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    SSOP24 TUBE PACKING Search Results

    SSOP24 TUBE PACKING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    ELANSC300-33VC Rochester Electronics LLC Microcontroller, 32-Bit, 33MHz, CMOS, PQFP208, TQFP-208 Visit Rochester Electronics LLC Buy
    MC68040FE33A Rochester Electronics LLC Rochester Manufactured 68040, RISC 32-bit Microprocessor 33MHz, 184 CQFP Package, Commercial Temp spec. Visit Rochester Electronics LLC Buy
    CY7C4285-15ASC Rochester Electronics LLC FIFO, 64KX18, 10ns, Synchronous, CMOS, PQFP64, 10 X 10 MM, TQFP-64 Visit Rochester Electronics LLC Buy
    ML6431CH Rochester Electronics LLC Consumer Circuit, BICMOS, PQFP32, 7 X 7 MM, 1 MM HEIGHT, TQFP-32 Visit Rochester Electronics LLC Buy
    ML6430CH Rochester Electronics LLC Consumer Circuit, BICMOS, PQFP32, 7 X 7 MM, 1 MM HEIGHT, TQFP-32 Visit Rochester Electronics LLC Buy

    SSOP24 TUBE PACKING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    1937 sot23

    Abstract: SOT263 SOT89 pq SO24 SSOP16 SSOP24 sot263-1
    Text: PACKING AND PACKING QUANTITIES Page SCOPE SURFACE-MOUNT DEVICES Tape specification Reel specification Tube specification Packing quantities LEADED DEVICES Tape and reel packing of TO-92 devices Bulk packing of TO-92 devices Philips Semiconductors Packing and


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    SOT263

    Abstract: SOT89 pq SC13 SO24 SSOP16 SSOP24 4 PIN THROUGH HOLE TRANSISTORS sot263-1
    Text: DISCRETE SEMICONDUCTORS DATA SHEET Packing and packing quantities PowerMOS transistors 1998 Jun 03 Supersedes data of 1997 Jun 23 File under Discrete Semiconductors, SC13 PACKING AND PACKING QUANTITIES Page SCOPE SURFACE-MOUNT DEVICES Tape specification Reel specification


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    QFP80

    Abstract: sop18 sop28 SSOP10 TO-252 njrc DIP18 DIP20 DIP40 SDIP22 SDIP24
    Text: PACKING SPECIFICATION TABLE • General Description NJRC delivers ICs in 4 methods, plastic tube container, two kinds of Taping, tray and vinyl bag packing. Except adhesive tape treated anti electrostatic and contain carbon are using as the ESD Electrostatic


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    PDF 25pcs/tube 20pcs/tube 14pcs/tube 10pcs/tube 000pcs/ QFP80 sop18 sop28 SSOP10 TO-252 njrc DIP18 DIP20 DIP40 SDIP22 SDIP24

    SSOP10

    Abstract: DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30
    Text: PACKING SPECIFICATION TABLE • General Description NJRC delivers ICs in 4 methods, plastic tube container, two kinds of Taping, tray and vinyl bag packing. Except adhesive tape treated anti electrostatic and contain carbon are using as the ESD Electrostatic


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    PDF 25pcs/tube 20pcs/tube 14pcs/tube 10pcs/tube SSOP10 SSOP10 DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30

    QFP80

    Abstract: sop28 SSOP10 SOP8 tray reel
    Text: PACKING SPECIFICATION TABLE • General Description NJRC delivers ICs in 4 methods, plastic tube container, two kinds of Taping, tray and vinyl bag packing. Except adhesive tape treated anti electrostatic and contain carbon are using as the ESD Electrostatic


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    PDF 25pcs/tube 20pcs/tube 14pcs/tube 10pcs/tube 000pcs/ QFP80 sop28 SSOP10 SOP8 tray reel

    MARKING CODE SMD led driver

    Abstract: TPSG philips PLL FM MODULATOR
    Text: Philips Semiconductors: Product information on TDA8822, Universal I²C-bus programmable RF modulator Go to Philips Semiconductors' home page Catalog & Datasheets Product INFOrmation page Catalog by Function Catalog by System Cross reference Models Packages


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    PDF TDA8822, TDA8822; TDA8822 TDA8822 MARKING CODE SMD led driver TPSG philips PLL FM MODULATOR

    DIP18

    Abstract: DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30 TO-252 njrc
    Text: PACKING SPECIFICATION TABLE • General Description NJRC delivers ICs in 4 methods, plastic tube container, two kinds of Taping, tray and vinyl bag packing. Except adhesive tape treated anti electrostatic and contain carbon are using as the ESD Electrostatic


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    PDF 25pcs/tube 20pcs/tube 14pcs/tube 10pcs/tube 20pcs/pcs/tray 50pcs/tray DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30 TO-252 njrc

    LQFP144

    Abstract: QFN24 tray qfp32 QFN tray QFP52-A2 QFP52-S1 SSOP20 DIP18 DIP20 DIP32
    Text: PACKING SPECIFICATION TABLE • General Description NJRC delivers ICs in 4 methods, plastic tube container, two kinds of Taping, tray and vinyl bag packing. Except adhesive tape treated anti electrostatic and contain carbon are using as the ESD Electrostatic


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    PDF DIP14 DIP16 DIP18 DIP20 DIP22 DIP24 DIP32 DIP40 SDIP22 SDIP24 LQFP144 QFN24 tray qfp32 QFN tray QFP52-A2 QFP52-S1 SSOP20 DIP18 DIP20 DIP32

    smps FAN4803

    Abstract: "SMPS Controller" KA7553 INVERTER 500 W SMPS FAN4803-2 ILC6377SOADJX smps 600 PFM SOT23 smps controller REGULATOR SOT89
    Text: Analog and Mixed Signal Switching Regulators — DC:DCConversion ICs Application Part Number Package Packing FAN5035MTCX Voltage Mode DC-DC IC TSSOP-24 TnR FAN5037M Desktop PC Logic/Vtt SO-8 Tube FAN5037MX Desktop PC Logic/Vtt SO-8 TnR FAN5038M Dual Voltage Controller for DSP/ASIC/FPGA Supplies


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    PDF FAN5035MTCX FAN5037M FAN5037MX FAN5038M FAN5038MX FAN5056MV85 FAN5056MV85X FAN5059M FAN5059MX FAN5063M smps FAN4803 "SMPS Controller" KA7553 INVERTER 500 W SMPS FAN4803-2 ILC6377SOADJX smps 600 PFM SOT23 smps controller REGULATOR SOT89

    DO247

    Abstract: K 1603 to-220 QSOP24 QSOP28 SSOP20 SSOP24 TSSOP24 TSSOP28 PD0022 Package and Packing Information ST SMC
    Text: PD0022 Packing information Axial, Throuh hole, Surface mount and Chip scale packages for IPAD , Protection, Rectifiers, Thyristors and ACSwitches 1 Tape and reel delivery mode 1.1 Tape dimensions for Surface mount packages Table 1. Surface mount devices all dimensions in millimeters


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    PDF PD0022 DO247 K 1603 to-220 QSOP24 QSOP28 SSOP20 SSOP24 TSSOP24 TSSOP28 PD0022 Package and Packing Information ST SMC

    74BC645

    Abstract: 74bc244 BC242 bc540 BC541 BC244 bc574 BC240 bc564 BC241
    Text: Bi-CMOS Logic TD74ABT/TD74BC Series Toshiba Bi-CMOS Logic TD74ABT / TD74BC Series Outline , High-speed bus systems based on today s advanced CPUs require more than just standard logic. In particular, the bus interfaces of such systems demand very high-performance devices. To meet these needs, Toshiba


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    PDF TD74ABT/TD74BC TD74ABT TD74BC 74ABT 74BC244 74BC645 74bc244 BC242 bc540 BC541 BC244 bc574 BC240 bc564 BC241

    24V 10A SMPS

    Abstract: ka3525 ka7632 KA7812ATU KA3501 RC5054AM KA317T KA7808TU 24v 2a smps KA337TU
    Text: Analog and Mixed Signal Products CD-ROM Selection Guide Regulators Product Description Package Packing Code1 Suffix References LM336Z25 [KA336Z-2.5] LM336Z5 [KA336Z-5] LM431ACM [TL431CD][KA431D] LM431ACZ [TL431CLP][KA431Z] Programmable shunt regulator, 2.5V


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    PDF KA317TU] KA350TU] KA337TU] OT-23-5 SO-16 SO-20 SSOP-20 SO-24 24V 10A SMPS ka3525 ka7632 KA7812ATU KA3501 RC5054AM KA317T KA7808TU 24v 2a smps KA337TU

    PD0022

    Abstract: marking code w2 sot323 marking w0 sot-23 mlp 836 RD91 package QFN-6x6 diode sod-123 marking code 120 STMicroelectronics marking code date SOT 23 TO202 package transistor marking 36L
    Text: PD0022 Packing information Axial, through hole, surface mount and chip scale packages for IPAD , protection, rectifiers, thyristors and ACSs™ 1 Tape and reel delivery mode 1.1 Tape dimensions for surface mount packages Table 1. Surface mount devices - all dimensions in millimeters


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    PDF PD0022 35-8L PD0022 marking code w2 sot323 marking w0 sot-23 mlp 836 RD91 package QFN-6x6 diode sod-123 marking code 120 STMicroelectronics marking code date SOT 23 TO202 package transistor marking 36L

    JEDEC TRAY DIMENSIONS

    Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
    Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors


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    PDF manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package

    M62364G-R24-R

    Abstract: No abstract text available
    Text: UNISONIC TECHNOLOGIES CO., M62364 CMOS IC 8-BIT 8-CH MULTIPLYING D-A CONVERTER WITH BUFFER AMPLIFIERS SSOP-24 209mil „ DESCRIPTION The UTC M62364 is a CMOS 8-bit, 8-ch D/A converter having a multiplying function and output buffer amplifiers. It has a serial data input and can easily communicate with a


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    PDF M62364 SSOP-24 209mil) M62364 OP-24 QW-R502-008 M62364G-R24-R

    RC5054AM

    Abstract: LDO PCB Layout Guidelines RC5058M RC5041M FAN1583 15V 1A adjustable regulator FMS72 RC431AT RC5060M RC5051C
    Text: Analog and Mixed Signal Products CD-ROM Selection Guide Vertical Market—Desktop Computing Product Description LM431ACM [TL431CD] [KA431D] Reference, Adjustable, 2% LM431ACZ [TL431CLP] [KA431Z] 2% TL431CP[KA431] 2% LM431BCM [TL431ACD] [KA431AD] 1% LM431BCZ [TL431ACLP] [KA431AZ]


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    PDF 100mA AN-42 RC5040 RC5042DC-DC AN-50 RC5054AM LDO PCB Layout Guidelines RC5058M RC5041M FAN1583 15V 1A adjustable regulator FMS72 RC431AT RC5060M RC5051C

    SA00215

    Abstract: No abstract text available
    Text: INTEGRATED CIRCUITS 74ABT657 Octal transceiver with parity generator/checker 3-State Product specification IC23 Data Handbook Philips Semiconductors 1995 Dec 11 Philips Semiconductors Product specification Octal transceiver with parity generator/checker


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    PDF 74ABT657 74ABT657 500mA 01-Jan-98) SA00215

    Untitled

    Abstract: No abstract text available
    Text: UNISONIC TECHNOLOGIES CO., LTD L16B06 CMOS IC 16-BIT CONSTANT CURRENT LED DRIVER  DESCRIPTION The L16B06 is a constant-current sink driver specifically designed for LED display applications. The device incorporates shift registers, data latches, and constant current circuitry on the silicon


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    PDF L16B06 16-BIT L16B06 SSOP-24 209mil) 25MHz QW-R502-A45

    74abt374 Philips

    Abstract: MARKING CODE SMD IC 531
    Text: INTEGRATED CIRCUITS 74ABT646A Octal bus transceiver/register 3-State Product specification Supersedes data of 1995 Sep 06 IC23 Data Handbook Philips Semiconductors 1998 Feb 17 Philips Semiconductors Product specification Octal bus transceiver/register (3-State)


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    PDF 74ABT646A 74ABT646A 74ABT245 74ABT374 500mA 01-Jan-98) 74abt374 Philips MARKING CODE SMD IC 531

    marking 842

    Abstract: code 842 8 PIN SMD N74F269DB-T
    Text: INTEGRATED CIRCUITS 74F269 8-bit bidirectional binary counter Product specification IC15 Data Handbook Philips Semiconductors 1996 Jan 05 Philips Semiconductors Product specification 8–bit bidirectional binary counter 74F269 FEATURES PIN CONFIGURATION • Synchronous counting and loading


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    PDF 74F269 74F269 115MHz DIP24) images/n74f269db marking 842 code 842 8 PIN SMD N74F269DB-T

    lt941

    Abstract: 1174H5 1460d5 121i3 117450 ltc 1172 LT1682CMS8 ltc947 ltbw 1121I5
    Text: SURFACE MOUNT PRODUCTS Introduction Linear Technology Corporation LTC was founded in 1981 to address the growing demand for high performance and superior quality linear integrated circuits. Today, LTC has successfully established a leadership position by introducing and supplying leading edge products in


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    PDF dev50I 1550L 1550LI 1555I 1579I 1579I3 1579I5 1620I 1621I 1643H lt941 1174H5 1460d5 121i3 117450 ltc 1172 LT1682CMS8 ltc947 ltbw 1121I5

    SOT263-1

    Abstract: sot2631
    Text: PACKING AND PACKING QUANTITIES Page SCOPE 1928 SURFACE-MOUNT DEVICES Tape specification 1928 Reel specification Tube specification Packing quantities LEADED DEVICES Tape and reel packing of TO-92 devices Bulk packing of TO-92 devices 1934 Philips Semiconductors


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    PDF OT96-1) OT223 SC-70 OT323) SSOP16 OT338-1 SSOP24 OT340-1) SC-88 OT363) SOT263-1 sot2631

    DMP24 REEL

    Abstract: SOP8 tray 500PCS
    Text: EEa GENERAL DESCRIPTION/PACKING SPECIFICATION GENERAL DESCRIPTION NJRC delivers ICs in 4 methods of plastic tube container, two kind o f Taping, tray and vinyl bag packing. Except adhesive tape treated anti electorostatic and contain carbon are using as the ESD Electrostatic Discharge


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    PDF DIP14 DIP18 DIP20 DIP22 DIP40 SDIP22 SD1P24 SDIP28 SDIP30 SDIP42 DMP24 REEL SOP8 tray 500PCS

    1P28

    Abstract: SDMP30 SSOP14 SSOP16 SSOP20 P22 sot89
    Text: m PACKING SPECIFICATION TABLE General Description NJRC delivers ICs in 4 methods of plastic tube container, two kind of Taping,tray and vinyl bag packing. Except adhesive tape treated anti electorostatic and contain carbon are using as the ESD Electrostatic Discharge Damage protection.


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    PDF 50pcs/tube 25pcs/tube 20pcs/tube 10pcs/tube SSOP24 000pcs/reel 1P28 SDMP30 SSOP14 SSOP16 SSOP20 P22 sot89