SPANSION date code format
Abstract: AM29 T0003 Am29f 405 gde 8 905 959 252
Text: Chapter 8 Die and Wafer Shipments CHAPTER 8 DIE AND WAFER SHIPMENTS Introduction Product Carrier Guide for Die and Wafers Storage Conditions for Die and Wafer Carrier Designs for Singulated Die Waffle Pack Surftape and Reel Carrier Designs for Wafers Wafer Jar
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AM29
Abstract: 29f800bb AMD xp
Text: u Chapter 11 Die and Wafer Shipments CHAPTER 11 DIE AND WAFER SHIPMENTS Introduction Product Carrier Guide for Die and Wafers Carrier Designs for Singulated Die Waffle Pack Surftape and Reel GEL-PAK Die Tray Carrier Designs for Wafers Wafer Jar GEL-PAK Wafer Tray
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60Co
Abstract: No abstract text available
Text: Intersil White Paper Specialty Products Space and Defense Wafer by Wafer Low Dose Rate Acceptance Testing in a Production Environment Abstract—This White Paper describes technical details of a wafer by wafer low dose rate acceptance testing program being implemented for all Intersil radiation hardened products. We
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Abstract: No abstract text available
Text: Wafer-carrier Mounting Photomicrosensors EE-SPY801/802 Photomicrosensors for detecting wafer-carrier mounting. • The mounting position is set with a pedestal. ■ The contact surface with the wafer carrier uses a special chemical-resistant fluoro-resin.
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EE-SPY801/802
EE-SPY801
EE-SPY802
X064-E1-02
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two leg infrared receiver led
Abstract: EE9-C01 IT16 power window construction details ethylene gas sensor
Text: Wafer-carrier Mounting Photomicrosensors EE-SPY801/802 CSM_EE-SPY801_802_DS_E_3_1 Photomicrosensors for detecting wafer-carrier mounting. • The mounting position is set with a pedestal. • The contact surface with the wafer carrier uses a special chemicalresistant fluororesin.
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EE-SPY801/802
EE-SPY801
two leg infrared receiver led
EE9-C01
IT16
power window construction details
ethylene gas sensor
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IC weight sensor
Abstract: chloride ups circuit diagram relay 24v omron two leg infrared receiver led 12V ENERGY LIGHT CIRCUIT DIAGRAM EE-SPX303 hydrocarbon sensor hydrogen gas sensor omron plc Pulsating photoelectric Optical Sensor datasheet
Text: Wafer-carrier Mounting Photomicrosensors EE-SPY801/802 Photomicrosensors for detecting wafer-carrier mounting. • The mounting position is set with a pedestal. ■ The contact surface with the wafer carrier uses a special chemical-resistant fluoro-resin.
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EE-SPY801/802
EE-SPY801
IC weight sensor
chloride ups circuit diagram
relay 24v omron
two leg infrared receiver led
12V ENERGY LIGHT CIRCUIT DIAGRAM
EE-SPX303
hydrocarbon sensor
hydrogen gas sensor
omron plc
Pulsating photoelectric Optical Sensor datasheet
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scfm 50 10 kv
Abstract: No abstract text available
Text: APS/SPS200TESLA 200 mm Fully-Automated On-Wafer Probing Solution for High-Power Devices DATA SHEET The APS/SPS200TESLA is the industry’s irst fully-automated on-wafer probing solution focused on production performance for high-power semiconductors. The APS/SPS200TESLA improves productivity and yield at inal test by enabling production wafer
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APS/SPS200TESLA
APS/SPS200TESLA
APS/SPS200TESLA-DS-1113
scfm 50 10 kv
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MIFARE Card IC Coil Design Guide
Abstract: MIFARE s70 chip Philips MF1 IC S70 General Wafer Specification MF1 IC S70 k 1356 12NC ordering code philips MIFARE s70 philips application notes philips 15601
Text: INTEGRATED CIRCUITS ADDENDUM Standard 4Kbyte Card IC MF1 IC S70 01 Wafer Specification Product Specification Revision 3.1 PUBLIC Philips Semiconductors October 2002 Philips Semiconductors Wafer Specification Rev. 3.1 October 2002 Standard 4Kbyte Card IC MF1 IC S70 01
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SCA74
MIFARE Card IC Coil Design Guide
MIFARE s70 chip
Philips MF1 IC S70
General Wafer Specification
MF1 IC S70
k 1356
12NC ordering code philips
MIFARE s70
philips application notes
philips 15601
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Untitled
Abstract: No abstract text available
Text: PRESS RELEASE CYPRESS RESTRUCTURES: SAN JOSE WAFER FACILITY TO BE R&D ONLY SAN JOSE, California. . .October 14, 1996. . .Cypress Semiconductor Corporation [NYSE: CY] today announced a restructuring of its San Jose wafer fabrication facility, including a workforce
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MIFARE Card IC Coil Design Guide
Abstract: Philips MF1 IC S50 Mifare MF1 S50 Philips Mifare 1 S50 Philips Mifare 1 S50 specifications philips S50 MF1 S50 mifare s50 MIFARE card MF1 IC S50 S5005
Text: INTEGRATED CIRCUITS ADDENDUM Standard Card IC MF1 IC S50 05 Wafer Specification Revision 3.0 PUBLIC Philips Semiconductors October 2002 Philips Semiconductors Rev. 3.0 October 2002 Wafer Specification Standard Card IC MF1 IC S50 05 CONTENTS 1 SCOPE 3 2 REFERENCE DOCUMENTS
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SCA74
MIFARE Card IC Coil Design Guide
Philips MF1 IC S50
Mifare MF1 S50
Philips Mifare 1 S50
Philips Mifare 1 S50 specifications
philips S50
MF1 S50
mifare s50 MIFARE card
MF1 IC S50
S5005
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Ablebond 84-1*SR4
Abstract: z9925 EIAJ ED-4701 MARK A48 857L TSMC 0.35um Volt, SPDM, CMOS 98068A 0.6 um cmos process ablebond 84-1lmisr4
Text: Reliability Summary Report PI6CV857A August 28, 2002 Reliability by Design Page 1 of 20 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:
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PI6CV857A
Ablebond 84-1*SR4
z9925
EIAJ ED-4701
MARK A48
857L
TSMC 0.35um
Volt, SPDM, CMOS
98068A
0.6 um cmos process
ablebond 84-1lmisr4
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MIFARE s70 chip
Abstract: Philips MF1 IC S70 General Wafer Specification MIFARE s70 UV-tape MIFARE Card IC Coil Design Guide S7001 MIFARE Card Coil Design Guide
Text: INTEGRATED CIRCUITS ADDENDUM Standard 4Kbyte Card IC MF1 IC S70 01 Specification “sawn wafer on UV-tape” Product Specification Revision 3.0 PUBLIC Philips Semiconductors August 2004 Philips Semiconductors Rev. 3.0 August 2004 Sawn wafer on UV-tape MF1 IC S70 01
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SCA74
MIFARE s70 chip
Philips MF1 IC S70
General Wafer Specification
MIFARE s70
UV-tape
MIFARE Card IC Coil Design Guide
S7001
MIFARE Card Coil Design Guide
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uv-tape
Abstract: Philips MF1 IC S50 Philips Mifare 1 S50 Mifare MF1 S50 MF1 S50 mifare s50 mifare s50 MIFARE mifare mf1 ic s50 MF1 IC S50 MF1ICS5005
Text: INTEGRATED CIRCUITS ADDENDUM Standard Card IC MF1 IC S50 05 Specification “sawn wafer on UV-tape” Revision 3.0 PUBLIC Philips Semiconductors August 2004 Philips Semiconductors Rev. 3.0 August 2004 sawn wafer on UV-tape Standard Card IC MF1 IC S50 05 CONTENTS
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SCA74
uv-tape
Philips MF1 IC S50
Philips Mifare 1 S50
Mifare MF1 S50
MF1 S50
mifare s50
mifare s50 MIFARE
mifare mf1 ic s50
MF1 IC S50
MF1ICS5005
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QCI-39000
Abstract: QCI-30014 SPI-41014 microchip lot code
Text: M PACKAGING Overview of Microchip Die/Wafer Support INTRODUCTION ELECTRICAL SPECIFICATIONS Microchip Technology Inc. devices are available in wafer form and in die form. All products sold in die or wafers have been characterized and qualified according to the requirements of Microchip Technology Inc.
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SPI-41014,
QCI-39000,
DS30258C-page
QCI-39000
QCI-30014
SPI-41014
microchip lot code
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cpc9909
Abstract: 6-pin smps power control ic cpc1943 MXHV9910 0-10v to 4-20ma Line Driver SHDSL IX2127 CPC1230 opamps catalog deutsch relays inc
Text: Clare, a wholly owned subsidiary of IXYS Corporation, located 20 miles north of Boston, Massachusetts, USA, designs, manufactures, and markets a wide variety of semiconductor devices. Clare’s wafer fabrication facility features a 600V BCDMOS process on a bonded-wafer, silicon-on-insulator, trench-isolated
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MX887P
MX844
12-Bit
MX887D
cpc9909
6-pin smps power control ic
cpc1943
MXHV9910
0-10v to 4-20ma
Line Driver SHDSL
IX2127
CPC1230
opamps catalog
deutsch relays inc
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QCI-39000
Abstract: QCI-30014 30014 dry cooling tower RG41 200B
Text: M PACKAGING Overview of Microchip Die/Wafer Support INTRODUCTION ELECTRICAL SPECIFICATIONS Microchip Technology Inc. devices are available in wafer form and in die form. All products sold in die or wafers have been characterized and qualified according to the requirements of Microchip Technology Inc.
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SPI-41014,
QCI-39000,
DS30258C-page
QCI-39000
QCI-30014
30014
dry cooling tower
RG41
200B
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abb traction motor
Abstract: diode 6.5 kv 5SMY 12M4500 76E-12 IGBT 6500 V 86M1280 5SMY86J1280 ABB IGBT 76J1280 76M12
Text: IGBT and Diode dies ABB Semiconductors ABB IGBT and Diode dies from stateof-the-art SPT planar technology platform. Fig.1 Un-sawn wafer, sawn wafer die on frame and pick-and-place dies in waffle-packs ABB Semiconductor has a well established reputation in the
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CH-5600
1768/138a
29palms
abb traction motor
diode 6.5 kv
5SMY 12M4500
76E-12
IGBT 6500 V
86M1280
5SMY86J1280
ABB IGBT
76J1280
76M12
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HP8341B
Abstract: HP4145 hp11612a 8970B TRANSISTOR noise figure measurements footprint transistor Plessey
Text: On Wafer Noise Measurement Using Bipolar Transistor RF Test Structures S.D. Connor Bipolar Characterization Group, Central R&D, G.E.C. Plessey Semiconductors, Tweedale Way, Oldham, Lancs OL9 7LA, England. Abstract:- We present here a technique for on wafer noise we measurements using bipolar R.F. cell structures. Measurements were taken
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TSMC 0.35um
Abstract: ED-4701-3-B122A tsmc 0.35 um CMOS gate area PBGA 256 reflow profile Volt, SPDM, CMOS ED-4701-1-C111A ISO-9000 PI7C7300 PI7C8150-33 PI7C8152
Text: Reliability Summary Report PCI Bridge Products March 20, 2003 Updated Total Life Test Hours Reliability by Design Page 1 of 16 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:
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dycostrate
Abstract: CH-2074 without underfill
Text: Wafer Level CSP with Solder Support Structure Jörg Jasper EM-Marin S.A., Rue des Sors 3, CH-2074 Marin, Switzerland Jürgen Simon Technical University of Berlin, Gustav-Meyer-Allee 25, D-13355 Berlin, Germany Abstract Chip scale package CSP and flip chip interconnects proliferate in telecommunication and other portable products. Wafer level CSP
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CH-2074
D-13355
dycostrate
without underfill
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Untitled
Abstract: No abstract text available
Text: 10 53261-* 51021-* WAFER ASSY REC.HOUSING A W LEAK MATING LENGTH PLUG TERMINAL 50079-* REC.TERMINAL 53261-* 50079-* 51D21-* G ENERAL U N L E S S TO LERAN C ES S P E C IF IE D DIMENSION STYLE WAFER ASSY TERMINAL REC. HOUSING SCALE MM ONLY
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51D21-*
SD-5S261-02Y
EN-02JAI021)
SD-5326I024.
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Untitled
Abstract: No abstract text available
Text: 10 53261-* 51021-* WAFER ASSY REC.HOUSING A W LEAK MATING LENGTH PLUG TERMINAL 50079-* REC.TERMINAL 53261-* 50079-* 51D21-* G ENERAL U N L E S S TO LERAN C ES S P E C IF IE D DIMENSION STYLE WAFER ASSY TERMINAL REC. HOUSING SCALE MM ONLY
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51D21-*
SD-5S261-02Y
EN-02JAI021)
SD-5326I024.
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Untitled
Abstract: No abstract text available
Text: 10 53261-* 51021-* WAFER ASSY REC.HOUSING A W LEAK MATING LENGTH PLUG TERMINAL 50079-* REC.TERMINAL 53261-* 50079-* 51D21-* G EN ERAL TO LERAN C ES U N L E S S S P E C IF IE D DIMENSION STYLE WAFER ASSY TERMINAL REC. HOUSING SCALE MM ONLY
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51D21-*
MXJ-32
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Untitled
Abstract: No abstract text available
Text: 12 13 11 10 NOTES UNLESS OTHERWISE SPECIFIED : 1. MATERIALS: WAFER MATERIAL NUMBER CONTACT PLATING MINIMUM GOLD THICKNESS WAFER PLASTIC COLOR 7 5 1 8 7 -0 0 0 5 0.00076m m OOuin) BLACK 7 5 1 S 7-0055 0.00127mm (50uh) GRAY 751 87-1005 0.00076m m OOuin) BLACK
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00076m
00127mm
SD-75187-001
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