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    W-CSP FOOTPRINT Search Results

    W-CSP FOOTPRINT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    R5F513T5ADFJ#30 Renesas Electronics Corporation 32-bit Microcontrollers for Single Motor control Applications; Reduces Footprint and BOM Costs Visit Renesas Electronics Corporation
    R5F513T5ADNE#20 Renesas Electronics Corporation 32-bit Microcontrollers for Single Motor control Applications; Reduces Footprint and BOM Costs Visit Renesas Electronics Corporation
    R5F513T3ADFL#10 Renesas Electronics Corporation 32-bit Microcontrollers for Single Motor control Applications; Reduces Footprint and BOM Costs Visit Renesas Electronics Corporation
    R5F513T3ADFL#30 Renesas Electronics Corporation 32-bit Microcontrollers for Single Motor control Applications; Reduces Footprint and BOM Costs Visit Renesas Electronics Corporation
    R5F513T5AGNH#20 Renesas Electronics Corporation 32-bit Microcontrollers for Single Motor control Applications; Reduces Footprint and BOM Costs Visit Renesas Electronics Corporation

    W-CSP FOOTPRINT Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    W-CSP footprint

    Abstract: MO-211-C DM056 wcsp package reliability WLCSP stencil design EH11 wcsp wcsp qualification WAN0158
    Text: w WAN_0202 Guidelines on How to Use W-CSP Packages and Create Associated PCB Footprints INTRODUCTION The Wolfson Wafer level ChipScale Package W-CSP is a die-sized package, which obtains electrical contact via solder bumps on the bottom surface of the device to a Printed Circuit Board


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    mdfn60

    Abstract: smd transistor marking j8 C1608X7R1H104KT JESD78 NCP2820 NCP2820FCT1G NCP2820FCT2G NCP2820MUTBG BD8x
    Text: NCP2820 2.65 W Filterless Class−D Audio Power Amplifier Features • Optimized PWM Output Stage: Filterless Capability • Efficiency up to 90% • • • • • • • Low 2.5 mA Typical Quiescent Current Large Output Power Capability: 1.4 W with 8.0 W Load CSP and


    Original     		PDF NCP2820 NCP2820/D mdfn60 smd transistor marking j8 C1608X7R1H104KT JESD78 NCP2820 NCP2820FCT1G NCP2820FCT2G NCP2820MUTBG BD8x

    Untitled

    Abstract: No abstract text available
    Text: NCP2820 2.65 W Filterless Class−D Audio Power Amplifier Features • Optimized PWM Output Stage: Filterless Capability • Efficiency up to 90% • • • • • • • Low 2.5 mA Typical Quiescent Current Large Output Power Capability: 1.4 W with 8.0 W Load CSP and


    Original     		PDF NCP2820 NCP2820/D

    oki qfp tray

    Abstract: 1000H ED-4701 72 ball w-csp SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY wcsp reliability FBGA tray mobile phone
    Text: Oki’s Wafer Level Chip Size Packaging Technology 1 W-CSP 12/02 The Market’s Requirement for a New Packaging Technology • The need for increased functionality, smaller device size and lower costs are major challenges for today’s design engineers < •


    Original     		PDF 30min 30min 1000H 100cyc 300cyc 500cyc ED-4701 oki qfp tray 1000H ED-4701 72 ball w-csp SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY wcsp reliability FBGA tray mobile phone

    LG LX

    Abstract: DIODE MARKING code UG 45
    Text: NCP5230 Product Preview Precise Low Voltage Synchronous Buck Controller with Power Saving Mode http://onsemi.com MARKING DIAGRAMS 1 5230 A L Y W G Features • • • *Note: Microdot may be in either location VCC ROSC/EN CSP PIN CONNECTIONS 16 15 14 13


    Original     		PDF NCP5230 QFN16 NCP5230/D LG LX DIODE MARKING code UG 45

    Untitled

    Abstract: No abstract text available
    Text: NCP81031 Product Preview Low Voltage Synchronous Buck Controller with Power Saving and Transient Enhancement Features http://onsemi.com MARKING DIAGRAMS 1 XXXXX A L Y W G Features • • • • Note: Microdot may be in either location VCC ROSC/EN CSP PIN CONNECTIONS


    Original     		PDF NCP81031 NCP81031/D

    NCP2820AFCT2G

    Abstract: smd transistor marking j5 C1608X7R1H104KT JESD78 J-STD-020A NCP2820 NCP2820FCT1G MPZ1608S221A1 marking code NF SMD Transistor A2 SMD CODE MARKING
    Text: NCP2820 Series 2.65 W Filterless Class-D Audio Power Amplifier http://onsemi.com MARKING DIAGRAMS 1 9-PIN FLIP-CHIP CSP FC SUFFIX CASE 499AL C1 xx A Y WW G = AQ for NCP2820 = BD for NCP2820A = Assembly Location = Year = Work Week = Pb-Free Package 8 Features


    Original     		PDF NCP2820 499AL NCP2820 NCP2820A NCP2820A NCP2820/D NCP2820AFCT2G smd transistor marking j5 C1608X7R1H104KT JESD78 J-STD-020A NCP2820FCT1G MPZ1608S221A1 marking code NF SMD Transistor A2 SMD CODE MARKING

    Untitled

    Abstract: No abstract text available
    Text: NCP2820 Series 2.65 W Filterless Class-D Audio Power Amplifier http://onsemi.com MARKING DIAGRAMS 1 9-PIN FLIP-CHIP CSP FC SUFFIX CASE 499AL C1 xx A Y WW G = AQ for NCP2820 = BD for NCP2820A = Assembly Location = Year = Work Week = Pb-Free Package 8 Features


    Original     		PDF NCP2820 499AL NCP2820 NCP2820A NCP2820A NCP2820/D

    PCB design for very fine pitch csp package

    Abstract: 0.3mm pitch csp package oki pitch wcsp reliability 0.4mm pitch BGA 2asic oki packaging gps watch ceramic QFP Package 100 lead
    Text: Oki’s ASIC Wafer Level Chip Size Packaging Technology Overview March 2004 1 ASIC W-CSP 02/04 The Market’s Requirement for New ASIC Packaging Technology • The need for increased functionality, smaller device size and lower costs are major challenges for today’s ASIC design engineers


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    Untitled

    Abstract: No abstract text available
    Text: NCP81147 Precise Low Voltage Synchronous Buck Controller with Power Saving Mode http://onsemi.com MARKING DIAGRAMS 1 81147 A L Y W G Features • • • *Note: Microdot may be in either location ROSC/EN 16 15 14 CSP VCC PIN CONNECTIONS 13 12 CSN/VO LG 2


    Original     		PDF NCP81147 NCP81147/D

    Untitled

    Abstract: No abstract text available
    Text: NCP2820 Series 2.65 W Filterless Class-D Audio Power Amplifier http://onsemi.com MARKING DIAGRAMS 1 9−PIN FLIP−CHIP CSP FC SUFFIX CASE 499AL C1 xx A Y WW G • • • • • • • • • • • = AQ for NCP2820 = BD for NCP2820A = Assembly Location


    Original     		PDF NCP2820 NCP2820/D

    Untitled

    Abstract: No abstract text available
    Text: NCP2820 Series 2.65 W Filterless Class-D Audio Power Amplifier http://onsemi.com MARKING DIAGRAMS 1 9−PIN FLIP−CHIP CSP FC SUFFIX CASE 499AL C1 xx A Y WW G • • • • • • • • • • • • = AQ for NCP2820 = BD for NCP2820A = Assembly Location


    Original     		PDF NCP2820 499AL NCP2820 NCP2820A NCP2820A NCP2820/D

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


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    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


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    CM1442-06l

    Abstract: MARKING 1053
    Text: CM1442-06LP LCD and Camera EMI Filter Array with ESD Protection Functional Description Features • Six Channels of EMI Filtering with Integrated ESD Protection • 0.4 mm Pitch, 15−Bump, 2.360 mm x 1.053 mm Footprint Chip • • • • • Scale Package CSP


    Original     		PDF CM1442-06LP CM1442-06LP CM1442-06LP/D CM1442-06l MARKING 1053

    Untitled

    Abstract: No abstract text available
    Text: SiT1542 Preliminary Smallest Footprint 1.2mm2 , Ultra-Low Power 32.768 kHz Oscillator in CSP for Single-Cell Li+ Unregulated Battery Powered Applications The Smart Timing Choice The Smart Timing Choice Features Applications  Supply voltage optimized for Li+ battery voltage: 2.7V to 4.3V


    Original     		PDF SiT1542

    Untitled

    Abstract: No abstract text available
    Text: SiT1532 Preliminary Smallest Footprint 1.2mm2 , Ultra-Low Power 32.768 kHz Oscillator in CSP The Smart Timing Choice The Smart Timing Choice Features Applications  Smallest footprint in chip-scale (CSP): 1.5 x 0.8 mm  Mobile Phones  Ultra-low power: <1µA


    Original     		PDF SiT1532

    SMD capacitor aa4 aa5

    Abstract: No abstract text available
    Text: SiT1532 Preliminary Smallest Footprint 1.2mm2 , Ultra-Low Power 32.768 kHz Oscillator in CSP The Smart Timing Choice The Smart Timing Choice Features Applications  Smallest footprint in chip-scale (CSP): 1.5 x 0.8 mm  Mobile Phones  Ultra-low power: <1 µA


    Original     		PDF SiT1532 SMD capacitor aa4 aa5

    32.768Khz oscillator SMD

    Abstract: No abstract text available
    Text: SiT1544 Preliminary Smallest Footprint 1.2mm2 , Ultra-Low Power 1 Hz - 32.768 kHz Programmable Oscillator for Li+ Unregulated Battery Powered Applications The Smart Timing Choice The Smart Timing Choice Features Applications  Factory programmable from 32.768 kHz down to 1 Hz


    Original     		PDF SiT1544 32.768Khz oscillator SMD

    01802

    Abstract: No abstract text available
    Text: Si8401DB Vishay Siliconix P-Channel 20-V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) - 20 RDS(on) (Ω) ID (A) 0.065 at VGS = - 4.5 V - 4.9 0.095 at VGS = - 2.5 V - 4.1 • TrenchFET Power MOSFET • MICRO FOOT® Chipscale Packaging Reduces Footprint Area Profile (0.62 mm) and


    Original     		PDF Si8401DB Si3443DV Si8401DB-T1-E1 11-Mar-11 01802

    Untitled

    Abstract: No abstract text available
    Text: Si8413DB Vishay Siliconix P-Channel 20-V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) - 20 RDS(on) (Ω) ID (A) 0.048 at VGS = - 4.5 V - 6.5 0.063 at VGS = - 2.5 V - 5.7 Qg (Typ.) 14 • TrenchFET Power MOSFET • MICRO FOOT® Chipscale Packaging Reduces Footprint Area Profile (0.62 mm) and


    Original     		PDF Si8413DB Si8413DB-T1-E1 11-Mar-11

    00984a2

    Abstract: top side marking b2 PACDN1404C PACDN1404CG PACDN1408C PACDN1408CG PACDN1416C PACDN1416CG 1416C
    Text: PACDN1404C/1408C/1416C ESD Protection Arrays, Chip Scale Package Features Product Description • The PACDN1404C, PACDN1408C and PACDN1416C are transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components that may be subjected to ESD.


    Original     		PDF PACDN1404C/1408C/1416C PACDN1404C, PACDN1408C PACDN1416C MILSTD-883D 178mm 00984a2 top side marking b2 PACDN1404C PACDN1404CG PACDN1408CG PACDN1416C PACDN1416CG 1416C

    Untitled

    Abstract: No abstract text available
    Text: Si8409DB Vishay Siliconix P-Channel 30-V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) - 30 RDS(on) (Ω) ID (A) 0.046 at VGS = - 4.5 V - 6.3 0.065 at VGS = - 2.5 V - 5.3 Qg (Typ.) 17 • TrenchFET Power MOSFET • MICRO FOOT® Chipscale Packaging Reduces Footprint Area Profile (0.62 mm) and


    Original     		PDF Si8409DB Si8401DB Si8409DB-T1-E1 11-Mar-11

    Zn107

    Abstract: No abstract text available
    Text: .Advance information Features • Easy m em ory expansion w ith CE1, CE2, OE inputs • Intelliwatt active pow er reduction circuitry • 2.3V to 3.0V operating range JESD 8 -5 • JEDEC registered packaging - 3 2 -pin TSOP package - 48-ball 8m m x 6m m CSP BGA


    OCR Scan     		PDF 48-ball AS7C18 1-20017-A. Zn107