Untitled
Abstract: No abstract text available
Text: Bolt Clamped High Power Transducers Dimensions Model: 30402S Features l High efficiency & high output l Large amplitude l Low heat generation l Durability & stability l Easy connection Model: 45402H Applications l Ultrasonic cleaners l Ultrasonic welders l Ultrasonic processing machines: bonding,
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30402S
45402H
45282H
30402S
45402H
45282H
60282H
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ultrasonic transducer circuit
Abstract: ultrasonic transducers 50w 40 khz Ultrasonic Generator Circuit application of ultrasonic sound waves Ultrasonic welding circuit "Piezoelectric transducer" ultrasonic Ultrasonic cleaner circuit 40 khz ultrasonic transducer Ultrasonic welding generator Ultrasonic Cleaning Transducer
Text: Bei ji ng Ul tra s oni c Tra ns ducer,PCB Genera tor & Pi ezoel ectri c Cera mi c 2012-4-24 We are China Piezo Products Manufacturer who are specialists in Ultrasonic Cleaning transducer,Piezoelectric Ceramic,Ultrasonic Cleaner and Ultrasonic Generator. Ultrasonic Transducer Technical
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polaroid 6500
Abstract: Ultrasonic Transducer application notes MHZ ULTRASONIC transducers polaroid ultrasonic transducer circuit ultrasonic transducer polaroid ULTRASONIC transducers Mhz Ultrasonic transmitter receiver ultrasonic transducers distance measure ultrasonic transducer
Text: M AN597 Implementing Ultrasonic Ranging Author: THEORY OF OPERATION Robert Schreiber Microchip Technology Inc. INTRODUCTION Object ranging is essential in many types of systems. One of the most popular ranging techniques is ultrasonic ranging. Ultrasonic ranging is used in a wide
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AN597
PIC16CXXX
DS00597B-page
polaroid 6500
Ultrasonic Transducer application notes
MHZ ULTRASONIC transducers
polaroid
ultrasonic transducer circuit
ultrasonic transducer polaroid
ULTRASONIC transducers Mhz
Ultrasonic transmitter receiver
ultrasonic transducers
distance measure ultrasonic transducer
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Untitled
Abstract: No abstract text available
Text: AXS2 SEALED TYPE µIC SOCKETS AXS2 µSOCKET SERIES FEATURES 1. Sealed µIC sockets compatible with ultrasonic cleaning (for 30 seconds) 3bath cleaning (boiling, ultrasonic, vapor) and hot water cleaning. 2. The socket is sealed by the hot melt method for high bonding strength.
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ic socket DIP
Abstract: ic base for 40 pin DIP ic
Text: AXS1 HIGH RELIABILITY IC SOCKET WITH ROUND PIN SEALED TYPE Compliance with RoHS Directive ROUND PIN TYPE SEALED IC SOCKETS (AXS1) FEATURES CONSTRUCTION 1. Sealed IC sockets compatible with ultrasonic cleaning (30 seconds), 3-bath cleaning (boiling, ultrasonic,
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AXS210611K
Abstract: AXS210811K AXS211411K AXS211611K AXS211811K AXS212011K AXS212411K AXS212471K AXS212811K AXS213211K
Text: AXS2 SEALED TYPE µIC SOCKETS AXS2 µSOCKET SERIES FEATURES PRODUCT TYPES 1. Sealed µIC sockets compatible with ultrasonic cleaning (for 30 seconds) 3bath cleaning (boiling, ultrasonic, vapor) and hot water cleaning. 2. The socket is sealed by the hot melt
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AXS212811
Abstract: AXS210611K AXS210811K AXS211411K AXS211611K AXS211811K AXS212011K AXS212411K AXS212471K AXS212811K
Text: AXS2 SEALED TYPE µIC SOCKETS AXS2 µSOCKET SERIES FEATURES PRODUCT TYPES 1. Sealed µIC sockets compatible with ultrasonic cleaning (for 30 seconds) 3bath cleaning (boiling, ultrasonic, vapor) and hot water cleaning. 2. The socket is sealed by the hot melt
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Untitled
Abstract: No abstract text available
Text: Order Discontinued as of August 31, 2009 AXS2 SEALED TYPE µIC SOCKETS AXS2 µSOCKET SERIES FEATURES 1. Sealed µIC sockets compatible with ultrasonic cleaning (for 30 seconds) 3bath cleaning (boiling, ultrasonic, vapor) and hot water cleaning. 2. The socket is sealed by the hot melt
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8 pin ic base socket round pin type lead
Abstract: 40 pin ic base socket round pin type lead 28 pin ic base socket round pin type lead 18 pin ic base socket round pin type lead ic base for 40 pin DIP ic Socket IC 24 pin AXS110819 AXS110811 AXS111411 AXS111811
Text: AXS1 HIGH RELIABILITY IC SOCKET WITH ROUND PIN SEALED TYPE Compliance with RoHS Directive http://www.mew.co.jp/ac/e/ ROUND PIN TYPE SEALED IC SOCKETS (AXS1) FEATURES CONSTRUCTION 1. Sealed IC sockets compatible with ultrasonic cleaning (30 seconds), 3-bath cleaning (boiling, ultrasonic,
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Untitled
Abstract: No abstract text available
Text: AXS1 HIGH RELIABILITY IC SOCKET WITH ROUND PIN SEALED TYPE ROUND PIN TYPE SEALED IC SOCKETS (AXS1) FEATURES CONSTRUCTION 1. Sealed IC sockets compatible with ultrasonic cleaning (30 seconds), 3-bath cleaning (boiling, ultrasonic, vapor) and hot water. 2. The top surface of the socket is
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Untitled
Abstract: No abstract text available
Text: AXS1 ROUND PIN TYPE SEALED IC SOCKETS AXS1 HIGH RELIABILITY IC SOCKET WITH ROUND PIN (SEALED TYPE) FEATURES CONSTRUCTION 1. Sealed IC sockets compatible with ultrasonic cleaning (30 seconds), 3-bath cleaning (boiling, ultrasonic, vapor) and hot water. 2. The top surface of the socket is
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Untitled
Abstract: No abstract text available
Text: SIDAC OVP CHIPS OVER VOLTAGE PROTECTION Hard Glass Passivated Positive Resistance Turn On IS 800 mA Max. SIZE: 0.075" x 0.075" (Less Kerf) x 0.010" Silver Metalized for Solder Assembly Also available with Aluminum one side for Heavy Aluminum wire ultrasonic bonding.
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GO100-4
GO120-4
GO150-4
GO220-4
GO240-4
GO270-4
GO320-4
GO345-4
10x160
10x560
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L59 microswitch
Abstract: microswitch l96 "Pressure transducer" MEDIAMATE MICRO SWITCH FREEPORT BZE6-2RN S877T BZE7-2RQ8-PG MICRO SWITCH FREEPORT A ILLINOIS. USA model L96 KEMA 02 ATEX 2240 947-F4Y-2D-1C0-300E ST2R5BG2SPGF
Text: Industrial Switches and Sensors Global switches Heavy duty switches Compact switches Product solutions on the Interactive Catalogue Precision switches Hazardous location switches Safety switches Relays Position products Ultrasonic distance sensors Pressure sensors
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24CE/924CE
100456-EN
L59 microswitch
microswitch l96
"Pressure transducer" MEDIAMATE
MICRO SWITCH FREEPORT BZE6-2RN
S877T
BZE7-2RQ8-PG
MICRO SWITCH FREEPORT A ILLINOIS. USA model L96
KEMA 02 ATEX 2240
947-F4Y-2D-1C0-300E
ST2R5BG2SPGF
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g330
Abstract: bo 200
Text: SIDAC CHIPS • Hard Glass Passivated • Negative Resistance Turn On • SIZE: 0.050" x 0.050" Less Kerf x 0.010" • I BO < 200 µA • Silver Metalized for Solder Assembly • Also available with Aluminum one side for Heavy Aluminum wire ultrasonic bonding.
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10x160
10x560
10x1000
g330
bo 200
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GO220-5
Abstract: No abstract text available
Text: SIDAC OVP CHIPS OVER VOLTAGE PROTECTION • Hard Glass Passivated • Positive Resistance Turn On IS 800 mA Max. • SIZE: 0.110" x 0.110" (Less Kerf) x 0.010" • Silver Metalized for Solder Assembly • Also available with Aluminum one side for Heavy Aluminum wire ultrasonic bonding.
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GO100-5
GO120-5
GO150-5
GO220-5
GO240-5
GO270-5
GO320-5
GO345-5
10x160
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Untitled
Abstract: No abstract text available
Text: SIDAC OVP CHIPS OVER VOLTAGE PROTECTION • Hard Glass Passivated • Positive Resistance Turn On IS 800 mA Max. • SIZE: 0.135" x 0.135" (Less Kerf) x 0.010" • Silver Metalized for Solder Assembly • Also available with Aluminum one side for Heavy • Aluminum wire ultrasonic bonding.
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GO100-6
GO120-6
GO150-6
GO220-6
GO240-6
GO270-6
GO320-6
GO345-6
10x160
10x1000
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MSK PRODUCT COMPARISON CHART
Abstract: No abstract text available
Text: MSK PRODUCT COMPARISON CHART Test Flow or Requirement MIL-STD-883 Test Method Certification Qualification QML Listing No Element Evaluation Clean Room Processing Ultrasonic Inspection, TM 2030 Wirebond Process Control No Yes A/R Yes Hermetic Class H Yes
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MIL-STD-883
MSK PRODUCT COMPARISON CHART
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CDQ2N52
Abstract: 2 MHZ ULTRASONIC transducers CDK1N52
Text: Technical Specification FLUXUS F70x Liquid Ultrasonic Flowmeter for Permanent Installation Designed for wall mounting or installation in 19'' rack systems Features • Precise bi-directional and highly dynamic flow measurement with the non-intrusive clamp-on technology
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inductive speed sensor
Abstract: MQVR3S-530RA 1000VA QT50UVR3F SAFQT50U QT50UVR3FQ1 QT50UVR3WQ MQVR3S-515RA
Text: U-GAGE QT50U Series Sensors – Universal Supply Voltage Long-Range Ultrasonic Sensors with Electromechanical Relay Output Features • Fast, easy-to-use TEACH-Mode programming; no potentiometer adjustments • SPDT electromechanical relay for high-capacity switching
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QT50U
U-GAGETMQT50USeries
inductive speed sensor
MQVR3S-530RA
1000VA
QT50UVR3F
SAFQT50U
QT50UVR3FQ1
QT50UVR3WQ
MQVR3S-515RA
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ic socket DIP
Abstract: Socket IC 24 pin
Text: Order Discontinued as of August 31, 2009 AXS1 HIGH RELIABILITY IC SOCKET WITH ROUND PIN SEALED TYPE Compliance with RoHS Directive ROUND PIN TYPE SEALED IC SOCKETS (AXS1) FEATURES CONSTRUCTION 1. Sealed IC sockets compatible with ultrasonic cleaning (30 seconds),
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ANCC-151A
Abstract: ANCC-153A
Text: PCS and WLAN Omni Antennas ANCC-15x Series V4.00 Features ● ● ● ● ● ● Light Weight - Slim Profile Patented Printed Circuit Technology Watertight Ultrasonic and O-Ring Sealed Groundplane Independent Stainless Steel Hardware Multiple pigtail lengths, radome colors and connector
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ANCC-15x
ANCC-151A
ANCC-153A
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Untitled
Abstract: No abstract text available
Text: APPLICATION NOTES Attachment Methods Bonding of capacitors to substrates can be cat egorized into two methods: those involving solder, which are prevalent, and those using other mate rials, such as epoxies and thermo-compression or ultrasonic bonding with wire.
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CH4730
Abstract: 1N4728 1N4764 CH4728 CH4729 CH4731 CH4732 CH4733 CH4734 CH4735
Text: VOLTAGE REGULATOR PLANAR DIODE CHIPS HIGH POWER 3.3-100 VOLTS Electrically sim ilar to the J E D E C 1N 4 7 2 8 - 1N 4 764 Com patible with ultrasonic and thermocompression lead bonding, scrub and eutectic preform die bonding. Junction surfaces are protected from ambient
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1N4728
1N4764
Note47
CH4760
CH4761
CH4762
CH4763
CH4764
CH4730
1N4764
CH4728
CH4729
CH4731
CH4732
CH4733
CH4734
CH4735
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Omron
Abstract: V750-D22M03-IM 5888 d1111 omron nt series RFID Ultrasonic welding V750-D22M02-IM
Text: Omron V750 Series omRon GEN • GLOBAL INLAYS Omron Inlays Single Design for Global Use Unmatched Performance RoHS Restriction of Hazardous Substance Compliant Jomful is Omron's own technology used to manufacture inlays. The term JOMFUL is derived from: Joint Of Metal with Film by Ultrasonic
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888-303-RFID
Omron
V750-D22M03-IM
5888
d1111
omron nt series
RFID
Ultrasonic welding
V750-D22M02-IM
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