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    X-GOLD 116 Search Results

    X-GOLD 116 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-ACPRREDAA0 Amphenol Cables on Demand RCA Male Plug Cable Connector (Red) - Amphenol ACPR-RED - Gold Plated Diecast Shell Datasheet
    AV-3.5MINYRCA-015 Amphenol Cables on Demand Amphenol AV-3.5MINYRCA-015 Stereo Y Adapter Cable - Premium Gold Stereo 3.5mm (Headphone Plug) to Dual RCA Y Adapter Cable - 3.5mm Mini-Stereo Male to Dual RCA Male 15ft Datasheet
    101015147502A Amphenol Communications Solutions T-flash Card Hingd With 15u\\ Gold Visit Amphenol Communications Solutions
    GTFP08121YHR Amphenol Communications Solutions MICRO SD,P/P,10U GOLD Visit Amphenol Communications Solutions

    X-GOLD 116 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: THIN FILM MULTI-TAP RESISTORS MSMT 116 SERIES LOG RESISTOR MECHANICAL DA TA DAT Rmax. SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BACKSIDE SURFACE 0.060" x 0.020" x 0.010" ±0.003" SILICON OR ALUMINA TANT ALUM NITRIDE ANTALUM 25,000 Å MINIMUM GOLD BARE SUBSTRA


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    T-240R0J-GB 116AT 112-D-1198 PDF

    Mini-Systems

    Abstract: No abstract text available
    Text: THIN FILM MULTI-TAP RESISTORS MSMT 116 SERIES LOG RESISTOR MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BACKSIDE SURFACE 0.060" x 0.020" x 0.010" ±0.003" SILICON OR ALUMINA TANT ALUM NITRIDE ANTALUM 25,000 Å MINIMUM GOLD BARE SUBSTRA


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    T-240R0J-GB 116AT 112-H-0306 Mini-Systems PDF

    622-0641

    Abstract: 622-3041 622-1430
    Text: IDC Systems Female Sockets FEMALE SOCKET CONNECTOR WITH 30µ INCHES GOLD .100" x .100" CENTERS LR92984 E60980 PHYSICAL PROPERTIES INSULATION MATERIAL: Glass filled thermoplastic rated UL 94V-0 COLOR: Blue CONTACTS: Beryllium copper 30µ inches minimum gold over 50µ inches nickel in contact zone;


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    LR92984 E60980 622-0641 622-3041 622-1430 PDF

    Untitled

    Abstract: No abstract text available
    Text: IDC Systems Female Sockets FEMALE SOCKET CONNECTOR WITH 15µ INCHES GOLD .100" x .100" CENTERS LR92984 E60980 PHYSICAL PROPERTIES INSULATION MATERIAL: Glass filled thermoplastic rated UL 94V-0 COLOR: Black CONTACTS: Phosphor bronze 15µ inches minimum gold over 50µ inches nickel in contact zone;


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    LR92984 E60980 PDF

    X-GOLD 118

    Abstract: xgold 118 ARM11 processor Infineon X-GOLD 116 X-GOLD x-goldtm ARM11 baseband block diagram of wireless gsm camera infineon x-gold gsm modem block diagram
    Text: Product Brief X-GOLDTM116 Ultra-low cost GSM/GPRS Single-Chip Solution for Messaging Phones Main Features THE Infineon X-GOLD 116 is the first Single-Chip in 65nm CMOS technology that integrates Baseband, RF Transceiver, Power Management Unit and FM Radio. After the successful market introduction of the 2nd generation


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    X-GOLDTM116 X-GOLDTM101 X-GOLDTM116 ARM11ances. B153-H9348-X-X-7600 NB08-1333 X-GOLD 118 xgold 118 ARM11 processor Infineon X-GOLD 116 X-GOLD x-goldtm ARM11 baseband block diagram of wireless gsm camera infineon x-gold gsm modem block diagram PDF

    12MM

    Abstract: HDAM-15-12 C12C10 c12 assembly instruction
    Text: REVISION A HDAM-XX-XX.X-X-13-X-X "D" REF PIN 11A (13 ROW PER POSITION) -11 -15 -23 3.25 .128 (REF) DO NOT SCALE FROM THIS PRINT 22.50 .886 (REF) LEAD STYLE -12.0: 12MM -17.0: 17MM CL No OF ROWS -13 PLATING SPECIFICATION -S: SELECTIVE, .000030 INCHES GOLD IN MATING AREA,


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    X-X-13-X-X WT-24-XX MPP-26-01-N) X-X-13-X-X-MKT 12MM HDAM-15-12 C12C10 c12 assembly instruction PDF

    Untitled

    Abstract: No abstract text available
    Text: UG78D6646JG Data sheets can be downloaded at www.unigen.com 64M Bytes 8M x 64 bits SYNCHRONOUS DRAM MODULE 184 Pin DDR SDRAM Unbuffered DIMM based on 4 pcs 8M x 16 DDR SDRAM 4K Refresh FEATURES • • PART IDENTIFICATION SDRAM PACKAGE PLATING 4K TSOP Gold


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    UG78D6646JG 64ms/4K) 1250mil) A0-A11: PDF

    609-F161M

    Abstract: No abstract text available
    Text: IDC Systems Female Sockets FEMALE SOCKET CONNECTOR .100" x .200" .100" x .300" CENTERS LR92984 E60980 PHYSICAL PROPERTIES INSULATION MATERIAL: Glass reinforced thermoplastic, rated UL 94V-0 COLOR: Blue CONTACT MATERIAL: Beryllium copper with 30µ inches min. gold over 50µ inches min. nickel in contact


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    LR92984 E60980 609-F141M2 609-F161M2 609-F141M 609-F161M 609-F161M PDF

    Untitled

    Abstract: No abstract text available
    Text: REVISION B SEE NOTE 2 DO NOT SCALE FROM THIS PRINT SPM-05-X-X-XXX-PF DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] OPTION -PF: PANEL FLANGE No OF POSITIONS -05 1.78 .070 REF PLATING SPECIFICATION -S: SELECTIVE, .000030 GOLD ON POST, TIN ON TAIL OR-112-01 TERMINATION


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    SPM-05-X-X-XXX-PF OR-112-01 SH41-01-X DCN-1532-32 C-296-01-X EPOXY-01 PT-YFW-12T-P TP-28 PT-1-24-02-112 PDF

    Untitled

    Abstract: No abstract text available
    Text: REVISION C SEE NOTE 2 SPM-05-X-X-XXX-PF DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] DO NOT SCALE FROM THIS PRINT OPTION -PF: PANEL FLANGE No OF POSITIONS -05 1.78 .070 REF PLATING SPECIFICATION -S: SELECTIVE, .000030 GOLD ON POST, TIN ON TAIL OR-112-01 TERMINATION


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    SPM-05-X-X-XXX-PF OR-112-01 SH41-01-X DCN-1532-32 C-296-01-X SH41-XX-X EPOXY-01 PT-YFW-12T-P TP-28 PT-1-24-02-112 PDF

    SPM-05-S-B-VT1-PF

    Abstract: No abstract text available
    Text: REVISION D SEE NOTE 2 SPM-05-X-X-XXX-PF DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] OPTION -PF: PANEL FLANGE No OF POSITIONS -05 1.78 .070 REF DO NOT SCALE FROM THIS PRINT PLATING SPECIFICATION -S: SELECTIVE, .000030 GOLD ON POST, TIN ON TAIL OR-112-01 TERMINATION


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    SPM-05-X-X-XXX-PF OR-112-01 SH41-01-X DCN-1532-32 C-296-01-X SH41-XX-X EPOXY-01A PT-YFW-12T-P TP-28 PT-1-24-02-112 SPM-05-S-B-VT1-PF PDF

    Untitled

    Abstract: No abstract text available
    Text: .156" 3.96mm Series 179 Right Angle Connector .156 (3.96) Centers Card Edge Tuning Fork Contacts PART NUMBER CODING 1 79- X X X - X X CONTACT PLATING CONTACT SURFACE AND TERMINATION 30 = .000010 GOLD OVERALL 32 = 000020 GOLD OVERALL ALL GOLD PLATED OVER .000050


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    X79-XX3-XX X79-XX4-XX X79-XX5-XX X79-XX6-XX X79-XX7-XX PDF

    Untitled

    Abstract: No abstract text available
    Text: THIN FILM MULTI TAP RESISTORS 116 SERIES LOG RESISTOR MECHANICAL DATA .060" x . 020" X .010" + .0 0 3 " SILICON OR ALUMINA TANTALUM NITRIDE 25,000 A MINIMUM GOLD BARE SUBSTRATE GOLD BACK OPTIONAL SIZE SUBSTRATE RESISTOR BONDING PADS BACKSIDE SURFACE ELECTRICAL DATA


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    150ppm -20dB 125mW 116-240ROJ-0000 240fi, CN-TF112-A-0993 PDF

    Untitled

    Abstract: No abstract text available
    Text: DIP Sockets E L E C T R O N I C S DISK M cKenzie Socket Division Open and Closed Frame DIP Sockets EXTRA LONG SOLDER TAILS 'h _ '^ 4 'S fes f c ; .116 2,95 P n U 1 H , I .183 (4,65) .020— 1 (0,51) TYP Specify . . x x x I Contact/Shell 091B 30p" Gold/10p" Gold


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    Gold/10p" Gold/200 /Tin/200 PDF

    Untitled

    Abstract: No abstract text available
    Text: Customer Information Sheet DRAWING N o .: SHEET M80-882XXXX 2 OF 2 I If IN D OUBT M80-882XXXX FIN IS 22 45 42 H : : : O F WAY S 1 7 . 22 : -S E L E C T I V E GOLD GOLD S E L E C T I V E GOLD ♦ TIN/LEAD / I00X TIN | | •2.00 x No.


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    M80-882XXXX M80-882XXXX PDF

    Untitled

    Abstract: No abstract text available
    Text: NOTES: 1. MATERIALS AND FINISHES: BODY - BRASS, GOLD PLATING CONTACT - BERYLLIUM COPPER, GOLD PLATING INSULATOR - TEFLON 2. ELECTRICAL: A. IMPEDANCE: 50 OHM B. DIELECTRIC WITHSTANDING VOLTAGE: 1000 VRMS, 3. MECHANICAL: A. DURABILITY: 500 CYCLES MIN. B. TEMPERATURE RANGE: - 65'C to + 1 6 5 X


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    116051AAZ02GA5F SMA6051A1-008-3GT50G-50 PDF

    Ab00

    Abstract: No abstract text available
    Text: REV ORDER INFORMATION A 288 90 XX XX X APP. ECN NO. DATE NEW DESIGN Plating: 2: Selective Gold 3: All Gold No. Of Contact 08 ~ 80 Pin Chart SPECIFICATION -Type * Current Rating: 1A * Withstanding Voltage: 500 VAC (1 min.) Insulation Resistance: * 1000 Megohms MIN.


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    C28890XXXXX Ab00 PDF

    Untitled

    Abstract: No abstract text available
    Text: REV A APP. ECN NO. NEW DESIGN ORDER INFORMATION 288 84 XX XX X H - Plating: 2: Selective Gold 3: All Gold No. Of Contact 08 ~ 80 Pin Chart 00: B:0.9 01: B:1.3 SPECIFICATION * Current Rating: 1 A * Withstanding Voltage: 500 VAC ( 1 min. ) * Insulation Resistance:


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    C28884XXXXX C28884XXXXX PDF

    C2888

    Abstract: No abstract text available
    Text: REV ECN NO. APP. NEW DESIGN A ORDER INFORMATION 288 84 XX XX X H - Plating: 2: Selective Gold 3: All Gold No. Of Contact 08 ~ 80 Pin Chart 00: B:0.9 01: B:1.3 SPECIFICATION * Current Rating: 1 A * Withstanding Voltage: 500 VAC ( 1 min. ) * Insulation Resistance:


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    C28884XXXXX C2888 PDF

    Untitled

    Abstract: No abstract text available
    Text: REV A ORDER INFORMATION APP. ECN NO. NEW DESIGN DATE 288 90 XX XX X I _ Plating: 2: Selective Gold 3: All Gold No. O f Contact 08 ~ 80 Pin Chart 0.7 SPECIFICATION -Type * Current Rating: 1A * Withstanding Voltage: 4-.0±0.20 500 VAC (1 m in.) o Insulation Resistance:


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    C28890XXXXX PDF

    Transistor S 40443

    Abstract: No abstract text available
    Text: bbS3T31 0024T37 flOO « A P X Philips Semiconductors NPN 7 GHz wideband transistor £ BFG197; BFG197/X; BFG197/XR AMER PHILIPS/ DIS CRETE FEATURES Product specification b?E D PINNING PIN • High power gain • Low noise figure • Gold metallization ensures


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    bbS3T31 0024T37 BFG197; BFG197/X; BFG197/XR BFG197 BFG197 OT143 BFG197/X Transistor S 40443 PDF

    transistor vc 548

    Abstract: transistor C 548 B Philips
    Text: bbSBTBl DDSMflDT Tb5 « A P X P hilips Sem iconductors NPN 12 GHz wideband transistor BFG33; BFG33/X N AUER PHILIPS/DISCRETE FEATURES Product specification b7E J> PINNING PIN • High power gain • Low noise figure • Gold metallization ensures excellent reliability.


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    BFG33; BFG33/X BFG33 BFG33/X; OT143. transistor vc 548 transistor C 548 B Philips PDF

    Untitled

    Abstract: No abstract text available
    Text: APP. REV ECN NO. A NEW DESIGN CUSTOMER COPY DATE ORDER INFORMATION 188 66 XX XX X n n n n n n n n • Plating: 2: Selective Gold 3: All Gold No. Of Contact 0 8 ~ u u u u u u u u 2.0±0.10 80 Chart — 0.50±0.05 Type 2.00*(NO OF CONTACTS/2-1) ±0.25 4.0±0.20


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    C18866XXXXX PDF

    thv8

    Abstract: HYB39S16800T 16m x 4 hyb
    Text: SIEMENS SIMM-Modules Product View S IM M -M odules Product View SIMM-Modules non-parity 2M X 32 FPM EDO FPM G = Gold leaded Semiconductor Group 26 EDO SIEMENS SIMM-Modules Product View 4M x 3 2 8M FPM EDO 32 FPM L-SIM-72-12 HYM 324020S/GS X EDO L-SIM-72-15


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    L-SIM-72-12 324020S/GS 324025S/GS L-SIM-72-15 328020S/GS 328025S/GS 364020S/GS L-SIM-72-13 364035S/GS thv8 HYB39S16800T 16m x 4 hyb PDF