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Microsemi Corporation W3H128M72E-533SBI
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Bristol Electronics	W3H128M72E-533SBI		22			1 - 10 - 100 - 1000 - 10000 -	Get Quote
Microchip Technology Inc W3H128M72E-400SBI WHIW3H128M72E-400SBI (Alt: W3H128M72E-400SBI)
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Avnet Silica	W3H128M72E-400SBI			53 Weeks	1	1 - 10 - 100 - 1000 - 10000 -	Buy Now
Microchip Technology Inc W3H128M72E-667NBI WHIW3H128M72E-667NBI (Alt: W3H128M72E-667NBI)
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Avnet Silica	W3H128M72E-667NBI			61 Weeks	1	1 - 10 - 100 - 1000 - 10000 -	Buy Now
Microchip Technology Inc W3H128M72E-400SBM DRAM Module DDR2 SDRAM 1Gbyte (Alt: W3H128M72E-400SBM)
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Avnet Silica	W3H128M72E-400SBM			61 Weeks	1	1 - 10 - 100 - 1000 - 10000 -	Buy Now

W3H128M72E Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
W3H128M72 Abstract: W3H128M72E-XSBX W3H128M72E Text: White Electronic Designs W3H128M72E-XSBX Advanced* 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Package: CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm	Original	PDF	W3H128M72E-XSBX W3H128M72 W3H128M72E-XSBX W3H128M72E
W3H128M72E-XSBX Abstract: 84 FBGA Text: White Electronic Designs W3H128M72E-XSBX 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400  Package:  CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm  Posted CAS additive latency: 0, 1, 2, 3 or 4	Original	PDF	W3H128M72E-XSBX 775mA 975mA -100ps 250ps 350ps 400ps W3H128M72E-XSBX 84 FBGA
W3H128M72ER-XSBX Abstract: LDM-1 W3H128M72 Text: White Electronic Designs W3H128M72ER-XNBX PRELIMINARY* 128M x 72 REGISTERED DDR2 SDRAM 255 PBGA FEATURES  Data rate = 667, 533, 400 Mb/s  Posted CAS additive latency: 0, 1, 2, 3 or 4  Package:  Write latency = Read latency - 1* tCK  Commercial, Industrial and Military Temperature	Original	PDF	W3H128M72ER-XNBX W3H128M72ER-XSBX LDM-1 W3H128M72
Untitled Abstract: No abstract text available Text: W3H128M72ER-XNBX ADVANCED* 128M x 72 REGISTERED DDR2 SDRAM 255 PBGA FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  45% Space savings vs. FBGA  Package:  Reduced part count • 255 Plastic Ball Grid Array PBGA , 23 x 21mm  51% I/O reduction vs FBGA	Original	PDF	W3H128M72ER-XNBX
Untitled Abstract: No abstract text available Text: W3H128M72E-XSBX W3H128M72E-XNBX 1GB – 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  56% space savings vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 22mm	Original	PDF	W3H128M72E-XSBX W3H128M72E-XNBX
Untitled Abstract: No abstract text available Text: White Electronic Designs W3H128M72E-XSBX 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400  Package:  CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm  Posted CAS additive latency: 0, 1, 2, 3 or 4	Original	PDF	W3H128M72E-XSBX W3H128M72E-XSBX
Untitled Abstract: No abstract text available Text: W3H128M72E-XSBX W3H128M72E-XNBX 1GB – 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Commercial, Industrial and Military Temperature Ranges  Data rate = 667, 533, 400  Organized as 128M x 72  Package:  Weight: W3H128M72E-XSBX - 4 grams max	Original	PDF	W3H128M72E-XSBX W3H128M72E-XNBX W3H128M72E-XSBX W3H128M72E-XNBX
W3H128M72ER-XSBX Abstract: 74sstu32864 Text: White Electronic Designs W3H128M72ER-XSBX ADVANCED* 128M x 72 REGISTERED DDR2 SDRAM 255 PBGA FEATURES Data rate = 667, 533, 400 Package: CK/CK# Termination options available • 0 ohm, 20 ohm • 255 Plastic Ball Grid Array PBGA , 22 x 26mm Posted CAS additive latency: 0, 1, 2, 3 or 4	Original	PDF	W3H128M72ER-XSBX W3H128M72ER-XSBX 74sstu32864
W3H128M72E-XSBX Abstract: No abstract text available Text: White Electronic Designs W3H128M72E-XSBX PRELIMINARY* 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Package: CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm	Original	PDF	W3H128M72E-XSBX A0-12 A0-13 W3H128M72E-XSBX
Untitled Abstract: No abstract text available Text: White Electronic Designs W3H128M72E-XNBX ADVANCED* 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Mb/s Posted CAS additive latency: 0, 1, 2, 3 or 4 Package: Write latency = Read latency - 1* tCK • 208 Plastic Ball Grid Array PBGA , 16 x 22mm	Original	PDF	W3H128M72E-XNBX
Untitled Abstract: No abstract text available Text: W3H128M72ER-XNBX ADVANCED* 128M x 72 REGISTERED DDR2 SDRAM 255 PBGA FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  45% Space savings vs. FBGA  Package:  Reduced part count • 255 Plastic Ball Grid Array PBGA , 23 x 21mm  51% I/O reduction vs FBGA	Original	PDF	W3H128M72ER-XNBX
W3H128M72E-XSBX Abstract: No abstract text available Text: White Electronic Designs W3H128M72E-XSBX 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Package: CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Posted CAS additive latency: 0, 1, 2, 3 or 4	Original	PDF	W3H128M72E-XSBX W3H128M72E-XSBX
W3H128M72ER-XSBX Abstract: M2 8gb pinout Text: White Electronic Designs W3H128M72ER-XSBX PRELIMINARY* 128M x 72 REGISTERED DDR2 SDRAM 255 PBGA FEATURES Data rate = 667, 533, 400 Mb/s Posted CAS additive latency: 0, 1, 2, 3 or 4 Package: Write latency = Read latency - 1* tCK Commercial, Industrial and Military Temperature	Original	PDF	W3H128M72ER-XSBX W3H128M72ER-XSBX M2 8gb pinout
W3J2256M72-XPBX Abstract: W3J128M64G-XPBX DDR1 512M W3J128M72G-XPBX 256mb EEPROM Memory ddr3 sdram chip 128mb W3H128M72 w3j128m72 BGA NAND Flash W72M64VB-XBX Text: Microelectronics Catalog Quick Reference Guide Extended Temperature Plastics — Memories DDR3 SDRAM MCPs Size 1GB 1GB 2GB 4GB Organization 128M x 64 128M x 72 256M x 72 512M x 72 Part Number W3J128M64G-XPBXƒ W3J128M72G-XPBXƒ W3J256M72G-XPBX* W3J2256M72-XPBX*	Original	PDF	W3J128M64G-XPBX W3J128M72G-XPBX W3J256M72G-XPBX* W3J2256M72-XPBX* W3H32M64E-XSBX W3H32M72E-XSB2X W3H64M64E-XSBX W3H64M72E-XSBX W3H128M72E-XSBX W3H128M64E-XSBX W3J2256M72-XPBX W3J128M64G-XPBX DDR1 512M W3J128M72G-XPBX 256mb EEPROM Memory ddr3 sdram chip 128mb W3H128M72 w3j128m72 BGA NAND Flash W72M64VB-XBX

w3j128m72 Abstract: ddr sram 256mb 2.5 pata DDR2 128M x 32 W3H128M72E-XSBX 256mb EEPROM Memory W3J128M72G-XNBX NAND Flash Qualification Reliability WEDPZ512K72V-XBX DDR2 x32 Text: Microelectronics Catalog Quick Reference Guide Extended Temperature Plastics — Memories DDR3 SDRAM MCPs Size 1GB 1GB 1GB 1GB Organization 256M x 32 128M x 64 128M x 72 2 x 256M x 16 Part Number W3J256M32G-XNBXƒ W3J128M64G-XNBXƒ W3J128M72G-XNBXƒ W3J2256M16G-XNBXƒ	Original	PDF	W3J256M32G-XNBX W3J128M64G-XNBX W3J128M72G-XNBX W3J2256M16G-XNBX W3H32M64E-XSBX W3H32M72E-XSB2X W3H64M64E-XSBX W3H64M72E-XSBX W3H128M72E-XSBX W3H128M64E-XSBX w3j128m72 ddr sram 256mb 2.5 pata DDR2 128M x 32 W3H128M72E-XSBX 256mb EEPROM Memory W3J128M72G-XNBX NAND Flash Qualification Reliability WEDPZ512K72V-XBX DDR2 x32