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    TSMC 0.18 Search Results

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    XPC823ZT66B2T

    Abstract: XPC823ZT81B2T XPC823 XPC823ZT75B2T motorola tsmc XPC823ZT66B2 KXPC823ZT81B2T MPC823 MOS11 xpc823zt66
    Text: Semiconductor Products Sector Networking and Computing Systems Group Networking and Communications System Division PCN: MPC823 XC Qualification in TSMC/WaferTech Motorola is pleased to announce an additional wafer fabrication facility, TSMC/WaferTech, for


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    PDF MPC823 XPC823 MOS11 W90913 W90904 W90912 XPC823ZT66B2T XPC823ZT81B2T XPC823ZT75B2T motorola tsmc XPC823ZT66B2 KXPC823ZT81B2T xpc823zt66

    3248L

    Abstract: No abstract text available
    Text: RELIABILITY REPORT DATE: 6/8/05 QUALITY ENG : PART NUMBER MICREL KS8001L/KSZ8001L KS8001LD/KSZ8001LD PROJECT # PACKAGE TYPE : ASSEMBLY LOC LOT # FAB LOC D/C # PROCESS KS8001S 48L SSOP OSE GD64047MEA TSMC 0437A 0.18 um KS8001LD 48L QFP ASE GD64047MEK TSMC 0503A


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    PDF KS8001L/KSZ8001L KS8001LD/KSZ8001LD KS8001S GD64047MEA KS8001LD GD64047MEK 10BASE-T/100BASE-TX/FX KS8001L KS8001S KSZ8001L 3248L

    XPC823ZT66B2T

    Abstract: XPC823 XPC823ZT75B2T XPC823ZT81B2T KXPC823ZT81B2T MPC823 W90913 XPC823ZT
    Text: M Semiconductor Products Sector Networking and Computing Systems Group Networking and Communications System Division PCN: MPC823 XC Qualification in TSMC/WaferTech Motorola is pleased to announce an additional wafer fabrication facility, TSMC/WaferTech, for


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    PDF MPC823 XPC823 MOS11 W90913 W90904 W90912 XPC823ZT66B2T XPC823ZT75B2T XPC823ZT81B2T KXPC823ZT81B2T W90913 XPC823ZT

    XPC850SRZT50BT

    Abstract: XPC850ZT50BT XPC850DEZT50BT XPC850SRZT80BT XPC850DEZT66BT XPC850SRZT66A SPB25 SC5302 MPC850 XPC850SRCZT50B
    Text: Semiconductor Products Sector Networking and Computing Systems Group Networking and Communications System Division PCN: MPC850 XC Qualification in TSMC/WaferTech EFFECTIVE DATE: 30-SEPT-00 Motorola is pleased to announce an additional wafer fabrication facility, TSMC/WaferTech, for


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    PDF MPC850 30-SEPT-00 MOS11 C850ZT66A, PPC850SRZT50A, SC530206ZT50B, XPC850CZT50A, XPC850SRZT50BT XPC850ZT50BT XPC850DEZT50BT XPC850SRZT80BT XPC850DEZT66BT XPC850SRZT66A SPB25 SC5302 XPC850SRCZT50B

    tristate buffer cmos

    Abstract: TSMC 0.18 um CMOS "embedded dram" tsmc tsmc cmos 0.13 um TSMC 0.18um tsmc cmos 0.13 MOSAID Technologies TSMC cmos 0.18um
    Text: SoC-RAMTM PL Memory Core 0.18µm 4.97Mbit embedded DRAM Macrocell Memory Type: Process: Geometry: Configuration: Structure: Synchronous DRAM 0.18µm Generic TSMC Logic Process Memory Density Area Height Width Cell-Efficiency Number of banks Number of pages in a bank


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    PDF 97Mbit tristate buffer cmos TSMC 0.18 um CMOS "embedded dram" tsmc tsmc cmos 0.13 um TSMC 0.18um tsmc cmos 0.13 MOSAID Technologies TSMC cmos 0.18um

    ISSI

    Abstract: TSMC embedded Flash TSMC Flash memory 0.18 motorola tsmc flash Integrated Silicon Solution Inc "embedded dram" tsmc memory issi tsmc 0.18 flash TSMC embedded EEPROM
    Text: Memory Based Solutions ISSI ¨ Integrated Silicon Solution, Inc. ISSI www.issi.com 1 ISSI198_11/98 ¨ Integrated Silicon Solution, Inc. Over Ten Years of High-Performance Memories ISSI Milestones Incorporated - 1988 u First Foundry Partnership TSMC - 1990


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    PDF ISSI198 ISSI TSMC embedded Flash TSMC Flash memory 0.18 motorola tsmc flash Integrated Silicon Solution Inc "embedded dram" tsmc memory issi tsmc 0.18 flash TSMC embedded EEPROM

    tsmc cmos 0.13 um

    Abstract: "embedded dram" tsmc
    Text: SoC-RAMTM PL Memory Core 0.18µm 3Mbit embedded DRAM Macrocell Memory Type: Process: Geometry: Configuration: Structure: Synchronous DRAM 0.18µm Generic TSMC Logic Process Memory Density Area Height Width Cell-Efficiency Number of banks Number of pages in a bank


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    Untitled

    Abstract: No abstract text available
    Text: TSMC 0.18 micron Process OPERATING LIFE @ Tj = + 130-150c at rated Voltage Family Device Lot. Pkg Qty Act Hrs Rej Act Hrs Rej PHYs KS8001LD KS8001S KSZ8001S KSZ8001L GD64047MEL GD64047MEC GD64047MEQ GDP0833.02 QFP-48 SSOP-48 SSOP-48 QFP-48 116 116 77 77 168


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    PDF 130-150c KS8001LD KS8001S KSZ8001S KSZ8001L GD64047MEL GD64047MEC GD64047MEQ GDP0833 QFP-48

    tsmc cmos 0.13 um

    Abstract: "embedded dram" tsmc D1270 TSMC cmos 0.18um TSMC 0.18Um MOSAID Technologies
    Text: SoC-RAMTM PL Memory Core 0.18µm 8Mbit embedded DRAM Macrocell Memory Type: Process: Geometry: Configuration: Structure: Synchronous DRAM 0.18µm Generic TSMC Logic Process Memory Density Area Height Width Cell-Efficiency Number of banks Number of pages in a bank


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    TSMC embedded Flash

    Abstract: TSMC Flash memory 0.18 ISSI Integrated Silicon Solution Inc
    Text: Over Ten Years of High-Performance Memories ISSI Integrated Silicon Solution, Inc. ISSI www.issi.com 1 ISSI198_11/98 ® Integrated Silicon Solution, Inc. Over Ten Years of High-Performance Memories ISSI Milestones Incorporated - 1988 u First Foundry Partnership TSMC - 1990


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    PDF ISSI198 TSMC embedded Flash TSMC Flash memory 0.18 ISSI Integrated Silicon Solution Inc

    roadmap ISSI

    Abstract: IS61C1024 IS61C64AH IS61C64B IS62C64 IS89C52 IS25M080A5T2R IS80C32 flash memory 5v 16M-bit 48 TSOP ISSI
    Text: Memory Based Solutions ISSI Integrated Silicon Solution, Inc. ISSI www.issi.com 1 ISSI_498 04/09/98 ® Integrated Silicon Solution, Inc. Memory Based Solutions ISSI Milestones • • • • • • • Incorporated - 1988 First Foundry Partnership TSMC - 1990


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    PDF IS22C020 IS22C040 IS22C041 IS22C042 IS82C600 roadmap ISSI IS61C1024 IS61C64AH IS61C64B IS62C64 IS89C52 IS25M080A5T2R IS80C32 flash memory 5v 16M-bit 48 TSOP ISSI

    cmos tsmc 0.18

    Abstract: tsmc eeprom ram tsmc 0.18 tsmc cmos 0.35 0.35 tsmc cmos 16V8 20V8
    Text: PRESS RELEASE CYPRESS AND TSMC TEAMING UP ON 0.18-MICRON CPLD FAMILY Six-Layer Metal Process will Deliver Very High Density and Performance with Low Power SAN JOSE, Calif., September 14, 1998 - Cypress Semiconductor Corp. NYSE:CY and Taiwan Semiconductor Manufacturing Company (NYSE:TSM) today announced that they have entered


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    PDF 18-MICRON 18-micron 18micron Ultra37000, FLASH370i, cmos tsmc 0.18 tsmc eeprom ram tsmc 0.18 tsmc cmos 0.35 0.35 tsmc cmos 16V8 20V8

    TSMC embedded Flash

    Abstract: NT410 tsmc 0.18 flash TSMC Flash cmos tsmc 0.18 TSMC Flash memory 0.18 TSMC Flash IP tsmc cmos NT1208 NT1115
    Text: Taiwan Semiconductor Manufacturing Company Ltd. January 27, 2000 Page 1 FOR IMMEDIATE RELEASE CONTACT IN TAIWAN CONTACT IN NEW YORK Derek Tien or Julie Chan Finance Division TSMC [email protected] 886/3/567-2664 Mami Ogawa Thomson Financial Investor Relations


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    JESD22-A114F

    Abstract: JESD47 JESD-47 JEDEC JESD22-B116 free download JESD22-A102C JESD22-A108B JESD22-B116A JESD22-A114-F JESD78B JESD22-A102-C
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: W-1002-01(R4) DATE: October 4, 2010 Affected Products: Refer to the attached list of products transferring from IDT Fab 4 to TSMC


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    PDF JESD22-A115B, JESD78B AV265 JESD22-B116-A, EIA/JESD22-A110B, EIA/JESD22-A102C, 168hrs JESD22-A113 JESD22-A114F JESD47 JESD-47 JEDEC JESD22-B116 free download JESD22-A102C JESD22-A108B JESD22-B116A JESD22-A114-F JESD78B JESD22-A102-C

    tsmc 0.18um

    Abstract: TSMC 0.18um data sheet tsmc cmos RTL code for ethernet TSMC cmos 0.18um data sheet TSMC cmos 0.18um ethernet mdio circuit diagram 20 channel data transmitting circuit 3.125G block diagram for optical fiber receiver
    Text: SB1000 PRODUCT BRIEF SILICON BRIDGE SB1000 - Quad 1 - 3.125Gbps Low Power CMOS Transceiver Macro Cell in 0.18um TSMC Process FEATURES BENIFITS/ADVANTAGES • • • • • • • • • • • • • • • • • • • • • Compliant with IEEE 802.3ae 10Gbps Ethernet


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    PDF SB1000 SB1000 125Gbps 10Gbps 8B/10B tsmc 0.18um TSMC 0.18um data sheet tsmc cmos RTL code for ethernet TSMC cmos 0.18um data sheet TSMC cmos 0.18um ethernet mdio circuit diagram 20 channel data transmitting circuit 3.125G block diagram for optical fiber receiver

    TSMC 0.35Um

    Abstract: TSMC 1P4M HP83K cmos tsmc 0.18 tsmc FAB10 FAB-10 tsmc cmos 0.35 PI7C8150B PI7C8150A PI7C8152A
    Text: 3545 North First St. • San Jose, CA 95134 • USA PRODUCT/PROCESS CHANGE NOTICE PCN PCN Number: 06-04 Date Issued: June 30, 2006 Product(s) Affected: PI7C8150A, 8150A-33, 8150B, 8150B-33, PI7C8152A, 8152B Manufacturing Location Affected: TSMC Fab 7 and 10


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    PDF PI7C8150A, 150A-33, 8150B, 8150B-33, PI7C8152A, 8152B FAB10 TSMC 0.35Um TSMC 1P4M HP83K cmos tsmc 0.18 tsmc FAB10 FAB-10 tsmc cmos 0.35 PI7C8150B PI7C8150A PI7C8152A

    CL018G

    Abstract: TSMC 0.18 um CMOS silicon TSMC 0.18 um CMOS low power low noise frequency divider specification cmos tsmc 0.18 tsmc cmos model N-7075 0.18 um CMOS Process adc verilog tsmc cmos 0.18 um
    Text: BRIEF PRODUCT SPECIFICATION nPLL20240-18a 240MHz Low Jitter PLL FEATURES • • • • • • • • • TSMC CL018G 1.8 V 240 MHz Low Jitter PLL Reference Clock Input 20 Mhz, 40 MHz and 80 MHz Programmable Steps, 3, 6 or 12 Divider 80 MHz, 40 MHz and 20 MHz Complimentary


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    PDF nPLL20240-18a 240MHz CL018G N-7075 TSMC 0.18 um CMOS silicon TSMC 0.18 um CMOS low power low noise frequency divider specification cmos tsmc 0.18 tsmc cmos model 0.18 um CMOS Process adc verilog tsmc cmos 0.18 um

    TSMC Flash

    Abstract: linear handbook E144 EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 automatic heat detector project report
    Text: Cyclone III Design Guidelines November 2008 AN-466-1.2 Introduction The Cyclone III FPGA family offered by Altera ® is a cost-optimized, memory-rich FPGA family. Cyclone III FPGAs are built on Taiwan Semiconductor Manufacturing Company's TSMC 65-nm low-power (LP) process technology with additional silicon


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    PDF AN-466-1 65-nm TSMC Flash linear handbook E144 EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 automatic heat detector project report

    70241k

    Abstract: d5611 61c256 ic 9022 61c64 RELIABILITY REPORT ISSI vacuum tubes CMS 2015 S/TRANSISTOR J 5804 EQUIVALENT 28F010P
    Text: ISSI Integrated Silicon Solution, Inc. Quality and Reliability 1997-1998 An ISO 9001 Company ISSI ® Reliability Report 1997-1998 An ISO 9001 Company 1997 Integrated Silicon Solution, Inc. Integrated Silicon Solution, Inc. • 2231 Lawson Lane • Santa Clara, CA 95054


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    PDF R-118 70241k d5611 61c256 ic 9022 61c64 RELIABILITY REPORT ISSI vacuum tubes CMS 2015 S/TRANSISTOR J 5804 EQUIVALENT 28F010P

    c9013

    Abstract: 84 pin PBGA oscilloscope MTBF TSMC retention memory dc 8069 IS61C1024 IC Data-book Q-16 car radio 14x20 TSOP 8638
    Text: ISSI Integrated Silicon Solution, Inc. Quality and Reliability 1997-1998 An ISO 9001 Company ISSI ® Quality System Manual QUALITY Reliabilty Report 1997-1998 RELIABILITY Integrated Silicon Solution, Inc. An ISO 9001 Company 1997 Integrated Silicon Solution, Inc.


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    PDF R-118 c9013 84 pin PBGA oscilloscope MTBF TSMC retention memory dc 8069 IS61C1024 IC Data-book Q-16 car radio 14x20 TSOP 8638

    TSMC 0.18Um

    Abstract: No abstract text available
    Text: Nomenclature Guide TW Types TW aaaa bb - c d e f g# - h j k l PREFIX DEVICE NUMBER AT: Auto Wafer EP: Epi Wafer l - OPTIONS S = SLT B = Burn-in H = High Temp. Testing I = Industrial V = High Volt Testing T = Tape & Reel Packing c - PROCESS This character is included in the


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    PDF 6815-LA1-GR TW6816-LA1-GR TW6817-LA1-GR TW6818-LA1-GR TW6932-LA1-GR 1-888-INTERSIL TSMC 0.18Um

    TSMC 0.35um

    Abstract: tsmc 0.18um Intersil marking code TSMC 0.25Um vanguard 0.35Um tsmc 0.18-um utac qfn TSMC 90nm TW6818-LA1-GR
    Text: Nomenclature Guide TW Types TW aaaa bb - c d e f g# - h j k l PREFIX DEVICE NUMBER AT: Auto Wafer EP: Epi Wafer l - OPTIONS S = SLT B = Burn-in H = High Temp. Testing I = Industrial V = High Volt Testing T = Tape & Reel Packing c - PROCESS This character is included in the


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    PDF TW6815-LA1-GR TW6816-LA1-GR TW6817-LA1-GR TW6818-LA1-GR TW6932-LA1-GR 1-888-INTERSIL TSMC 0.35um tsmc 0.18um Intersil marking code TSMC 0.25Um vanguard 0.35Um tsmc 0.18-um utac qfn TSMC 90nm

    PCI AHB DMA

    Abstract: tsmc 0.18 axi bridge
    Text: Compliant with PCI Express Base Specification 1.1 CPXP-EP PCI Express Endpoint Controller Core with SoC Bridge Extensions for AHB, AXI and Wishbone Implements a PCI Express endpoint controller that is compliant with PCI Express Base specification 1.1, including the Transaction, Data Link, and Physical protocol layers. It


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    PDF 250MB/s PCI AHB DMA tsmc 0.18 axi bridge

    018U

    Abstract: Nordic Semiconductor ADC Verilog Implementation TSMC 0.18Um
    Text: PhysicalExpress H HA AN ND DO OFFFF A AN ND DM MA AN NU UFFA AC CTTU UR RIIN NG GS SE ER RV VIIC CE E What is PhysicalExpress? Through several years of experience with Handoff projects, Nordic Semiconductor is able to present customers with a well-proven methodology and a simple, streamlined interface. Combining this methodology with state-of-the-art EDA tools and silicon proven IP, we


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