JESD51-2
Abstract: exposed QFP 144 100L JESD51-7 Techpoint
Text: MQFP-ed Exposed Drop-in Heat Slug Metric Quad Flat Pack • 14 x 20mm to 32 x 32mm • 100 to 240 lead count • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 14 x 20mm to 32 x 32mm STATS ChipPAC’s Exposed Drop-In Heat Slug Metric Quad
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AN 7823
Abstract: 100L JESD51-2 JESD51-7 Techpoint
Text: MQFP-d Heat Spreader Metric Quad Flat Pack • 14 x 14mm to 32 x 32mm • 64 to 240 lead count • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 14 x 14mm to 32 x 32mm STATS ChipPAC’s Heat Spreader Metric Quad Flat Pack MQFP-d is a thermally enhanced version of the QFP
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exposed QFP 144
Abstract: exposed QFP 128 TQFP-EP AN 7823 EP 603 QFP-EP 100L 144L JESD51-2 JESD51-7
Text: QFP-ep Exposed Pad Quad Flat Pack • 7 x 7mm to 24 x 24mm body sizes • 32 to 216 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 24 x 24mm STATS ChipPAC’s Exposed Pad Quad Flat Pack QFP-ep is a thermally enhanced version of the QFP package. Thermal
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STATS ChipPAC
Abstract: AN 7823 EP 603 LQFP Package LQFP Package tray QFP JEDEC tray 64 leads qfp 32 QFP PACKAGE thermal resistance Techpoint
Text: QFP-SD Stacked Die Quad Flat Pack • Stacking of die enables more functionality and integration in a conventional QFP package FEATURES DESCRIPTION • Combining devices into one package reduces PCB real estate and cost STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD. LQFP-SD is a stacked die
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Techpoint
Abstract: 100L JESD51-2 JESD51-7 lqfp 7x7 tray QFP 128 bonding
Text: LQFP Low Profile Quad Flat Pack • 7 x 7mm to 28 x 28mm body sizes • 32 to 208 lead counts • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 28 x 28mm STATS ChipPAC’s LQFP is a low profile 1.4mm version of the QFP. The LQFP is a leadframe based, plastic encapsulated
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JESD51-7
Abstract: 100L JESD51-2 STATS ChipPAC Techpoint
Text: MQFP Metric Quad Flat Pack • 10 x 10mm to 32 x 32mm body sizes • 44 to 240 lead counts • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 10 x 10mm to 32 x 32mm STATS ChipPAC’s Metric Quad Flat Pack MQFP is a leadframe based, plastic encapsulated package with gull
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80mmC
JESD51-7
100L
JESD51-2
STATS ChipPAC
Techpoint
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100L
Abstract: JESD51-2 JESD51-7 32 QFP PACKAGE thermal resistance tqfp 7x7 1.4 tray tqfp 7x7 tray tqfp 64 thermal resistance Techpoint
Text: TQFP Thin Profile Quad Flat Pack • 7 x 7mm to 14 x 14mm • 32 to 128 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 14 x 14mm The Thin Profile Quad Flat Pack TQFP belongs to STATS ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP
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cx28500-12
Abstract: CX28500G-12 CX28500 traceability M28529G-12
Text: September 3, 2009 CN-090309 Customer Notification Test Site Transfer for CX28500, M28525, and M28529 Products Dear Valued Customer: This notification is a supplement to CN-071309 regarding the closure of the STATS test facility in San Diego, California, and the test transfer of multiple products. During the qualification process for these products, it was
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CN-090309
CX28500,
M28525,
M28529
CN-071309
CX28500-12,
CX28500G-12,
M28525-12,
M28525G-12,
M28529-12,
cx28500-12
CX28500G-12
CX28500
traceability
M28529G-12
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25821
Abstract: dallas date code ds12887 25854
Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 MAR '00 25224 9950 OSEP DE940040AAC SOIC 50 50 DS1869 A3 JUN '00 25547 0017 CPS ChipPac, China DH833210AAB SOIC
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DS1621
DS1869
DE940040AAC
DH833210AAB
DS2181A
DS5002
DE004552ABD
DN012259AAL
DN028766AAD
25821
dallas date code ds12887
25854
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JESD51-9
Abstract: TFLGA AN 7823 JESD51-2
Text: FLGA Fine Pitch Land Grid Array • Array molded, cost effective, space-saving packaging solution • Available in 1.20mm TFLGA , 1.00mm (VFLGA), and 0.80mm (WFLGA) maximum thickness • Thinner than FBGA • Exposed thermal/mechanical lands available • Laminate substrate based enabling 2 and 4
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Analog devices marking Information MSOP
Abstract: TSSOP-EP 0.5 mm pitch TSSOP tssop 38 footprint Analog 8 msop devices marking AN 7823 Analog devices marking Information PACKAGE TSSOP_ ST TSSOP Marking die paddle MSOP-EP
Text: TSSOP and MSOP Small Outline Packages • Wide range of body sizes • 8 to 56 lead counts • Thermally enhanced versions available TSSOP-ep and MSOP-ep FEATURES TSSOP • Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm • Lead Count: 8L to 56L • Lead Pitch: 0.50mm & 0.65mm
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MO-153)
Analog devices marking Information MSOP
TSSOP-EP
0.5 mm pitch TSSOP
tssop 38 footprint
Analog 8 msop devices marking
AN 7823
Analog devices marking Information PACKAGE TSSOP_
ST TSSOP Marking
die paddle
MSOP-EP
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DUAL ROW QFN leadframe
Abstract: QFN tray qfn 4x4 JEDEC qfn tray tray qfn 8x8 tray qfn 6x6 QFN tray 8x8 tray qfn 9x9 QFN 64 8x8 PACKAGE TRAY AN 7823 JEDEC qfn tray 5x5
Text: QFN Quad Flat No-Lead Package • Punch or Saw singulated formats • Body sizes from 2 x 2mm to 12 x 12mm • Pin counts from 4L to 156L • Square or rectangular body sizes • Leads on four sides of the body QFN • Leads on two opposing sides of the
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techpoint
Abstract: AN 7823 Unbiased HAST 130, 85 RH, 100 Hrs
Text: FLGA-SD Fine Pitch Land Grid Array - Stacked Die • Stacking of die allows for more functionality in an array molded, cost effective, space saving package solution • Available in 1.2mm TFLGA , 1.0mm (VFLGA), and 0.8mm (WFLGA) maximum thickness • Thinner than FBGA
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AN 7823
Abstract: Techpoint
Text: BCC Bump Chip Carrier BCC+ exposed paddle without ground ring • Saw singulated format • Package height 0.8mm max. • Square body size (rectangular body designable) • Staggered dual row or single row bump design BCC+ (exposed paddle with ground ring)
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VFBGA 120
Abstract: VFBGA package tray tray 23X23 10x14 239.2 AN 7823 chippac tray 8X14 vFBGA* 96 bALL
Text: FBGA-SD Fine Pitch Ball Grid Array - Stacked Die • FBGA-SD: Laminate substrate based enabling 2 & 4 layers of routing flexibility • FBGA-T-SD: Single metal layer tape based substrate with dense routing & good electrical performance • Available in 1.4mm LFBGA-SD , 1.2mm (TFBGASD/TFBGA-T-SD), 1.0mm (VFBGA-SD/VFBGA-TSD) & 0.80mm (WFBGA-SD) maximum package
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997E-07
Abstract: No abstract text available
Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Double Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS21352 A4 DK031452AB LQFP STRESS: HIGH VOLTAGE LIFE MONITOR DATE ASSEMBLY
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DK031452AB
DS21352
DM941230AG
DN041061AAE
DK007198AAF
DK016058AA
DK016058AA
DS2108
997E-07
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dallas date code ds1230
Abstract: No abstract text available
Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS1620 D1 JUN '01 27096 0109 CPS ChipPac, China DH046190AAI SOIC 50 50 DS1869 A3 JUN '00
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DH046190AAI
DS1620
DS1869
DH833210AAB
DS5002
DN028766AAD
DN030363AAA
J-STD-020
DS1302
dallas date code ds1230
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ECG sensor
Abstract: epic sensor ECG Semiconductors WLCSP flip chip FO-WLP micromechanical
Text: Plessey Semiconductors debuts ECG sensor from passive component project - Electro. Page 1 of 2 ADVERTISE | SUBSCRIBE Home Semiconductors Packaging MEMS LEDs Displays Photovoltaics Energy Storage ElectroIQ E-Source Magazines Plessey Semiconductors debuts ECG sensor from
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/03/plessey-semiconductors-debuts-ecg-sen
ECG sensor
epic sensor
ECG Semiconductors
WLCSP flip chip
FO-WLP
micromechanical
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TI date code
Abstract: 271-14
Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Double Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS21352 A4 DN033071AAA LQFP STRESS: HIGH VOLTAGE LIFE MAR '01 26769 0103
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DS21352
DN033071AAA
DS2108
DN041061AAE
TI date code
271-14
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TI date code
Abstract: No abstract text available
Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C3 JUN '00 25568 0011 Carsem S DM941230AG
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DM941230AG
DM941226AA
DS2502
DM941226AA
DM941230AG
TI date code
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25804
Abstract: No abstract text available
Text: RELIABILITY MONITOR DS1000Z-25 OCT '00 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 150x1.4 OSEP 0033 PROCESS Single Poly, Single Metal DE009456ACE 8 SOIC 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1
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DS1000Z-25
DS1000
DE009456ACE
150x1
DS87C520
DE029195AAB
650x65
25804
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dallas date code ds1230
Abstract: dallas ds1230 25919 DS1230
Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 DE940040AAC SOIC A7 MAR '00 25224 9950 OSEP PACKAGE READ POINT QTY FAIL 50 50 RELIABILITY MONITOR STRESS:
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DS1621
DE940040AAC
DS5002
DS87C520
DM925587AAF
DK935356AAB
DK933191AAJ
DE952427AAD
DE014522ADB
dallas date code ds1230
dallas ds1230
25919
DS1230
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DALLAS DS80C320
Abstract: 25863
Text: RELIABILITY MONITOR DS1232L JAN '00 Monitor DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1232 C2-L 150 9948 PROCESS Single Poly, Single Metal DK933191AAJ 8 SOIC ATP Anam, PI 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7
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DS1232L
DS1232
DK933191AAJ
HRS87C520
DS87C520
DE013425AAD
J-STD-020
30C/60%
DALLAS DS80C320
25863
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JSTD-020
Abstract: DM035 26438
Text: RELIABILITY MONITOR DS1232L JAN '01 MONITOR REVISION DATE CD LOT NUMBER PINS PACKAGE 0051 DK038265AAC 8 C2-L SOIC PROCESS Single Poly, Single Metal 0.8 µm Standard Process DEVICE DS1232 WIDTH ASSEMBLY SITE 150x1.4 ATP Anam, PI JOB NO DESCRIPT Cf: 60% Ea: 0.7
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DS1232L
DK038265AAC
DS1232
J-STD-020
85C/85%
14x20x
DS80CH11
DS80CH11
DN034351AA
JSTD-020
DM035
26438
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