Strain gage report
Abstract: with or without underfill flip SMT Texas "Strain Gage" ENIG strain rate texas instruments automotive flip chip underfill Texas alternative ENIG
Text: Application Report SPRAA55 - August 2004 Use and Handling of Semiconductor Packages with ENIG Pad Finishes Eddie Moltz DSP Packaging ABSTRACT Electroless Nickel/Immersion Gold plating, or ENIG, is a versatile process and enables fabrication of high-density flip chip BGA substrates needed for high-performance IC chips.
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SPRAA55
Strain gage report
with or without underfill
flip SMT Texas
"Strain Gage"
ENIG
strain rate
texas instruments automotive flip chip
underfill Texas
alternative ENIG
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outsourcing IBM
Abstract: avnet celestica flextronics national semiconductor CC
Text: Considerations in Converting from SMT to Die Assemblies National Semiconductor Technical Seminar Series Die Product Business Unit June 26 2003 1 Approaches, Options & Solutions • Die conversion trends and drivers • Die interconnect approaches • Device and information resources
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Untitled
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389 – JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • • • • • • • •
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TLV5610IYZ
SBAS389
12-Bit,
TLV5610IYE
TMS320TM
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Untitled
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
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TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320â
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Untitled
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
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TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
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Untitled
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
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TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
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WCSP-20
Abstract: Application-SBVA017
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
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TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
WCSP-20
Application-SBVA017
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heat and mass transfer
Abstract: No abstract text available
Text: Thermal Management of a C4/Ceramic-Ball-Grid Array: The Motorola PowerPC 603 and PowerPC 604™ RISC Microprocessors Gary B. Kromann m Advanced Packaging Technology Semiconductor Products Sector 3501 Ed Bluestein Blvd, K1 Austin, Texas 78721 ABSTRACT This paper presents various thermal management options
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603TM
604TM
SPECint92/
SPECfp92
21x21
133MHz
heat and mass transfer
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Untitled
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
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TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
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wcsp qualification
Abstract: TLV5610 TLV5610IDW TLV5610IYE TLV5610IYZ TMS320
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
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TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
wcsp qualification
TLV5610
TLV5610IDW
TLV5610IYE
TLV5610IYZ
TMS320
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TLV5610
Abstract: TLV5610IDW TLV5610IYE TLV5610IYZ TMS320 Application-SBVA017
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
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TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
TLV5610
TLV5610IDW
TLV5610IYE
TLV5610IYZ
TMS320
Application-SBVA017
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Untitled
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
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PDF
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TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320â
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Untitled
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
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Original
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PDF
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TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
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Untitled
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
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PDF
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TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
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WCSP-20
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
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TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
WCSP-20
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WCSP-20
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
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PDF
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TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
WCSP-20
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Untitled
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
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Original
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PDF
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TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
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Untitled
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
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TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320â
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TLV5608
Abstract: TLV5608IDW TLV5608IYE TLV5610 TLV5610IDW TLV5610IYE TMS320
Text: TLV5610IYE TLV5608IYE www.ti.com SLAS393 − OCTOBER 2003 2.7 V TO 5.5 V, 12Ć AND 10ĆBIT OCTAL DAC IN WAFER CHIP SCALE PACKAGE FEATURES D Eight Voltage Output DACs in One Package − TLV5610IYE . . . 12-Bit − TLV5608IYE . . . 10-Bit D Programmable Settling Time vs Power
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TLV5610IYE
TLV5608IYE
SLAS393
10BIT
12-Bit
10-Bit
TMS320
TLV5608
TLV5608IDW
TLV5608IYE
TLV5610
TLV5610IDW
TLV5610IYE
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wcsp qualification
Abstract: TLV5608 TLV5608IDW TLV5608IYE TLV5608IYER TLV5610 TLV5610IDW TLV5610IYE TMS320
Text: TLV5610IYE TLV5608IYE www.ti.com SLAS393 − OCTOBER 2003 2.7 V TO 5.5 V, 12Ć AND 10ĆBIT OCTAL DAC IN WAFER CHIP SCALE PACKAGE FEATURES D Eight Voltage Output DACs in One Package − TLV5610IYE . . . 12-Bit − TLV5608IYE . . . 10-Bit D Programmable Settling Time vs Power
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TLV5610IYE
TLV5608IYE
SLAS393
10BIT
12-Bit
10-Bit
TMS320
wcsp qualification
TLV5608
TLV5608IDW
TLV5608IYE
TLV5608IYER
TLV5610
TLV5610IDW
TLV5610IYE
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Untitled
Abstract: No abstract text available
Text: TLV5610IYE TLV5608IYE www.ti.com SLAS393 − OCTOBER 2003 2.7 V TO 5.5 V, 12Ć AND 10ĆBIT OCTAL DAC IN WAFER CHIP SCALE PACKAGE FEATURES D Eight Voltage Output DACs in One Package − TLV5610IYE . . . 12-Bit − TLV5608IYE . . . 10-Bit D Programmable Settling Time vs Power
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TLV5610IYE
TLV5608IYE
SLAS393
12-Bit
10-Bit
TMS320â
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Untitled
Abstract: No abstract text available
Text: TLV5610IYE TLV5608IYE www.ti.com SLAS393 − OCTOBER 2003 2.7 V TO 5.5 V, 12Ć AND 10ĆBIT OCTAL DAC IN WAFER CHIP SCALE PACKAGE FEATURES D Eight Voltage Output DACs in One Package − TLV5610IYE . . . 12-Bit − TLV5608IYE . . . 10-Bit D Programmable Settling Time vs Power
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TLV5610IYE
TLV5608IYE
SLAS393
10BIT
TLV5610IYE
12-Bit
10-Bit
TMS320
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90Pb 10Sn solder paste
Abstract: 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola
Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Andrew Mawer, Terry Burnette, Thomas Koschmeider and Diane Hodges Final Manufacturing Technology Center Motorola Semiconductor Products Sector 3501 Ed Bluestein Blvd., MD: F25 Austin, Texas 78721 USA
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25x25x1
90Pb 10Sn solder paste
97Pb
BGA OUTLINE DRAWING
ceramic rework
BGA PROFILING
BGA Solder Ball collapse
fine BGA thermal profile
pcb warpage in ipc standard
bga rework
CBGA motorola
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with or without underfill
Abstract: No abstract text available
Text: TLV5610IYE TLV5608IYE www.ti.com SLAS393 − OCTOBER 2003 2.7 V TO 5.5 V, 12Ć AND 10ĆBIT OCTAL DAC IN WAFER CHIP SCALE PACKAGE FEATURES D Eight Voltage Output DACs in One Package − TLV5610IYE . . . 12-Bit − TLV5608IYE . . . 10-Bit D Programmable Settling Time vs Power
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TLV5610IYE
TLV5608IYE
SLAS393
10BIT
TLV5610IYE
12-Bit
10-Bit
TMS320
with or without underfill
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