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Catalog Datasheet	MFG & Type	PDF	Document Tags
DNDA Abstract: No abstract text available Text: 1.0 m Process Family: XDH10 Modular 1.0μm 650V Trench Insulated BCD Process DESCRIPTION XDH10 is X-Fab´s dielectric trench insulated smart power technology. Main target applications are analog switch ICs, driver ICs for capacitive, inductive and resistive loads and EL / piezo driver ICs for	Original	PDF	XDH10 XDH10 DNDA
nd65d Abstract: nd35b nd65c PMOS XDH10 Text: 1.0 µm BCD Process XDH10 MIXED-SIGNAL FOUNDRY EXPERTS Modular 1.0µm 650V Trench Insulated BCD Process Thick SOI material together with area efficient deep trench insulation allows the design of plenty of silicon islands separated by dielectrical insulation deep enough to construct vertical devices up to 650V.	Original	PDF	XDH10 XDH10 nd65d nd35b nd65c PMOS
"X-Fab" Core cell library Abstract: nd65d RM3 transistors XDH10 analog devices transistor tutorials pnp transistor 650v mos rm3 data 20 PHB zener MOS RM3 nd35b Text: 1.0 µm BCD Process XDH10 MIXED-SIGNAL FOUNDRY EXPERTS Modular 1.0µm 650V Trench Insulated BCD Process Description XDH10 is X-Fab´s dielectric trench insulated smart power technology. Main target applications are analog switch ICs, driver ICs for capacitive, inductive and resistive loads and EL / piezo driver ICs for	Original	PDF	XDH10 XDH10 "X-Fab" Core cell library nd65d RM3 transistors analog devices transistor tutorials pnp transistor 650v mos rm3 data 20 PHB zener MOS RM3 nd35b
zener diode phc 24 Abstract: 350v ZENER DIODE -20/zener diode phc 24 Text: 1.0 µm BCD Process XDM10 MIXED-SIGNAL FOUNDRY EXPERTS Modular 1.0µm 350V Trench Insulated BCD Process Description Key Features XDM10 is X-Fab´s dielectric trench insulated smart power technology. Main target applications are analog switch ICs, driver ICs for capacitive, inductive and resistive loads and EL / piezo driver ICs for	Original	PDF	XDM10 XDM10 zener diode phc 24 350v ZENER DIODE -20/zener diode phc 24