NSR02L30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN	Original	PDF	NSR02L30NXT5G NSR02L30/D
Untitled Abstract: No abstract text available Text: NSR01F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN	Original	PDF	NSR01F30NXT5G NSR01F30/D
Untitled Abstract: No abstract text available Text: NSR01F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN	Original	PDF	NSR01F30NXT5G NSR01F30/D
AC184 Abstract: AR108 Text: Hardware Reference Manual for i.MX53 Quick Start i.MX53 Quick Start Board Take your Multimedia Experience to the max freescale semiconductor TM Freescale Semiconductor Hardware User Guide for i.MX53 Quick Start Board,	Original	PDF	CH370 AC184 AR108

TMS4464 Abstract: TMS 2764 Texas Instruments IC mk4564 mcm6256 tms4500a Fuji Electric tv schematic diagram ET 439 power module fuji mcm6665 74L5138 TMS4500 Text: SMYOOO2 . ,MOS Memory Data Book 1984 II I III \' h' \/ Commercial and Military , :\ Specifications ' 1'/ ! . .Jf TEXAS INSTRUMENTS Alphanumeric Index, Table of Contents, Selection Guide Interchangeability Guide _ Glossary/Timing Conventions/Data Sheet Structure	Original	PDF	SMYD002 o184-464PP-142M iS-146 TMS4464 TMS 2764 Texas Instruments IC mk4564 mcm6256 tms4500a Fuji Electric tv schematic diagram ET 439 power module fuji mcm6665 74L5138 TMS4500
a3568 Abstract: S-80141ALMC aplication notes w25q32b quanta 6320 XL710 26 Pin GPIO Connector Header Extender 90 Degree Angle TXAL 228 B Text: Intel Ethernet Controller XL710 Datasheet Networking Division ND Revision: 2.1 December 2014 Legal Lines and Disclaimers No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a	Original	PDF	XL710 a3568 S-80141ALMC aplication notes w25q32b quanta 6320 XL710 26 Pin GPIO Connector Header Extender 90 Degree Angle TXAL 228 B