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    TQFP-176 FOOTPRINT Search Results

    TQFP-176 FOOTPRINT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    ELANSC300-33VC Rochester Electronics LLC Microcontroller, 32-Bit, 33MHz, CMOS, PQFP208, TQFP-208 Visit Rochester Electronics LLC Buy
    CY7C4285-15ASC Rochester Electronics LLC FIFO, 64KX18, 10ns, Synchronous, CMOS, PQFP64, 10 X 10 MM, TQFP-64 Visit Rochester Electronics LLC Buy
    ML6431CH Rochester Electronics LLC Consumer Circuit, BICMOS, PQFP32, 7 X 7 MM, 1 MM HEIGHT, TQFP-32 Visit Rochester Electronics LLC Buy
    ML6430CH Rochester Electronics LLC Consumer Circuit, BICMOS, PQFP32, 7 X 7 MM, 1 MM HEIGHT, TQFP-32 Visit Rochester Electronics LLC Buy
    R5F513T5ADFJ#30 Renesas Electronics Corporation 32-bit Microcontrollers for Single Motor control Applications; Reduces Footprint and BOM Costs Visit Renesas Electronics Corporation

    TQFP-176 FOOTPRINT Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    atmel 216

    Abstract: TQFP 132 PACKAGE TQFP216 BGA-121
    Text: Packaging Introduction Atmel pairs its high-performance silicon with packages, custom designed for the company’s gate arrays. Atmel offers our gate arrays in ceramic and plastic packages. Atmel’s plastic through hole and surface mount packages come in a


    Original     		MIL-STD-883D atmel 216 TQFP 132 PACKAGE TQFP216 BGA-121 PDF

    plx 9030

    Abstract: FOOTPRINTS CONNECTOR ssop-4 footprint plcc 208 plx 9030 176-pin pqfp PLCC pin configuration FOOTPRINTS CONNECTOR 2 PIN 14 pin plcc socket footprint soic 20 pci connector footprint plx 9030 data sheet
    Text: PCI 9030RDK–LITE PCI SMARTarget Rapid Development Kit Features •A PCI v2.2 prototype adapter board design based on the PLX PCI 9030 SMARTarget I/O Accelerator ■ Surface mount footprints on the board support industry standard embedded CPUs, DSPs, FPGAs, CPLDs and


    Original     		9030RDK 100-pin 9030RDK-LITE 9030/LITE-RDK-PB-P1-2 plx 9030 FOOTPRINTS CONNECTOR ssop-4 footprint plcc 208 plx 9030 176-pin pqfp PLCC pin configuration FOOTPRINTS CONNECTOR 2 PIN 14 pin plcc socket footprint soic 20 pci connector footprint plx 9030 data sheet PDF

    amkor exposed pad

    Abstract: exposed QFP 128 amkor exposed QFP 144
    Text: LEADFRAME data sheet FusionQuad Features: FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a cost-effective platform for increased lead count in a small


    Original     		PDF

    amkor

    Abstract: amkor exposed pad
    Text: LEADFRAME data sheet FusionQuad Features FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a


    Original     		PDF

    Yamaichi IC51-1444-1354-7 footprint

    Abstract: IC149-208-161-S5 BPW32 Enplas drawings BPW896-1030-30AB01L IC51-1764-1505-5 IC51-1004-809 SY-PQ240 enplas FPQ-256
    Text: v3.1 Socket Recommendation for Actel FPGA Packages Sockets for Prototyping with Actel FPGAs Actel offers a range of surface-mount sockets to make it easier for designers to prototype designs using Actel one-time-programmable FPGAs. These sockets have been manufactured for Actel by some of


    Original     		piec-256 FPQ-256 Yamaichi IC51-1444-1354-7 footprint IC149-208-161-S5 BPW32 Enplas drawings BPW896-1030-30AB01L IC51-1764-1505-5 IC51-1004-809 SY-PQ240 enplas FPQ-256 PDF

    footprint tqfp 208

    Abstract: GPIO20 rtc 205 82371AB FDC37N958FR FDC37N972 QS3384
    Text: APPLICATION NOTE 8.1 DUAL FOOTPRINT CONFIGURATION FOR THE FDC37N958FR AND THE FDC37N972 OVERVIEW • • • The SMSC FDC37N972 and the FDC37N958FR are 208-pin ISA Ultra I/O Controllers for mobile applications. These devices are pin-compatible with the following exceptions, which


    Original     		FDC37N958FR FDC37N972 FDC37N972 208-pin FDC37N958FR. FDC37N972, FDC37N972. footprint tqfp 208 GPIO20 rtc 205 82371AB QS3384 PDF

    footprint tqfp 208

    Abstract: rtc 205 82371AB FDC37N958FR FDC37N972 QS3384
    Text: APPLICATION NOTE 8.1 DUAL FOOTPRINT CONFIGURATION FOR THE FDC37N958FR AND THE FDC37N972 OVERVIEW • • • The SMSC FDC37N972 and the FDC37N958FR are 208-pin ISA Ultra I/O Controllers for mobile applications. These devices are pin-compatible with the following exceptions, which


    Original     		FDC37N958FR FDC37N972 FDC37N972 208-pin FDC37N958FR. FDC37N972, FDC37N972. footprint tqfp 208 rtc 205 82371AB QS3384 PDF

    led interface with 8051

    Abstract: Keyboard Controller kbc1100 philips RC5 8051 KBC1100 RC5 Infrared 8051 interfacing 8051 keyboard pwm fan speed control 8051 KBC1100-RD KBC1100-RT block diagram of 8051 based ADC
    Text: KBC1100 Mobile KBC with Super I/O, SFI, ADC and DAC with SMSC SentinelAlert!TM PRODUCT FEATURES • ■ ■ ■ ■ ■ ■ ■ ■ ■ Data Brief 3.3V Operation with 5V Tolerant Buffers ACPI 1.0b/2.0 and PC99a/PC2001 Compliant LPC Interface with Clock Run Support


    Original     		KBC1100 PC99a/PC2001 led interface with 8051 Keyboard Controller kbc1100 philips RC5 8051 KBC1100 RC5 Infrared 8051 interfacing 8051 keyboard pwm fan speed control 8051 KBC1100-RD KBC1100-RT block diagram of 8051 based ADC PDF

    atmel 0945

    Abstract: atmel 428
    Text: pkg-3.5-04/98 Packaging Introduction . 4-3 Package Options: Table . 4-3


    Original     		PDF

    b13193

    Abstract: XCR3256XL 614E-13 CS280 DS012 DS013 PQ208 TQ144 208pin T1648
    Text: R DS013 v1.2 May 3, 2000 XCR3256XL 256 Macrocell CPLD 14 Preliminary Product Specification Features Description • 7.5 ns pin-to-pin logic delays • System frequencies up to 140 MHz • 256 macrocells with 6,000 usable gates • Available in small footprint packages


    Original     		DS013 XCR3256XL 208-pin 144-pin 280-ball 280-pin TQ144 PQ208 b13193 614E-13 CS280 DS012 DS013 PQ208 TQ144 208pin T1648 PDF

    footprint tqfp 208

    Abstract: rtc 205 82371AB FDC37N958FR FDC37N972 QS3384 TQFP 100 footprint
    Text: APPLICATION NOTE 8.1 DUAL FOOTPRINT CONFIGURATION FOR THE FDC37N958FR AND THE FDC37N972 OVERVIEW • • • The SMSC FDC37N972 and the FDC37N958FR are 208-pin ISA Ultra I/O Controllers for mobile applications. These devices are pin-compatible with the following exceptions, which


    Original     		FDC37N958FR FDC37N972 FDC37N972 208-pin FDC37N958FR. FDC37N972, FDC37N972. footprint tqfp 208 rtc 205 82371AB QS3384 TQFP 100 footprint PDF

    vantis jtag schematic

    Abstract: ispGDS cable Envy 24 Vantis ISP cable 2032VE code for pci express.vhdl vantis PAL 22V10 MACH4 cpld amd
    Text: Lattice Semiconductor Corporation • Fall 1999 • Volume 6, Number 2 In This Issue SuperFAST 3.3V ispLSI 2000VE Family Complete! New Phone Numbers 3.3V ispGDXV™: The Next Generation Speedy ispLSI 2064E Rounds Out ispLSI 2000E Family Reference Design Program


    Original     		2000VE 2064E 2000E I0100 vantis jtag schematic ispGDS cable Envy 24 Vantis ISP cable 2032VE code for pci express.vhdl vantis PAL 22V10 MACH4 cpld amd PDF

    footprint jedec MS-026 TQFP

    Abstract: PL84 tube AS 108-120 x-ray tube datasheet 144 QFP body size drawing of a geometrical isometric sheet superior Natural gas engines x-ray tube datasheet 026 SMT, FPGA FINE PITCH BGA 456 BALL mo-047 texas
    Text: Packages INTRODUCTION Vantis provides its programmable logic devices PLDs in a wide range of packages. These packages provide benefits such as high power dissipation capability, small footprint, and high I/O. This section provides details about the packages that Vantis supplies.


    Original     		G46-88 footprint jedec MS-026 TQFP PL84 tube AS 108-120 x-ray tube datasheet 144 QFP body size drawing of a geometrical isometric sheet superior Natural gas engines x-ray tube datasheet 026 SMT, FPGA FINE PITCH BGA 456 BALL mo-047 texas PDF

    1000-pin bga 0,8 mm

    Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


    Original     		Unit2607 REJ01K0003-0300 1000-pin bga 0,8 mm HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog" PDF

    EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES

    Abstract: AS 108-120 Plastic Encapsulate Diodes D2863 tube pl84 144 QFP body size die electric sealer PL84 tube MO-047 footprint jedec MS-026 TQFP
    Text: Packages INTRODUCTION Vantis provides its programmable logic devices PLDs in a wide range of packages. These packages provide benefits such as high power dissipation capability, small footprint, and high I/O. This section provides details about the packages that Vantis supplies.


    Original     		JESD51, EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES AS 108-120 Plastic Encapsulate Diodes D2863 tube pl84 144 QFP body size die electric sealer PL84 tube MO-047 footprint jedec MS-026 TQFP PDF

    EPM7218

    Abstract: No abstract text available
    Text: MAX 7000A Includes MAX 7000AE Programmable Logic Device Family July 1999, ver. 2.02 Data Sheet Features. • ■ Preliminary Information ■ ■ ■ ■ ■ f High-performance CMOS EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array MatriX


    Original     		7000AE EPM7128A EPM7256A 256-pin EPM7218 PDF

    CS-007

    Abstract: Amkor Electronics Amkor mold compound
    Text: LEADFRAME data sheet FusionQuad Body Exposed Pad Size mm Size (mm) 176 ld 14 x 14 6.5 x 6.5 A Electrical: Theta JA (°C/W) by Velocity (m/s) 1.0 2.5 24.6 19.9 17.9 Body Pad Size Size Pkg (mm) 14 x 14 Inductance Capacitance Resistance (mm) Lead 6.5 x 6.5 176 ld


    Original     		PDF

    eeprom programmer schematic

    Abstract: No abstract text available
    Text: MAX 7000A Includes MAX 7000AE Programmable Logic Device Family June 1999, ver. 2.01 Data Sheet Features. • ■ Preliminary Information ■ ■ ■ ■ ■ f High-performance CMOS EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array MatriX


    Original     		7000AE EPM7128A EPM7256A EPM7128AE EPM7256AE EPM7512AE eeprom programmer schematic PDF

    TTL pin outs

    Abstract: 30J341 CMOS TTL Logic Family Specifications BGA and QFP Package BITBLASTER footprint tqfp 208 v16 248 337 BGA footprint N12110 74 series pin outs
    Text: MAX 7000A Includes MAX 7000AE Programmable Logic Device Family September 1999, ver. 2.03 Data Sheet Features. • ■ Preliminary Information ■ ■ ■ ■ ■ f High-performance CMOS EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array MatriX


    Original     		7000AE EPM7128A EPM7256A 256-pin TTL pin outs 30J341 CMOS TTL Logic Family Specifications BGA and QFP Package BITBLASTER footprint tqfp 208 v16 248 337 BGA footprint N12110 74 series pin outs PDF

    3195A

    Abstract: No abstract text available
    Text: XC3100, XC3100A Logic Cell Array Families Product Specifications F eatu re s Description • Two ultra-high-speed FPGA families with six members each XC3100 and XC3100A are performance-optimized rela­ tives of the XC3000 and XC3000A families. While all families are footprint compatible, the XC3100 and XC3100A


    OCR Scan     		XC3100, XC3100A XC3100 XC3000 XC3000A 3195A PDF

    Untitled

    Abstract: No abstract text available
    Text: XC3100, XC3100A Logic Cell Array Families Product Specifications Features Description • Two ultra-high-speed FPGA families with six members each XC3100 and XC3100A are performance-optimized rela­ tives of the XC3000 and XC3000A families. While all families are footprint compatible, the XC3100 and XC3100A


    OCR Scan     		XC3100, XC3100A XC3100 XC3100A XC3000 XC3000A PDF

    Untitled

    Abstract: No abstract text available
    Text: XC3100A Logic Cell Array Families f lX IL IN X Product Specifications Features Description • Ultra-high-speed FPGA family with six members The XC3100A is a performance-optimized relative of the XC3000 and XC3000A families. While all families are footprint compatible, XC31 OOAfamiliy extends the system


    OCR Scan     		XC3100A XC3100A XC3000 XC3000A XC4000 XC3195A IL-STD-883C PDF

    7064B

    Abstract: m7512b
    Text: MAX 7000B M Ï Ï I 3 Â. Programmable Logic Device Family August 1999. ve Data Sheet Features. • Preliminary Information ■ High-performance CMOS EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array M atrix (MAX ) architecture (see Table 1)


    OCR Scan     		7000B 7000S 7128B 7256B 7512B 7064B m7512b PDF

    PJO 399

    Abstract: PJO 389 PJO 499 B13128 pjo 489 7512A PJO 376 PJO 386
    Text: MMMA. MAX 7000A Includes MAX7000AE Programmable Logic Device Family May 1999, ver. 2 Data Sheet Features. • ■ ■ Prelim inary Information ■ ■ ■ ■ High-performance CMOS EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array MatriX


    OCR Scan     		MAX7000AE EPM7128A EPM7256A EPM7128AE EPM7256AE EPM7512AE PJO 399 PJO 389 PJO 499 B13128 pjo 489 7512A PJO 376 PJO 386 PDF