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    SOLDERING VOIDS Search Results

    SOLDERING VOIDS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    SOLDERING VOIDS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    AN10896

    Abstract: No abstract text available
    Text: AN10896 Mounting and Soldering of RF transistors Rev. 2 — 13 Nov 2012 Application note Document information Info Content Keywords Surface mount, reflow soldering, bolt down Abstract This application note provides bolt down and soldering guidelines for NXP’s RF transistor packages


    Original     		PDF AN10896 AN10896

    AN10896

    Abstract: finger print sensor pcb with circuit Mounting and Soldering of RF transistors heller 1700 ipc 610D JEDEC J-STD-020d Moisture/Reflow sensitivity HVQFN48 J-STD-020D bga rework graphite thermal spreader
    Text: AN10896 Mounting and Soldering of RF transistors Rev. 01 — 17 May 2010 Application note Document information Info Content Keywords Surface mount, reflow soldering, bolt down Abstract This application note provides bolt down and soldering guidelines for NXP’s RF transistor packages


    Original     		PDF AN10896 AN10896 finger print sensor pcb with circuit Mounting and Soldering of RF transistors heller 1700 ipc 610D JEDEC J-STD-020d Moisture/Reflow sensitivity HVQFN48 J-STD-020D bga rework graphite thermal spreader

    SP0101NZ1-2

    Abstract: SP0101N EMKA Tablets DIAGRAM
    Text: SiSonic Silicon Microphone TM Product Features SiSonic TM - Surface Mount Microphone - Compatible with Standard Surface Mount Soldering Process - Automated Pick 'n' Place Using Standard Equipment - No Off-Line Soldering or Insertion - Highly Shock Resistant


    Original     		PDF

    Cu3Sn

    Abstract: Solder Paste, Indium, Type 3 SSOP20 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3 HVQFN48 SSOP20 philips pb-free products SOT266-1 LAND PATTERN
    Text: AN10365 Surface mount reflow soldering description Rev. 02 — 26 July 2006 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.


    Original     		PDF AN10365 AN10365 Cu3Sn Solder Paste, Indium, Type 3 SSOP20 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3 HVQFN48 SSOP20 philips pb-free products SOT266-1 LAND PATTERN

    aluminium pop rivet

    Abstract: to220 mica Soldering guidelines and SMD footprint design to220 torque for SELF TAPPING SCREW SC18 MGA768
    Text: MOUNTING AND SOLDERING INSTRUCTIONS Page SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN FOR AXIAL AND RADIAL LEADED PACKAGES AND MEDIUMPOWER SURFACE MOUNT PACKAGES This information is contained in Philips publication SC18 Discrete Semiconductor Packages, 1997 , section: 4.


    Original     		PDF OD100, OD113, 220AB OT186; OT186A OT404 aluminium pop rivet to220 mica Soldering guidelines and SMD footprint design to220 torque for SELF TAPPING SCREW SC18 MGA768

    AN10365

    Abstract: ipc 610D Cu3Sn JEDEC J-STD-033b.1 SSOP20 LAND PATTERN JEDEC J-STD-033b J-STD-033b.1 Cu6Sn5 ipc 610 non-wetting Solder Paste, Indium, Type 3
    Text: AN10365 Surface mount reflow soldering description Rev. 04 — 13 August 2009 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and


    Original     		PDF AN10365 AN10365 ipc 610D Cu3Sn JEDEC J-STD-033b.1 SSOP20 LAND PATTERN JEDEC J-STD-033b J-STD-033b.1 Cu6Sn5 ipc 610 non-wetting Solder Paste, Indium, Type 3

    Lead Free reflow soldering profile BGA

    Abstract: AN10365 HVQFN48 SSOP20 Solder Paste, Indium, Type 3 Cu3Sn philips pb-free products
    Text: AN10365 Surface mount reflow soldering description Rev. 01 — 24 May 2005 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.


    Original     		PDF AN10365 AN10365 Lead Free reflow soldering profile BGA HVQFN48 SSOP20 Solder Paste, Indium, Type 3 Cu3Sn philips pb-free products

    Cu3Sn

    Abstract: HVQFN48 J-STD-020D SSOP20 Cu6Sn5 Solder Paste, Indium 5.1, Type 3 AN10365
    Text: AN10365 Surface mount reflow soldering description Rev. 03 — 22 April 2008 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.


    Original     		PDF AN10365 AN10365 Cu3Sn HVQFN48 J-STD-020D SSOP20 Cu6Sn5 Solder Paste, Indium 5.1, Type 3

    Cu3Sn

    Abstract: ipc 610 non-wetting
    Text: AN10365 Surface mount reflow soldering Rev. 6 — 30 July 2012 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and handling of NXP semiconductor packages.


    Original     		PDF AN10365 Cu3Sn ipc 610 non-wetting

    Untitled

    Abstract: No abstract text available
    Text: AN11183 Mounting and soldering of RF transistors in over-molded plastic packages Rev. 1 — 6 November 2012 Application note Document information Info Content Keywords Over-Molded Plastic OMP packages, heat sink, footprint, surface mount, reflow soldering, component handling, exposed heat spreader, SMDP,


    Original     		PDF AN11183

    Untitled

    Abstract: No abstract text available
    Text: Automation Controls Catalog Partly To Be Discontinued Last time buy:September 30, 2013 For board-to-board For board-to-FPC Narrow pitch connectors 0.4mm pitch P4 Series FEATURES • Without soldering terminals m m 96 3. m 1m 5. Socket Header • With soldering terminals


    Original     		PDF 50piece ACCTB48E 201303-T

    IXAN0030

    Abstract: solder voids to263 voids to263
    Text: IXAN0030 Surface Mount Soldering Recommendations for TO-263 and TO-268 Case Styles The IXYS TO-263 and TO0268 surface mount packages have tinned terminals and bases to allow state-of-the- art SMD soldering. Due to the sizes of the packages, there are some


    Original     		PDF IXAN0030 O-263 O-268 O0268 AB96-02 D-58623 IXAN0030 solder voids to263 voids to263

    683-166

    Abstract: 561101 electrical solvent cleaner rs-online 400ML MULTICORE SOLDER K1856
    Text: Issued November 1994 K18562 Solder Introduction Soldering is an important part of the PCB manufacturing process. The most reliable components and the highest quality PCB manufacture do not counterbalance poor soldering. The correct choice of alloy, size and flux type, together with careful preparation and


    Original     		PDF K18562 683-166 561101 electrical solvent cleaner rs-online 400ML MULTICORE SOLDER K1856

    Untitled

    Abstract: No abstract text available
    Text: SOLDERING RECOMMENDATIONS for SMD IXYS surface mount devices SMD in TO 252 / TO 263 / TO 268 / - packages have tinned terminals and base to allow an similar soldering process like common SMD devices. Due to the size of the package and the power dissipated there are some special


    Original     		PDF 30Kelvin

    AXK820125WG

    Abstract: AXK770247G
    Text: AXK7, 8 For board-to-board For board-to-FPC Narrow pitch connectors 0.4mm pitch P4 Series FEATURES • Without soldering terminals 96 3. m m m 1m 5. Socket Header • With soldering terminals 1. 0.4 mm pitch and mated heights of 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, 3.5


    Original     		PDF 50piece ACCTB48E 201204-T AXK820125WG AXK770247G

    AXK770327G

    Abstract: FPC CONNECTOR Front lock
    Text: AXK7, 8 For board-to-board For board-to-FPC Narrow pitch connectors 0.4mm pitch P4 Series FEATURES • Without soldering terminals 96 3. m m m 1m 5. Socket Header • With soldering terminals 1. 0.4 mm pitch and mated heights of 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, 3.5


    Original     		PDF 201201-T 50piece ACCTB10E AXK770327G FPC CONNECTOR Front lock

    AXK880145WG

    Abstract: AXK770247 AXK770327G AXK720247 AXK730347
    Text: AXK7, 8 For board-to-board For board-to-FPC Narrow pitch connectors 0.4mm pitch P4 Series FEATURES • Without soldering terminals 96 3. m m m 1m 5. Socket Header • With soldering terminals 1. 0.4 mm pitch and mated heights of 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, 3.5


    Original     		PDF 50piece ACCTB48E 201204-T AXK880145WG AXK770247 AXK770327G AXK720247 AXK730347

    QQ-S-571E

    Abstract: 5082-7441 MIL-P-28809 QQS-571-E Kester sn62 tinning HDSP-6300 HDSP-6508 MIL-B-81705 Display hp 5082-7441 QQ-S571E
    Text: Soldering LED Components Application Note 1027 Table of Contents • Introduction . 1 • An Abstract of Key Points . 2 • Leads on LED Components .


    Original     		PDF FC-113 QQ-S-571E 5082-7441 MIL-P-28809 QQS-571-E Kester sn62 tinning HDSP-6300 HDSP-6508 MIL-B-81705 Display hp 5082-7441 QQ-S571E

    Untitled

    Abstract: No abstract text available
    Text: Application Report SLTA054 – May 2005 – Revised August 2009 High-Temperature Soldering Requirements for Plug-In Power Surface-Mount Products . PMP - Plug-In Power


    Original     		PDF SLTA054

    100 series machine screw SOCKET

    Abstract: No abstract text available
    Text: 3M PGA Socket Screw Machine 200 Series • Accepts various PGA packages • Reliable four finger contact interface • Unique body design prevents air voids during soldering • Optional seal tape for closed-body configuration • Custom patterns available for quantities above


    Original     		PDF TS-2116-03 100 series machine screw SOCKET

    Untitled

    Abstract: No abstract text available
    Text: 3M PGA Socket Screw Machine 200 Series ED • Accepts various PGA packages • Reliable four finger contact interface • Unique body design prevents air voids during soldering • Optional seal tape for closed-body configuration • Custom patterns available for quantities above


    Original     		PDF TS-2116-B

    100-014-0xx

    Abstract: No abstract text available
    Text: 3M DIP Socket Screw Machine 100 Series • Accepts various DIP packages • Reliable four finger contact interface • Unique body design prevents air voids during soldering • Inner contact aligned to maximize contact surface area • Optional seal tape for closed-body configuration


    Original     		PDF TS-2115-C RIA-2217B-D 100-014-0xx

    3M DIP SOCKET

    Abstract: No abstract text available
    Text: 3M DIP Socket Screw Machine 100 Series • Accepts various DIP packages • Reliable four finger contact interface • Unique body design prevents air voids during soldering • Inner contact aligned to maximize contact surface area • Optional seal tape for closed-body


    Original     		PDF TS-2115-02 3M DIP SOCKET

    GE-MOV 275V

    Abstract: SCR based induction furnace circuit diagram varistors* gemov 250v ge ecm 2.3 series motors 10J 3kv AN9771 micro switch leach 1480 Thyristor 1200 A, IDM SCR Unit, LSI 5350 Storage Enclosure AN9774
    Text: Application Notes and Technical Brief 10 Transient Voltage Suppression PAGE AN8820.3 Recommendations for Soldering Terminal Leads to MOV Varistor Discs . . . . . . . . . . . . . . . . . . . 10-3 AN9108.4 Littelfuse “ML” Multilayer Surface Mount Surge Suppressors . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-4


    Original     		PDF AN8820 AN9108 AN9211 AN9304 SP720 AN9307 AN9308 UL1950, GR-1089, DB450, GE-MOV 275V SCR based induction furnace circuit diagram varistors* gemov 250v ge ecm 2.3 series motors 10J 3kv AN9771 micro switch leach 1480 Thyristor 1200 A, IDM SCR Unit, LSI 5350 Storage Enclosure AN9774