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    TQFP 144 PACKAGE DIMENSION Search Results

    TQFP 144 PACKAGE DIMENSION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    TQFP 144 PACKAGE DIMENSION Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    9811

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC FPT-144P-M10 EIAJ code :∗P-TQFP-0144-2020-0.50 144-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 20.0 × 20.0 mm Lead shape Gullwing Sealing method Plastic mold


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    PDF FPT-144P-M10 P-TQFP-0144-2020-0 144-pin FPT-144P-M10) F144022S-1C-1 9811

    Untitled

    Abstract: No abstract text available
    Text: PPE HEAT PROOF 23 A 17.55 25.20 A' TQFP 20x20 1.4mm 135.9 100.8 UNIT : mm 23 25.40 279.4 17.80 315.0 322.6 SECTION A – A' 23 6.02 6.35 7.62 19.85 Applied Package 144-pin • Plastic TQFP (1.4mm thick) 176-pin • Plastic TQFP (1.4mm thick) Quantity (pcs)


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    PDF 144-pin 176-pin

    MOTOROLA TOP MARK

    Abstract: TQFP 144 PACKAGE DIMENSION DSP56005
    Text: Pin-out and Package 144-pin TQFP Top View Pin-out and Package Information 109 Orientation Mark Top View 1 37 MODC/NMI MODB/IRQB MODA/IRQA GNDCK CKOUT VCCCK RESET PINIT VCCP PCAP GNDP XTAL EXTAL HA2/PB10 GNDH VCCQ GNDQ HA1/PB9 HA0/PB8 HACK/PB14 VCCH HEN/PB12


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    PDF 144-pin HA2/PB10 HACK/PB14 HEN/PB12 HR/W/PB11 HREQ/PB13 DSP56005 MOTOROLA TOP MARK TQFP 144 PACKAGE DIMENSION

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing Q144.20x20C 144 LEAD THIN QUAD FLATPACK PACKAGE TQFP Rev 0, 2/12 MILLIMETERS D SYMBOL D1 D2 A A2 A1 - 0.05 S -D- MIN -B- -A- e b L1 E E1 E2 4X aaa C A-B D bbb H A-B D 0.05 0.10 0.95 1.00 1.05 0.037 0.039 0.041


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    PDF 20x20C

    TQFP144 DIMENSION

    Abstract: TQFP144-P-1616-0 TQFP 144 PACKAGE DIMENSION 1616M
    Text: 144PFB-A Plastic 144pin 16✕16mm body TQFP Weight g JEDEC Code – Lead Material Cu Alloy MD e EIAJ Package Code TQFP144-P-1616-0.40 Under Development ME HD b2 D 144 114 1 l2 113 36 Symbol HE E Recommended Mount Pad 78 37 A 77 L1 F b y A1 c A2 e L Detail F


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    PDF 144PFB-A 144pin TQFP144-P-1616-0 TQFP144 DIMENSION TQFP 144 PACKAGE DIMENSION 1616M

    TQFP 144 PACKAGE DIMENSION

    Abstract: TQFP144 DIMENSION TQFP144
    Text: 144P6M-A Plastic 144pin 12✕12mm body TQFP EIAJ Package Code TQFP144-P-1212-0.30 Weight g JEDEC Code – Lead Material Alloy 42 HD D 144 109 E HE 108 1 Symbol 36 73 37 72 A L1 F b y A1 c A2 e L Detail F A A1 A2 b c D E e HD HE L L1 y Dimension in Millimeters


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    PDF 144P6M-A 144pin TQFP144-P-1212-0 TQFP 144 PACKAGE DIMENSION TQFP144 DIMENSION TQFP144

    TQFP144

    Abstract: 144PFB
    Text: MMP 144PFB-A Plastic 144pin 16✕16mm body TQFP Weight g 0.62 JEDEC Code – Lead Material Cu Alloy MD ME e EIAJ Package Code TQFP144-P-1616-0.40 b2 HD D 144 109 I2 Recommended Mount Pad 1 108 36 A A1 A2 b c D E e HD HE L L1 Lp HE E Symbol 73 37 A 72 L1 F


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    PDF 144PFB-A 144pin 1616mm TQFP144-P-1616-0 TQFP144 144PFB

    A2 diode

    Abstract: transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4
    Text: : Available, : Under development Plastic QFP Fine Pitch Nominal Dimensions (mm) Lead Pitch Classification (mm) Pin Counts 48 64 72 80 88 100 120 144 160 176 208 216 240 256 272 304 376 QFP 7x7 TQFP QFP 10 × 10 TQFP QFP 12 × 12 TQFP QFP 14 × 14 LQFP 0.5


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    PDF S176GM-50-3EU, S176GM-50-8EU-2 S208GD-50-5ML-2 S208GD-50-5EL-1 P208GD-50-LML, S208GD-50-8EU-2 S216GM-40-8EV P240GN-50-LMU, S256GD-40-LMV, S272GP-50-LMU, A2 diode transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4

    MACH4A

    Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384
    Text: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size


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    PDF 208-Ball 256-Ball 100-Ball 49-Ball 144-Ball 100-Pin 128-Pin 48-Pin 44-Pin 144-Pin MACH4A JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384

    EQFP 144 PACKAGE

    Abstract: BGA and eQFP Package TQFP 144 PACKAGE altera micro fineline BGA eQFP EPC16
    Text: Package dimensions selector guide FineLine BGA FBGA ; Hybrid FineLine BGA (HFBGA) as noted 1,932 1,760 45.00 x 45.00 1.00 1,517 43.00 x 43.00 1.00 1,020 40.00 x 40.00 1.00 896 33.00 x 33.00 1.00 1,508 780 31.00 x 31.00 1.00 40.00 x 40.00 1.00 35.00 x 35.00


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    LC4064V

    Abstract: Lattice ispmach LC4064V ispMACH 4A5 flip chip bga 0,8 mm OR3T80 LC4064 OR3C80 OR3T20 OR3T30 OR3T55
    Text: Lattice Package Offering Packages shown actual size. All dimensions refer to package body size. 32-Pin QFN 5 x 5 mm 0.5 mm pitch 6 x 6 mm 0.5 mm pitch 23 x 23 mm 1.0 mm pitch 27 x 27 mm 1.27 mm pitch 100-Ball fpBGA 132-Ball csBGA 56-Ball csBGA 11 x 11 mm 1.0 mm pitch


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    PDF 32-Pin 100-Ball 132-Ball 56-Ball 269-Ball 208-Ball 256-Ball 100-Pin 128-Pin 44-Pin LC4064V Lattice ispmach LC4064V ispMACH 4A5 flip chip bga 0,8 mm OR3T80 LC4064 OR3C80 OR3T20 OR3T30 OR3T55

    7007-048

    Abstract: 7542-100-X-07 7007-048-X-07 7228-208-X-08 7342-128-X-07 7042-100-X-08 7342-100-X-07 7310-052-X-08 7010-064 socket 7010-064-X-08
    Text: www.antares-att.com 800.348.2505 BURN-IN 7000 SERIES QFP & TQFP SOCKETS > Open Top > Zero Insertion Force for auto load > High normal force scrubbing contacts > For 0.5mm pitch and higher, corner post alignment feature accommodates JEDEC package dimensions.


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    PDF 2X150 2X150 MS-026 MS-029 MS-022 MO-112 7020-128-X-X8* 7020-144-X-08 7024-160-X-X8* 7024-176-X-X8* 7007-048 7542-100-X-07 7007-048-X-07 7228-208-X-08 7342-128-X-07 7042-100-X-08 7342-100-X-07 7310-052-X-08 7010-064 socket 7010-064-X-08

    ep600i

    Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)


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    bd248

    Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)


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    PQFP 176

    Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
    Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●


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    PDF 144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760

    ep600i

    Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
    Text: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


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    IDT package marking

    Abstract: IDT marking IDT marking TQFP IDT TOP SIDE package marking A-0410-02 IDT CODE DATE marking MQUAD pbga 144 TQFP 132 PACKAGE PDIP-48
    Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A-0410-02 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: 10/5/2004 DATE: All IDT Products (see attached list)


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    3014-100-X-08

    Abstract: 3228-208-X-08 3042-100 3014-120-X-X8 28X28 3014-100 equivalent M 393 QFP 128 lead .5mm 3342-100-X-07 3042-128-X-08
    Text: Burn-In Test Sockets 3000 Series OTQFP & TQFP Sockets • • • • Open Top Quad Flatpack & Thin Quad Flatpack Reduced actuation force contact design Zero Insertion Force for auto load For 0.5mm pitch and higher, corner post alignment feature accommodates JEDEC package dimensions.


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    208 pin rqfp drawing

    Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


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    TQFP 144 PACKAGE DIMENSION

    Abstract: No abstract text available
    Text: 4 Mechanical Specifications The 21142 is contained in either a 144-pin PQFP package type or a 144-pin TQFP package type. Figure 23 shows the mechanical layout of the PQFP and Table 37 lists PQFP package dimensions in millimeters. Figure 24 shows the mechanical layout of the TQFP and Table 38 lists TQFP


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    PDF 144-pin TQFP 144 PACKAGE DIMENSION

    14.5M 1982

    Abstract: No abstract text available
    Text: 4 Mechanical Specifications The 21143 is contained in either a 144-pin PQFP package type or a 144-pin TQFP package type. Figure 24 shows the mechanical layout of the PQFP, and Table 38 lists the PQFP package dimensions in millimeters. Figure 25 shows the mechanical layout of the TQFP, and Table 39 lists the TQFP


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    PDF 144-pin 14.5M 1982

    SOP48

    Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
    Text: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7


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    PDF QFP12 QFP13 QFP15 QFP14 12X12X1 14X20X2 14X14X1 SOP48 CF RM sot89 SOP38 14X14X2 epson QFP 216 45x45 mm bga 14x14x2.7

    TQFP 144 PACKAGE DIMENSION

    Abstract: ANSI Y14.5-1982
    Text: TDP VIEW . / \ BDTTDM VIEW □DP LEAD SIDES b DETAIL EVEN LEAD 'A' SIDES e/2 y v\ si x iyv\ PROPRIETARY INFORMATION TITLE« PKG. OUTLINE, 144L TQFP, 20x20x1.0 MM DOCUMENT CONTROL NO. 21-0087 REV A NDTES: 1, A LL DIMENSIONING AND TOLERANCING CONFORM TD ANSI Y14,5-1982,


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    PDF 20x20x1 MO-136, TQFP 144 PACKAGE DIMENSION ANSI Y14.5-1982

    Untitled

    Abstract: No abstract text available
    Text: ASIC # Standard Cells Package List Numerical value in the list means pin count. QFP, QFH, TQFP, LQFP Type Dimension (unit) Package \ Pin pitch (mm) (mm Xm m ) 7d 40,44 1.51,2.0t 0.8 Q FP'2 10D 0.65 12° 14a 14X20 18° QFH*2 64 2.0t 84 2.5t 64 2.0t 80 2.0t


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    PDF 14X20