DIN 41652 part 3
Abstract: No abstract text available
Text: 5,8 +0,3 Verpackt in Tray Verpackungseinheit 48 St. 18 0,6 5 x 18 = 90 max. 138 3 2,9 6,3 tray packaging packaging unit 48 pcs +0,2 Pin 1 31 -0,4 16,8 36 +0,2 7 x 36 = 252 +0,2 8,25 Layout: 25 ±0,1 4 x 2,74 = 10,96 A Bolzen mit Einpresszone bolt with compliant zone
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ERNI TMCS 9
Abstract: DIN 41652 DIN 41652 part 1 DIN 41652 part 2 ERNI
Text: Verpackt in Tray Verpackungseinheit 48 St. max. 138 3 0,6 18 2,9 5 x 18 = 90 6,3 6,3 -0,25 tray packaging packaging unit 48 pcs +0,2 Pin 1 31 -0,4 36 16,4 -0,2 7 x 36 = 252 8 -0,2 Layout: 25 ±0,1 4 x 2,74 = 10,96 A Bolzen mit Einpresszone bolt with compliant zone
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TMC-P
Abstract: DIN 41652 part 2 DIN 41652 part 1
Text: +0,2 31 -0,4 Verpackt in Tray Verpackungseinheit 32 Stck +0,2 +0,2 tray packaging packaging unit 32 pcs 14,8 13,3 25 ±0,1 28 138 max. 0,6 3 x 28 = 84 8,25 12,6 ±0,3 16,8 Pin 1 36 +0,3 7 x 36 = 252 5,8 325 max. Anwendungsbeispiel / example of use Bolzen / bolt
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TMC-P-09-EE-SV-Standard-BA8-ZV
TMC-P
DIN 41652 part 2
DIN 41652 part 1
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DIN 41652
Abstract: ISO 2768-M 244441 B274
Text: 6,3 -0,25 Verpackt in Tray packaging unit 48 pcs 18 5 x 18 = 90 tray packaging 2,7 3,2 6,3 max. 138 Verpackungseinheit 48 St. 0,6 36 Pin 1 Leiterplatte 7 x 36 = +0,2 pcb 252 31 -0,4 max. 325 4 x 2.74 = A 1 25 without : Mutter / 0,1 0,1 ø0.05 2,74 B 9x 1 Bolzen / bolt :
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2768-m
09-TL-2
DIN 41652
ISO 2768-M
244441
B274
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erni
Abstract: ERNI TMCS 9
Text: Verpackt in Tray Verpackungseinheit 48 St. 18 5 x 18 = 90 max. 138 2,7 2,6 6,3 6,3 -0,25 tray packaging packaging unit 48 pcs 0,6 Pin 1 +0,2 31 -0,4 36 16,4 -0,2 7 x 36 =252 8 -0,2 Layout: 4 x 2,74 = 10,96 A 9x 1 ±0,1 25 ±0,1 0,1 B 0,05 2,74 2,84 12,6 ±0,3
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din 7984
Abstract: DIN 41652 part 1 din 74-b tmc-p-09 ERNI TMC-P-09 DIN 41652 part 3
Text: +0,2 31 -0,4 Verpackt in Tray Verpackungseinheit 32 Stck +0,2 +0,2 tray packaging packaging unit 32 pcs 13,8 13,3 25 ±0,1 28 138 max. 0,6 3 x 28 = 84 8,25 12,6 ±0,3 16,8 Pin 1 +0,3 36 5,8 7 x 36 = 252 Bolzen / bolt Anwendungsbeispiel / example of use Sonstige Angaben siehe Zeichnung 204630 / Additional inications according to drawing 204630
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TMC-P-09-EE-SV-Euro-BA8-ZV
din 7984
DIN 41652 part 1
din 74-b
tmc-p-09
ERNI TMC-P-09
DIN 41652 part 3
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144855
Abstract: erni 174444
Text: 30,8 0,3 28 tray packaging packaging unit 32 pcs 0,3 max. 138 Verpackungseinheit 32 St. 12,6 -0,2 8 Ansicht X 3x28= 84 Verpackt in Tray 16,8 -0,2 36 1 M 5:1 7x36= 252 max. 325 25 additional indications please see 204629 sonstige Angaben siehe 204629/ 0,2 150
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2768-m
144855
erni 174444
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WSON 6x8
Abstract: tube 6x8 6X5 TUBE WSON
Text: SPI Flash Part Numbering System FM X XX XX X - X X X X X X Fidelix Memory Product Family Packing Type T : Tube Standard R : Tape and Reel Y : Tray * Package NO Marking 25 : SPI Business Package Type Organization 1 : 8 Pin 208 mil SOIC S : Standard 2 : 16 Pin 300 mil SOIC
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85MHz
104MHz
WSON 6x8
tube 6x8
6X5 TUBE
WSON
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Untitled
Abstract: No abstract text available
Text: REVISION J QTS-XXX-01-X-D-DP-EMX-XX No OF PAIRS -016, -032, -048, *-064, *-080 PER ROW DO NOT SCALE FROM THIS PRINT OPTION -TY: TRAY PACKAGING EDGE MOUNT THICKNESS -EM2: .064[1.63] .004 PCB (USE QTS-25-01-D-EM2-XX & T-1S42-01-X) -EM3: (USE QTS-25-01-D-EM3-XX
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QTS-XXX-01-X-D-DP-EMX-XX
QTS-25-01-D-EM2-XX
T-1S42-01-X)
QTS-25-01-D-EM3-XX
T-1S42-02-X)
T-1S42-XX-F
T-1G1-01-F)
T-1S42-XX-L
T-1G1-01-L)
PT-1-24-01-95
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Untitled
Abstract: No abstract text available
Text: LY622568 256K X 8 BIT LOW POWER CMOS SRAM Rev. 2.5 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 2.0 Rev. 2.1 Rev. 2.2 Rev. 2.3 Rev. 2.4 Rev. 2.5 Description Initial Issue Revised ISB1/IDR/Test Condition of ICC Adding PKG type : 32 P-DIP Revised Test Condition of ISB1/IDR
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LY622568
-35ns
-45ns
LY622568PL-70LLE
LY622568PL-70LLET
LY622568PL-70LLI
LY622568PL-70LLIT
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LY621024PL-70LL
Abstract: LY621024PL
Text: LY621024 128K X 8 BIT LOW POWER CMOS SRAM Rev. 1.8 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 1.3 Rev. 1.4 Rev. 1.5 Rev. 1.6 Rev. 1.7 Rev. 1.8 Description Issue Date Initial Issue Jul.25.2004 Revised sym. b of 32 pin 450mil SOP package outline dimension Jan.17.2007
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LY621024
450mil
LY621024GL-70LLE
LY621024GL-70LLET
LY621024GL-70LLI
LY621024GL-70LLIT
LY621024PL-70LL
LY621024PL
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Untitled
Abstract: No abstract text available
Text: LY626416 64K X 16 BIT LOW POWER CMOS SRAM Rev. 1.7 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 1.3 Rev. 1.4 Rev. 1.5 Rev. 1.6 Rev. 1.7 Description Initial Issue Revised typos in page 1,4,5 35ns to 45ns Added ISB1 /IDR values when TA = 25℃ and TA = 40℃
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LY626416
r16GL-70LLI
LY626416GL-70SLIT
LY626416GL-70SLI
LY626416GL-70LLIT
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LY6225616ML-55SL
Abstract: No abstract text available
Text: LY6225616 256K X 16 BIT LOW POWER CMOS SRAM Rev. 1.6 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 1.3 Rev. 1.4 Rev. 1.5 Rev. 1.6 Description Initial Issue Added -45 ns Spec. Added –SLE/SLI Spec. Deleted -35 ns Spec. Added ISB1/IDR values when TA = 25℃ and TA = 40℃
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LY6225616
LY6225616GL-70SLI
LY6225616GL-70SLIT
LY6225616GL-70LLIT
LY6225616ML-55SL
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Untitled
Abstract: No abstract text available
Text: LY62L1024 128K X 8 BIT LOW POWER CMOS SRAM Rev. 1.7 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 1.3 Rev. 1.4 Rev. 1.5 Rev. 1.6 Rev. 1.7 Description Initial Issue Revised Icc Deleted L grade Added SL grade Added ISB1/IDR values when TA = 25℃ and TA = 40℃
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LY62L1024
-45ns
Revised1024GL-55LLI
LY62L1024GL-55LLIT
LY62L1024GL-70SLI
LY62L1024GL-70SLIT
LY62L1024GL-70LLI
LY62L1024GL-70LLIT
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Untitled
Abstract: No abstract text available
Text: 322,6 R i ±0.3 ±o,25 V e rp ackt in Tray Verpackungseinheit 20 St. — •— — Ansicht X — _ M 5:1 Bestückung k ra ftlo s pow erless assembly L— — r . _ — ■— I t - — tray packaging packaging unit 2 0 pcs _ _ _ _ _ — — — — —
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25-THR
0006i0079
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Untitled
Abstract: No abstract text available
Text: 322.6 ±o.25 t0'2 i\ -ni Verpackt in Tray Verpackungseinheit 32 St. tray packaging packaging unit 32 pcs Ansicht X ao i M 5:1 o~ll Bestückung kraftlos powerless assem äy J— u — l— — l— — i- 36 7x36= 252 S o n s tig e A n g a b e n sie h e 2 0 4 6 2 9 /
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2768-m
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ERNI TMCS 9
Abstract: 194335
Text: Verpackt in Troy Verpackungseinheit 48 St. tray packaging packaging unit 48 pcs -BE 36 7 x 36 = 252 Pin 1 / max. 325 LEiterpLattE Verpackt in Gurt pcb 0,2 31 Ansouqhaube hood no m o+1' vO CsT 1* C 1 k 1 -' 3 1 1 25 wiltìout packaging unit 75 pcs _ I_
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Untitled
Abstract: No abstract text available
Text: 04.8 + 0 .25 2 PLC 30.8 ±0.38 #4-40 # 4-40 THREADED 2 PLC UNC SCREWLOCK 2 FLC 24.99 UNC INSERT 0.25 15 li 1 10 00.15 0 X Y DETAIL E AMP RECOMMENDED PCB LAYOUT THICKNESS: 1.57 (TOP VIEW) TRAY BLACK 3.1 8 DETAIL F 30/U. 3-1470250-3 W/ TUBE BLACK 3.1 8 DETAIL F
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c-1470250
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edge715
Abstract: DIN ISO 2768-M
Text: 391 Ansicht X 322,6 ±o,25 ±0 3 Ve rp ackt in T ray M 5:1 Verpackungseinheit 24 St. Bestückung kra ftlos — I— — — packaging unit 2 4 pcs 1 — I— •■ IJH ICD — tray packaging ■ it I— — 11—1— pow erless assembly — — 44 5 x44-220
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5x44-220
2768-m
15-THR
edge715
DIN ISO 2768-M
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DIN ISO 2768-M
Abstract: din iso 2768 M DIN 41652
Text: W i +0 25 Verp ackt in Tra y 25.1 -o,2 Verpackungseinheit 24 St. tray packaging I packaging onit 24 pcs Ansicht X M 5:1 Bestückung kra ftlos pow erless assembly € p r © © @ W © © © Ÿ - ^ © © © © © '© © - e p jj \D °°| ^ ) ^ I— s 1 •
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2768-m
15-THR
DIN ISO 2768-M
din iso 2768 M
DIN 41652
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Untitled
Abstract: No abstract text available
Text: r PRODUCT NO R .25 [0.010] MAX 4X 7 48 22 -X Y 1 i $fc ~ «t *i ?* fc _8 « - 16.87[0.664] — PACKAGING OPTION Y I - 8 S C Z DESCRIPTION TRAY 1 TAPE AND REEL 14.22[0.560] U S 3 uP L A T IN G CODE X m * l & .7 6 /j M / 3 0 * uL 3 . 7 6 j u M / 3 0 ju ” i f i
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L94V-0.
/100uâ
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144863
Abstract: No abstract text available
Text: 16,8 -0,2 BEBE3E& 3ESE3E& GO CNJ 1 I “ I“ p =1= « A1 -sD °°| £* JJ A = != tray packaging jing unit 32 pcs ' r<D<D @<Di Ì®®W® J - c p Ansicht X Verpackt in Troy Verpackungseinheit 32 St. 36 7x36- 252 M 5:1 max 325 25 ±o,2 sonstige Angaben siehe 204630 / additional ¡mkations please see 204630
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0006712iSZA
144863
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x2748
Abstract: No abstract text available
Text: 31 ±0,3 16,4 -o,2 m e @ g m ! ©m @ j] 3 2 2 6 ± 0 .2 5 o' e V e r p a c k t in T r a y vD Verpackungseinheit 32 St. C sf tray packaging packaging unit 32 pcs 25 ±o,2 PO rn i t m OÌ l nn 4 x 2 , 7 4 = 10,96 Layoutvarschlag A -> + Bolzen / b a it 0,04
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Untitled
Abstract: No abstract text available
Text: 46,086 69,3 Ve rp ackt in Tra y Verpackungseinheit 16 St. 55y 0'2 O ±o,25 ± o ,3 CsJ II CO CNJ X m OJ f o o o o o o o o o o o o o o o o o o o T O O O O O O O O 0. 0 o o o o o o o o A - ~ ~ - U _ _ r -I- _. n tray packaging - packaging unit 16 pcs
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37-EE-Eurostyle
37-EE-Eurostyle
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