Power Semiconductor Applications Philips Semiconductors
Abstract: "Power Semiconductor Applications" Philips "CHAPTER 1 Introduction to Power Semiconductors" CHAPTER 1 Introduction to Power Semiconductors "static induction thyristor" varistor 503 static induction Thyristor TELEVISION EHT TRANSFORMERS 201 Static Induction Thyristor varistor 10c 471
Text: Thermal Management Power Semiconductor Applications Philips Semiconductors CHAPTER 7 Thermal Management 7.1 Thermal Considerations 553 Thermal Management Power Semiconductor Applications Philips Semiconductors Thermal Considerations 555 Thermal Management
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GaAs FET operating junction temperature
Abstract: 5257 transistor chip die hp transistor HP transistor cross reference mtt2
Text: High Frequency Transistor Primer Part III Thermal Properties Table of Contents I. I. Thermal Resistance Thermal Resistance . 1 A. Definition .
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ED-19,
5966-3084E
GaAs FET operating junction temperature
5257 transistor
chip die hp transistor
HP transistor cross reference
mtt2
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SOT23-6 PMOS
Abstract: octal MOSFET ARRAY SOT23 PMOS MOSFET sot23-6 SCSI Terminators MIC184 sot-23 P-Channel MOSFET super i/o SOT23-6 package "SCSI Terminators"
Text: Thermal/System Management, Transistors and Arrays, Timers, References, and SCSI Terminators Selection Guide 2-Wire Serial Thermal Supervisors Remote Zone Description MIC184 Local/Remote Thermal Supervisor MIC280 Precision IttyBitty Thermal Supervisor IttyBitty®
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MIC184
MIC280
OT23-6
MIC281
MIC284
MIC384
MIC184
MIC94031
V-to-15V
SOT23-6 PMOS
octal MOSFET ARRAY
SOT23 PMOS
MOSFET sot23-6
SCSI Terminators
sot-23 P-Channel MOSFET
super i/o
SOT23-6 package
"SCSI Terminators"
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FR4 epoxy pcb double sided
Abstract: SA transistor thermal resistance of low power semiconductor
Text: Philips Semiconductors Thermal considerations PowerMOS Transistors The elements of thermal resistance shown in Fig.2 are defined as follows: THERMAL CONSIDERATIONS Thermal resistance Circuit performance and long-term reliability are affected by the temperature of the transistor die. Normally, both are
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MBB446
MBB447
FR4 epoxy pcb double sided
SA transistor
thermal resistance of low power semiconductor
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Abstract: No abstract text available
Text: AN11113 LFPAK MOSFET thermal design guide - Part 2 Rev. 2 — 16 November 2011 Application note Document information Info Content Keywords LFPAK, MOSFET, thermal analysis, design and performance, thermal considerations, thermal resistance, thermal vias, SMD, surface-mount,
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AN11113
AN10874)
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smd transistor 647
Abstract: BUX84 BUX84S SC18
Text: Philips Semiconductors Product specification NPN high voltage Power transistor FEATURES BUX84S SYMBOL • Fast switching • Excellent thermal stability • High thermal cycling performance • Low thermal resistance • Surface mounting package QUICK REFERENCE DATA
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BUX84S
OT428
BUX84S
smd transistor 647
BUX84
SC18
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DIN4762
Abstract: "beryllium oxide" transistor BUT 12 UNC4-40
Text: TECHNICAL PUBLICATION Thermal aspects of flange-mounted r.f. power transistors TECHNICAL NOTE 141 Philips Semiconductors Thermal aspects of flange-mounted r.f. power transistors CONTENTS 1 INTRODUCTION 2 PRACTICAL POINTS: 3 THERMAL MODELS 4 SURFACE CONDITIONS
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SCA57
DIN4762
"beryllium oxide"
transistor BUT 12
UNC4-40
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SMD TRANSISTOR js t
Abstract: smd transistor 2T smd transistor js
Text: Philips Semiconductors Thermal Considerations - Transistors THERMAL CONSIDERATIONS - TRANSISTORS Thermal resistance Circuit performance and long-term reliability are affected by the temperature of the transistor die. Normally, both are improved by keeping the die temperature junction
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MBG388
SMD TRANSISTOR js t
smd transistor 2T
smd transistor js
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free diode 1n4001
Abstract: 1N4001 transistor free diodes 1N4001 Temperature Sensors DIODE 1N4001 RESISTANCE MAX6581 MAX6602 MAX6643 MAX6654 MAX6690
Text: Maxim > App Notes > Automotive Temperature sensors and thermal management Keywords: temperature sensor, ideality, thermal diode, thermal sense diodes, temp sensor, remote temp sensor, sensors, thermal, temperatuer, temperature Sep 05, 2002 APPLICATION NOTE 1057
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MAX6698
MAX6699
com/an1057
AN1057,
APP1057,
Appnote1057,
free diode 1n4001
1N4001 transistor free
diodes 1N4001
Temperature Sensors
DIODE 1N4001 RESISTANCE
MAX6581
MAX6602
MAX6643
MAX6654
MAX6690
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free diode 1n4001
Abstract: diode data DIODE 1N4001 RESISTANCE 35606K MAX6643 MAX6644 MAX6645 MAX6646 MAX6647 MAX6653
Text: Maxim > App Notes > AUTOMOTIVE TEMPERATURE SENSORS and THERMAL MANAGEMENT Keywords: temperature sensor, ideality, thermal diode, thermal sense diodes, temp sensor, remote temp sensor, sensors, thermal, temperatuer, temperature Apr 17, 2002 APPLICATION NOTE 1057
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MAX6657:
MAX6660:
MAX6661:
MAX6664:
MAX6680:
MAX6681:
MAX6690:
MAX6692:
MAX6695:
MAX6696:
free diode 1n4001
diode data
DIODE 1N4001 RESISTANCE
35606K
MAX6643
MAX6644
MAX6645
MAX6646
MAX6647
MAX6653
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EMC for PCB Layout
Abstract: AN10874 thermal analysis on pcb JESD51-2
Text: AN10874 LFPAK MOSFET thermal design guide Rev. 02 — 27 January 2011 Application note Document information Info Content Keywords LFPAK, MOSFET, thermal analysis, design and performance, thermal considerations, thermal resistance, junction to ambient, junction to
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JESD51,
EMC for PCB Layout
AN10874
thermal analysis on pcb
JESD51-2
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GROUND BASED RADAR
Abstract: AIRBORNE DME vimostm
Text: Thermal Characteristics & Considerations VIMOS Product Portfolio VIMOS THERMAL CHARACTERISTICS & CONSIDERATIONS Introduction: This document provide’s the RF amplifier design Engineer with a useful reference to aid in thermal considerations and calculations, applied to the VIMOSTM portfolio of RF power transistors. Rather
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1214-1400MHz
200uS
GROUND BASED RADAR
AIRBORNE DME
vimostm
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Thermal considerations for SOT89
Abstract: BD136 BD226 BDX35
Text: Philips Semiconductors Thermal Impedance Curves General THERMAL IMPEDANCE CURVES Transistor thermal impedance curves for various packages and duty cycles are shown in Figures 1 to 23 inclusive. MGL193 103 handbook, full pagewidth Zth j-a δ=1 0.75 0.5 (K/W)
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MGL193
MGG837
OT416
SC-75)
MGL613
OT490
SC-89)
Thermal considerations for SOT89
BD136
BD226
BDX35
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EMC for PCB Layout
Abstract: thermal analysis on pcb AN10874 LFPAK package pcb thermal Design guide JESD51-2
Text: AN10874 LFPAK MOSFET thermal design guide Rev. 01 — 19 November 2009 Application note Document information Info Content Keywords LFPAK, MOSFET, thermal analysis, design and performance, thermal considerations, thermal resistance, junction to ambient, junction to
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AN10874
JESD51,
AN10874
EMC for PCB Layout
thermal analysis on pcb
LFPAK package
pcb thermal Design guide
JESD51-2
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AUTOMATIC 12V PC FAN CONTROL BY USING THERMISTOR
Abstract: 48h diode zener temperature sensor 2N3904 MON35W42 16mV-LSB
Text: MON35W42 Hardware Monitoring IC with Thermal Diode Interface FEATURES !" Monitoring Items 3 Thermal Inputs From Remote Thermistors or 2N3904 NPN-type Transistors or Pentium II Deschutes Thermal Diode Output 9 Voltage Inputs - Typical for Vcore, +3.3V, +12V, -12V, +5V, -5V, +5V Vsb,
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MON35W42
2N3904
MON35W42
AUTOMATIC 12V PC FAN CONTROL BY USING THERMISTOR
48h diode zener
temperature sensor
16mV-LSB
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base resistance for SOT23
Abstract: MBB444
Text: Philips Semiconductors Thermal Considerations - FETs General , , , THERMAL CONSIDERATIONS ,, , Thermal resistance 1 Circuit performance and long-term reliability are affected by the temperature of the transistor die. Normally, both are improved by keeping the die temperature junction
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MBE242
MGC124
MBB447
base resistance for SOT23
MBB444
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AN569 in Motorola Power Applications
Abstract: motorola mosfet BASIC THERMAL MANAGEMENT OF POWER SEMICONDUCTORS MTP15N06V equivalent dpak DIODE ANODE COMMON motorola ir 722c motorola Power Applications Manual mtv32 DV240 AN1083
Text: Thermal Compendium Table of Contents Abstracts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Basic Semiconductor Thermal Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
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Abstract: No abstract text available
Text: R R series Thermal Emission Microscope IAHEAI New High-sensitivity detector thermal detector InSb Motorized turret with objective lenses • Two objective lenses for analyzing thermal emissions • Three objective lenses for probing and laser scanning Thermal Emission Microscope
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B1201
SSMS0012E15
JUN/2015
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"Audio Power Amplifiers"
Abstract: darlington transistor for audio power application Germanium Power Diodes thermal resistance TO metal package aluminum kovar darlington power transistor power led heat sink
Text: PACKAGE INFORMATION THERMAL DESIGN FOR PLASTIC ICs THERMAL DESIGN FOR PLASTIC INTEGRATED CIRCUITS Proper thermal design is essential for reliable operation of many electronic circuits. Under severe thermal stress, leakage currents increase, materials decompose, and components drift in value or fail.
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Abstract: No abstract text available
Text: Philips Semiconductors Thermal considerations PowerMOS Transistors The elements of thermal resistance shown in Fig.2 are defined as follows: THERMAL CONSIDERATIONS Thermal resistance Circuit performance and long-term reliability are affected by the temperature of the transistor die. Normally, both are
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Abstract: No abstract text available
Text: MON35W42 STANDARD MICROSYSTEMS CORPORATION Hardware Monitoring IC with Thermal Diode Interface FEATURES • Monitoring Items - • • 3 Thermal Inputs From Remote Thermistors or 2N3904 NPN-type Transistors or Pentium II Deschutes Thermal Diode Output
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MON35W42
2N3904
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Untitled
Abstract: No abstract text available
Text: Philips Semiconductors Product specification NPN high voltage Power transistor FEATURES • • • • • BUX84S SYMBOL QUICK REFERENCE DATA Fast switching Excellent thermal stability High thermal cycling performance Low thermal resistance Surface mounting package
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BUX84S
BUX84S
OT428
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Untitled
Abstract: No abstract text available
Text: MON35W42 STANDARD MICROSYSTEMS CORPORATION Hardware Monitoring 1C with Thermal Diode Interface FEATURES Monitoring Items 3 Thermal Inputs From Remote Thermistors or 2N3904 NPN-type Transistors or Pentium II Deschutes Thermal Diode Output 9 Voltage Inputs - Typical for Vcore,
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MON35W42
2N3904
MON35W42
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Untitled
Abstract: No abstract text available
Text: Philips Semiconductors Small-signal Transistors General THERMAL CONSIDERATIONS The elements of thermal resistance shown in Fig.8 are defined as follows: Thermal resistance Circuit performance and long-term reliability are affected by the temperature of the transistor die. Normally, both are
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