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    WEIGHT OF SOP 16 PACKAGE Search Results

    WEIGHT OF SOP 16 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    WEIGHT OF SOP 16 PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    185 optocoupler 4-Pin

    Abstract: smd 4-pin DUAL DIODE smd diode code kc smd 4-pin package DUAL DIODE Diode smd code cm OPIA817ATRE OPIA814A OPIA817 OPIA1210 OPIA815
    Text: OPIA814, OPIA815, OPIA817 OPIA1210, OPIA4010 SMD, SOP and SSOP Packages Features: • • • • 5,000 Vrms electrical isolation Choice of a Single and Dual LED Phototransistor or Photo Darlington Sensor Low-cost plastic Dual-In-Line DIP package Agency Approvals:


    Original     		PDF OPIA814, OPIA815, OPIA817 OPIA1210, OPIA4010 E58730 2000pcs/Reel 185 optocoupler 4-Pin smd 4-pin DUAL DIODE smd diode code kc smd 4-pin package DUAL DIODE Diode smd code cm OPIA817ATRE OPIA814A OPIA817 OPIA1210 OPIA815

    OPIA602

    Abstract: optocoupler smd 16 pin OPIA500 OPIA500B OPIA600 OPIA601 OPIA603 OPIA604 OPIA605 ic 6 pin smd for power supply
    Text: Optocoupler—SMD and SOP Packages OPIA500, OPIA600 through OPIA605 5 Pin Features: • • • • 2,500 to 5,000 Vrms electrical isolation Choice of a Single and Dual LED Phototransistor or Photo Darlington Sensor Low-cost plastic Dual-In-Line DIP package


    Original     		PDF OPIA500, OPIA600 OPIA605 E58730 1000pcs/Reel OPIA602 optocoupler smd 16 pin OPIA500 OPIA500B OPIA601 OPIA603 OPIA604 OPIA605 ic 6 pin smd for power supply

    smd diode a6

    Abstract: ic smd 6pin for power supply ic 6 pin smd for power supply smd diode code a6 smd code a6 OPIA405C photo darlington sensor DIODE SMD A6 OPIA5010A smd diode code a.6 1
    Text: OPIA500B, OPIA4N35, OPIA4N33 OPIA2110, OPIA2210, OPIA5010, OPIA6010 SMD and SOP Packages 5 Pin Features: • • • • 3,750 or 5,000 Vrms electrical isolation Choice of a Single and Dual LED Phototransistor or Photo Darlington Sensor Low-cost plastic Dual-In-Line DIP package


    Original     		PDF OPIA500B, OPIA4N35, OPIA4N33 OPIA2110, OPIA2210, OPIA5010, OPIA6010 E58730 1000pcs/Reel smd diode a6 ic smd 6pin for power supply ic 6 pin smd for power supply smd diode code a6 smd code a6 OPIA405C photo darlington sensor DIODE SMD A6 OPIA5010A smd diode code a.6 1

    smd diode a5

    Abstract: OPIA2110A OPIA2110 OPIA2210 OPIA500 OPIA500B OPIA5010 OPIA6010 OPIA5010A ic 6 pin smd for power supply
    Text: OPIA500B, OPIA4N35, OPIA4N33 OPIA2110, OPIA2210, OPIA5010, OPIA6010 SMD and SOP Packages 5 Pin Features: • • • • 3,750 or 5,000 Vrms electrical isolation Choice of a Single and Dual LED Phototransistor or Photo Darlington Sensor Low-cost plastic Dual-In-Line DIP package


    Original     		PDF OPIA500B, OPIA4N35, OPIA4N33 OPIA2110, OPIA2210, OPIA5010, OPIA6010 E58730 1000pcs/Reel smd diode a5 OPIA2110A OPIA2110 OPIA2210 OPIA500 OPIA500B OPIA5010 OPIA6010 OPIA5010A ic 6 pin smd for power supply

    optocoupler smd 16 pin

    Abstract: smd optocoupler OPIA605 OPIA500 OPIA500B OPIA600 OPIA601 OPIA602 OPIA603 OPIA604
    Text: Optocoupler—SMD and SOP Packages OPIA500, OPIA600 through OPIA605 5 Pin Features: • • • • 2,500 to 5,000 Vrms electrical isolation Choice of a Single and Dual LED Phototransistor or Photo Darlington Sensor Low-cost plastic Dual-In-Line DIP package


    Original     		PDF OPIA500, OPIA600 OPIA605 E58730 1000pcs/Reel optocoupler smd 16 pin smd optocoupler OPIA605 OPIA500 OPIA500B OPIA601 OPIA602 OPIA603 OPIA604

    opia404b

    Abstract: OPIA405-409 opia404 OPIA401 smd optocoupler 4pin OPIA401-404 photo darlington sensor OPIA402B OPIA403B OPIA409
    Text: OPIA401 through OPIA409, OPIA414 SMD, SOP and SSOP Packages Features: • • • • 2,500 or 3,750 Vrms electrical isolation Choice of a Single and Dual LED Phototransistor or Photo Darlington Sensor Low-cost plastic Dual-In-Line DIP package Agency Approvals:


    Original     		PDF OPIA401 OPIA409, OPIA414 E58730 OPIA401-404) OPIA405-409) transmitter08 2000pcs/Reel opia404b OPIA405-409 opia404 smd optocoupler 4pin OPIA401-404 photo darlington sensor OPIA402B OPIA403B OPIA409

    smd optocoupler 4pin

    Abstract: OPIA409 OPI401ATRE OPIA401 OPIA401-404 OPIA401B OPIA402B OPIA403B OPIA405-409 OPIA414
    Text: OPIA401 through OPIA409, OPIA414 SMD, SOP and SSOP Packages Features: • • • • 2,500 or 3,750 Vrms electrical isolation Choice of a Single and Dual LED Phototransistor or Photo Darlington Sensor Low-cost plastic Dual-In-Line DIP package Agency Approvals:


    Original     		PDF OPIA401 OPIA409, OPIA414 E58730 OPIA401-404) OPIA405-409) 2000pcs/Reel smd optocoupler 4pin OPIA409 OPI401ATRE OPIA401-404 OPIA401B OPIA402B OPIA403B OPIA405-409 OPIA414

    OPIA400

    Abstract: optocoupler smd smd optocoupler 185 optocoupler 4-Pin 4 PIN IC Optocoupler with Phototransistor Output OPI400ATR OPIA400A OPIA401B OPIA402B OPIA403B
    Text: Optocoupler—SMD, SOP and SSOP Packages OPIA400 through OPIA414 Features: • • • • 2,500 to 5,000 Vrms electrical isolation Choice of a Single and Dual LED Phototransistor or Photo Darlington Sensor Low-cost plastic Dual-In-Line DIP package Agency Approvals:


    Original     		PDF OPIA400 OPIA414 E58730 2000pcs/Reel optocoupler smd smd optocoupler 185 optocoupler 4-Pin 4 PIN IC Optocoupler with Phototransistor Output OPI400ATR OPIA400A OPIA401B OPIA402B OPIA403B

    TSOP-48 pcb LAYOUT

    Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


    Original     		PDF

    land pattern for TSOP 2-44

    Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


    Original     		PDF

    BGA and QFP Package mounting

    Abstract: MCP Technology Trend EE13 jwg2 EE13 JWG SC47D tfBGA PACKAGE thermal resistance EIA and EIAJ standards Combo (Spindle VCM) Driver BGA and QFP Package EE-13
    Text: PACKAGE TRENDS 1-1 Packaging Trends Needs of electronic equipment Optimized System Integration Performance • Multiple functions • High speed • High output Outline • Small • Thin • Light Assembly • Automation • Systematization • High density


    Original     		PDF

    pioneer PAL 007 A

    Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson
    Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions


    Original     		PDF

    PAL 007 pioneer

    Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56
    Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions


    Original     		PDF

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		PDF DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram

    IC 50061

    Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing


    Original     		PDF

    d1884

    Abstract: TSOP infrared TQFP80-P-1212-0 MSM6779BAV-Z-01 MARK W1 TSOP MSM6778BAV-Z-01 DIP14-P-300-2 DIP20-P-300-2 3360D 8400B
    Text: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40


    Original     		PDF 50mil 100mil 70mil 40PQFP d1884 TSOP infrared TQFP80-P-1212-0 MSM6779BAV-Z-01 MARK W1 TSOP MSM6778BAV-Z-01 DIP14-P-300-2 DIP20-P-300-2 3360D 8400B

    DIP24-P-600-2

    Abstract: oki qfp tray SEPT24
    Text: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40


    Original     		PDF 100mil 70mil 50mil 40PQFP DIP24-P-600-2 oki qfp tray SEPT24

    weight of SOP 16 package

    Abstract: FPT-16P-M06
    Text: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN PLASTIC FPT-16P-M06 16-pin plastic SOP FPT-16P-M06 16-pin plastic SOP (FPT-16P-M06) Lead pitch 1.27 mm Package width x package length 5.3 × 10.15 mm Lead shape Gullwing Sealing method


    Original     		PDF FPT-16P-M06 16-pin FPT-16P-M06) P-SOP16-5 F16015S-c-4-7 weight of SOP 16 package FPT-16P-M06

    NEC stacked MCP 1999

    Abstract: Stacked CSP 1999 MCP Technology Trend 13B1 NEC stacked CSP memory NEC stacked CSP 2000 Hitachi Stacked CSP sharp calculator
    Text: Packaging Trends for Mobile Application Morihiro Kada Abstract The advent of the CSP has heralded a new paradigm in semiconductor packaging technology. Previously overshadowed by IC chips, packaging technology has begun to take center stage as a key factor in product competitiveness. Packaging technology will develop into 3D packages, and will create a


    Original     		PDF

    SMD MARKING CODE 071 A01

    Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
    Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods


    Original     		PDF LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo

    uhf varicap

    Abstract: 100MHZ 12MHZ 16PIN 1T362 1T363 CXA1665AM CXA1665AM-S CTV TUNER uhf varicap diode
    Text: CXA1665AM/AM-S All Band TV Tuner IC VHF-CATV-UHF Description The CXA1665AM/AM-S is a single chip TV tuner IC which performs as an oscillator, mixer for VHF/CATV and UHF bands. An IF amplifier is also provided. This IC adopts a 16-pin SOP package in response


    Original     		PDF CXA1665AM/AM-S CXA1665AM/AM-S 16-pin OP-16P-L01 OP016-P-0300-A CXA1665AM-S 16PIN OP-16P-L04 OP016-P-0300 uhf varicap 100MHZ 12MHZ 1T362 1T363 CXA1665AM CXA1665AM-S CTV TUNER uhf varicap diode

    B43876

    Abstract: B43875 B43991 B41684 B43405 B82727-C1-A1 B43471 B43465 b41876 B43406
    Text: SAW Components Data Sheet B7725, Pb-free SAW Components B7725 Low-Loss Filter 1575,42 MHz Data Sheet Chip Sized SAW Package QCS5H Features 0,1 Low loss RF filter for GPS receivers Unbalanced to balanced operation Low amplitude ripple Impedance transformation from 50 Ω


    Original     		PDF B7725, B7725 B7725 B39162-B7725-K910 C61157-A7-A139 F61074-V8189-Z000 2002/95/EC 2005/747/EC B43876 B43875 B43991 B41684 B43405 B82727-C1-A1 B43471 B43465 b41876 B43406

    oki qfp tray

    Abstract: 353512 ssop64 P-BGA256-2727-1 QFJ28-P-S450-1 QFP304-P-4040-0 ZIP28 QFP100-P-1420-0 LQFP144-P-2020-0 P-BGA352-3535-1
    Text: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40


    Original     		PDF 50mil 100mil 70mil 40PQFP oki qfp tray 353512 ssop64 P-BGA256-2727-1 QFJ28-P-S450-1 QFP304-P-4040-0 ZIP28 QFP100-P-1420-0 LQFP144-P-2020-0 P-BGA352-3535-1

    MARK W1 TSOP

    Abstract: weight of SOP 16 package MSM548332 weight of SOP package
    Text: O K I Semiconductor Packaging Multiport DRAM Products Packaging OKU Semiconductor Packaging Field Memory Products Package Name MSM514212 No. of Pins zs GS TS TS JS DIP ZIP SOP TSOP Typen TQFP SOJ O 28 r '\ 16 MSM514221B RS r o 20 O 26/20 o 16 MSM514222B o


    OCR Scan     		PDF MSM514212 MSM514221B MSM514222B MSM514223B MSM518221 MSM518222 MSM5412222 MSM548333 MSM548332 MSM548331 MARK W1 TSOP weight of SOP 16 package weight of SOP package